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Sanjay Goyal
Sanjay Goyal
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On instability-induced debond initiation in thin film systems
S Goyal, K Srinivasan, G Subbarayan, T Siegmund
Engineering Fracture Mechanics 77 (8), 1298-1313, 2010
302010
Compensation of overlay errors due to mask bending and non-flatness for EUV masks
M Chandhok, S Goyal, S Carson, SJ Park, G Zhang, AM Myers, ...
Alternative Lithographic Technologies 7271, 129-140, 2009
232009
A non-contact, thermally-driven buckling delamination test to measure interfacial fracture toughness of thin film systems
S Goyal, K Srinivasan, G Subbarayan, T Siegmund
Thin Solid Films 518 (8), 2056-2064, 2010
222010
Application of coreless substrate to package on package architectures
R Nickerson, R Olmedo, R Mortensen, CK Chee, S Goyal, AL Low, ...
2012 IEEE 62nd Electronic Components and Technology Conference, 1368-1371, 2012
142012
Design and application of a nonlinear energy sink to mitigate vibrations of an air spring supported slab
S Goyal, TM Whalen
International Design Engineering Technical Conferences and Computers and …, 2005
102005
The effect of corner glue on BGA package temperature cycling performance: A modeling study
M Pei, R Han, Y Ge, S Goyal, V Rajarathinam, M Mukadam
2013 IEEE 63rd Electronic Components and Technology Conference, 1494-1499, 2013
72013
Event-based use conditions method for thermo-mechanical reliability risk assessment
I Sauciuc, S Goyal, M Pei, T Harirchian, M Tse, R Kwasnick, S Tripathi, ...
Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2014
52014
Active suspensions for tracked Vehicles
YG Srinivasa, S Goyal, PR Sanketi
Proceedings of the Tenth International Congress on Sound and Vibration …, 2003
52003
Voltage in-situ electrical metrology for test-to-failure BGA component shock margin assessment
R Uppalapati, S Goyal, M Williams, S Parupalli
2012 IEEE 62nd Electronic Components and Technology Conference, 981-989, 2012
42012
Estimating the Yield Strength of Thin Metal Films Through Elastic–Plastic Buckling-Induced Debonding
S Goyal, K Srinivasan, G Subbarayan, T Siegmund
IEEE Transactions on Device and Materials Reliability 11 (2), 358-361, 2011
42011
Buckling, wrinkling and debonding in thin film systems
S Goyal, K Srinivasan, G Subbarayan, T Siegmund
2010 IEEE International Reliability Physics Symposium, 430-439, 2010
42010
Thermally induced wrinkling in thin-film stacks on patterned substrates
K Srinivasan, S Goyal, T Siegmund, G Subbarayan, Q Lin
IBM Journal of Research and Development 53 (3), 12: 1-12: 10, 2009
42009
Mechanics of thermally driven buckling-induced debonding in thin films
S Goyal
12009
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