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Engineered hybrid cardiac patches with multifunctional electronics for online monitoring and regulation of tissue function
R Feiner, L Engel, S Fleischer, M Malki, I Gal, A Shapira, ...
Nature materials 15 (6), 679-685, 2016
Electroless deposition of metal films with spray processor
Y Shacham-Diamand, V Nguyen, V Dubin
US Patent 6,065,424, 2000
Selective and blanket electroless copper deposition for ultralarge scale integration
VM Dubin, Y Shacham‐Diamand, B Zhao, PK Vasudev, CH Ting
Journal of the Electrochemical Society 144 (3), 898, 1997
Electroless copper deposition for ULSI
Y Shacham-Diamand, V Dubin, M Angyal
Thin Solid Films 262 (1-2), 93-103, 1995
Electroless deposition equipment or apparatus and method of performing electroless deposition
Y Shacham-Diamand, VM Dubin, CH Ting, B Zhao, PK Vasudev
US Patent 5,830,805, 1998
Copper transport in thermal SiO2
Y Shacham‐Diamand, A Dedhia, D Hoffstetter, WG Oldham
Journal of the Electrochemical Society 140 (8), 2427, 1993
Characterization of channel hot electron injection by the subthreshold slope of NROM/sup TM/device
E Lusky, Y Shacham-Diamand, I Bloom, B Eitan
IEEE Electron Device Letters 22 (11), 556-558, 2001
A random access photodiode array for intelligent image capture
O Yadid-Pecht, R Ginosar, Y Shacham-Diamand
IEEE transactions on electron devices 38 (8), 1772-1780, 1991
Electroplating of amorphous thin films of tungsten/nickel alloys
O Younes, L Zhu, Y Rosenberg, Y Shacham-Diamand, E Gileadi
Langmuir 17 (26), 8270-8275, 2001
Copper electroless deposition technology for ultra-large-scale-integration (ULSI) metallization
Y Shacham-Diamand, VM Dubin
Microelectronic Engineering 33 (1-4), 47-58, 1997
Integrated electroless metallization for ULSI
Y Shacham-Diamand, S Lopatin
Electrochimica Acta 44 (21-22), 3639-3649, 1999
Characterization of electroless deposited Co (W, P) thin films for encapsulation of copper metallization
A Kohn, M Eizenberg, Y Shacham-Diamand, Y Sverdlov
Materials Science and Engineering: A 302 (1), 18-25, 2001
30 years of electroless plating for semiconductor and polymer micro-systems
Y Shacham-Diamand, T Osaka, Y Okinaka, A Sugiyama, V Dubin
Microelectronic Engineering 132, 35-45, 2015
Electrons retention model for localized charge in oxide-nitride-oxide (ONO) dielectric
E Lusky, Y Shacham-Diamand, I Bloom, B Eitan
IEEE Electron Device Letters 23 (9), 556-558, 2002
Copper deposition and thermal stability issues in copper-based metallization for ULSI technology
J Li, Y Shacham-Diamand, JW Mayer
Materials science reports 9 (1), 1-51, 1992
High aspect ratio quarter-micron electroless copper integrated technology: Invited lecture
Y Shacham-Diamand, S Lopatin
Microelectronic Engineering 37, 77-88, 1997
Electroless copper deposition using glyoxylic acid as reducing agent for ultralarge scale integration metallization
YY Shacham‐Diamand
Electrochemical and Solid-State Letters 3 (6), 279, 2000
Subthreshold slope degradation model for localized-charge-trapping based non-volatile memory devices
A Shappir, Y Shacham-Diamand, E Lusky, I Bloom, B Eitan
Solid-State Electronics 47 (5), 937-941, 2003
Novel integrated electrochemical nano-biochip for toxicity detection in water
R Popovtzer, T Neufeld, D Biran, EZ Ron, J Rishpon, ...
Nano letters 5 (6), 1023-1027, 2005
STM/AFM studies of the evolution of morphology of electroplated Ni/W alloys
L Zhu, O Younes, N Ashkenasy, Y Shacham-Diamand, E Gileadi
Applied surface science 200 (1-4), 1-14, 2002
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