| CMOS sensors for on-line thermal monitoring of VLSI circuits V Szekely, C Marta, Z Kohari, M Rencz IEEE Transactions on Very Large Scale Integration (VLSI) Systems 5 (3), 270-276, 1997 | 160 | 1997 |
| Measuring partial thermal resistances in a heat-flow path MR Rencz, V Székely IEEE Transactions on Components and Packaging Technologies 25 (4), 547-553, 2002 | 137 | 2002 |
| Thermal dynamics and the time constant domain V Székely, M Rencz IEEE transactions on components and packaging technologies 23 (3), 587-594, 2000 | 123 | 2000 |
| Electro-thermal and logi-thermal simulation of VLSI designs V Szekely, A Poppe, A Páhi, A Csendes, G Hajas, M Rencz IEEE Transactions on Very Large Scale Integration (VLSI) Systems 5 (3), 258-269, 1997 | 116 | 1997 |
| Thermal measurement and modeling of multi-die packages A Poppe, Y Zhang, J Wilson, G Farkas, P Szabó, J Parry, M Rencz, ... IEEE Transactions on components and packaging technologies 32 (2), 484-492, 2009 | 97 | 2009 |
| Determining partial thermal resistances with transient measurements, and using the method to detect die attach discontinuities M Rencz, V Székely, A Morelli, C Villa Eighteenth Annual IEEE Semiconductor Thermal Measurement and Management …, 2002 | 95 | 2002 |
| Structure function evaluation of stacked dies M Rencz, V Szekely Twentieth Annual IEEE Semiconductor Thermal Measurement and Management …, 2004 | 88 | 2004 |
| Dynamic thermal multiport modeling of IC packages M Rencz, V Székely IEEE Transactions on Components and Packaging Technologies 24 (4), 596-604, 2001 | 87 | 2001 |
| Challenges in thermal interface material testing CJM Lasance, CT Murray, DL Saums, M Rencz Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management …, 2006 | 83 | 2006 |
| Multi-domain simulation and measurement of power LED-s and power LED assemblies A Poppe, G Farkas, V Székely, G Horváth, M Rencz Twenty-Second Annual IEEE Semiconductor Thermal Measurement and Management …, 2006 | 82 | 2006 |
| Studies on the nonlinearity effects in dynamic compact model generation of packages M Rencz, V Székely IEEE Transactions on Components and Packaging Technologies 27 (1), 124-130, 2004 | 78 | 2004 |
| Increasing the accuracy of structure function based thermal material parameter measurements M Rencz, A Poppe, E Kollár, S Ress, V Székely IEEE Transactions on components and packaging technologies 28 (1), 51-57, 2005 | 71 | 2005 |
| THERMAN: a thermal simulation tool for IC chips, microstructures and PW boards V Székely, A Poppe, M Rencz, M Rosental, T Teszéri Microelectronics Reliability 40 (3), 517-524, 2000 | 65 | 2000 |
| Thermal mapping with liquid crystal method A Csendes, V Szekely, M Rencz Microelectronic Engineering 31 (1-4), 281-290, 1996 | 60 | 1996 |
| An efficient thermal simulation tool for ICs, microsystem elements and MCMs: the μS-THERMANAL A Csendes, V Szekely, M Rencz Microelectronics Journal 29 (4-5), 241-255, 1998 | 57 | 1998 |
| Recent progress of thermal interface material research-an overview J Liu, B Michel, M Rencz, C Tantolin, C Sarno, R Miessner, KV Schuett, ... 2008 14th International Workshop on Thermal Inveatigation of ICs and Systems …, 2008 | 54 | 2008 |
| New possibilities in the thermal evaluation, offered by transient testing M Rencz Microelectronics Journal 34 (3), 171-177, 2003 | 53 | 2003 |
| Tracing the thermal behavior of ICs V Székely, M Rencz, B Courtois IEEE Design & Test of Computers 15 (2), 14-21, 1998 | 49 | 1998 |
| Multi-domain modelling of LEDs for supporting virtual prototyping of luminaires A Poppe, G Farkas, L Gaál, G Hantos, J Hegedüs, M Rencz Energies 12 (10), 1909, 2019 | 45 | 2019 |
| CMOS temperature sensors and built-in test circuitry for thermal testing of ICs V Székely, M Rencz, S Török, C Marta, L Lipták-Fegó Sensors and Actuators A: Physical 71 (1-2), 10-18, 1998 | 45 | 1998 |
