Electromigration in metals PS Ho, T Kwok
Reports on Progress in Physics 52 (3), 301, 1989
1005 1989 Low dielectric constant materials for ULSI interconnects M Morgen, ET Ryan, JH Zhao, C Hu, T Cho, PS Ho
Annual Review of Materials Science 30 (1), 645-680, 2000
510 2000 Plasma processing of low-k dielectrics MR Baklanov, JF de Marneffe, D Shamiryan, AM Urbanowicz, H Shi, ...
Journal of Applied Physics 113 (4), 2013
351 2013 Electromigration reliability issues in dual-damascene Cu interconnections ET Ogawa, KD Lee, VA Blaschke, PS Ho
IEEE Transactions on reliability 51 (4), 403-419, 2002
349 2002 Low-dielectric-constant materials for ULSI interlayer-dielectric applications WW Lee, PS Ho
MRS bulletin 22 (10), 19-27, 1997
341 1997 Chemical bonding and reaction at metal/polymer interfaces PS Ho, PO Hahn, JW Bartha, GW Rubloff, FK LeGoues, BD Silverman
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 3 (3 …, 1985
306 1985 Impact of near-surface thermal stresses on interfacial reliability of through-silicon vias for 3-D interconnects SK Ryu, KH Lu, X Zhang, JH Im, PS Ho, R Huang
IEEE Transactions on Device and Materials Reliability 11 (1), 35-43, 2010
284 2010 Thermo-mechanical reliability of 3-D ICs containing through silicon vias KH Lu, X Zhang, SK Ryu, J Im, R Huang, PS Ho
2009 59th Electronic Components and Technology Conference, 630-634, 2009
263 2009 Investigation of diffusion and electromigration parameters for Cu–Sn intermetallic compounds in Pb-free solders using simulated annealing B Chao, SH Chae, X Zhang, KH Lu, J Im, PS Ho
Acta Materialia 55 (8), 2805-2814, 2007
259 2007 Auger study of preferred sputtering on binary alloy surfaces PS Ho, JE Lewis, HS Wildman, JK Howard
Surface Science 57 (1), 393-405, 1976
258 1976 Complex formation and growth at the Cr–and Cu–polyimide interface R Haight, RC White, BD Silverman, PS Ho
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 6 (4 …, 1988
240 1988 Electromigration in Al (Cu) two‐level structures: Effect of Cu and kinetics of damage formation CK Hu, MB Small, PS Ho
Journal of applied physics 74 (2), 969-978, 1993
233 1993 Equilibrium structures of Si (100) stepped surfaces TW Poon, S Yip, PS Ho, FF Abraham
Physical review letters 65 (17), 2161, 1990
230 1990 Diffusion phenomena in thin films and microelectronic materials D Gupta, PS Ho
(No Title), 1988
213 1988 Thin films-interdiffusion and reactions FM d'Heurle, PS Ho, JM Poate, KN Tu, JW Mayer
by JM Poate, KN Tu and JW Mayer (John Wiley & Sons, 1978) Chap 8, 1978
205 1978 Motion of inclusion induced by a direct current and a temperature gradient PS Ho
Journal of Applied Physics 41 (1), 64-68, 1970
202 1970 Effects of enhanced diffusion on preferred sputtering of homogeneous alloy surfaces PS Ho
Surface Science 72 (2), 253-263, 1978
198 1978 Intermetallic compounds of Al and transitions metals: Effect of electromigration in 1–2‐μm‐wide lines JK Howard, JF White, PS Ho
Journal of Applied Physics 49 (7), 4083-4093, 1978
192 1978 Correlation of Schottky-barrier height and microstructure in the epitaxial Ni silicide on Si (111) M Liehr, PE Schmid, FK LeGoues, PS Ho
Physical review letters 54 (19), 2139, 1985
178 1985 Chemical bonding and electronic structure of Si PS Ho, GW Rubloff, JE Lewis, VL Moruzzi, AR Williams
Physical Review B 22 (10), 4784, 1980
178 1980