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Belgacem Haba
Belgacem Haba
Other namesBel Haba, Berugasemu Haba
Adeia, Google, Tessera, SiPipe, Rambus, NEC, IBM, Stanford University, USTHB
Verified email at alumni.stanford.edu
Title
Cited by
Cited by
Year
Stacked microelectronic assembly and method therefor
Y Kim, B Haba, V Solberg
US Patent 6,225,688, 2001
3632001
Stacked microelectronic assembly and method therefor
Y Kim, B Haba, V Solberg
US Patent 6,699,730, 2004
3192004
Reconstituted wafer level stacking
B Haba, I Mohammed, V Oganesian, D Ovrutsky, LW Mirkarimi
US Patent 7,901,989, 2011
2622011
Microelectronic elements with post-assembly planarization
V Oganesian, B Haba, C Mitchell, I Mohammed, P Savalia
US Patent 8,847,376, 2014
2512014
Microelectronic packages and methods therefor
B Haba, M Beroz, TG Kang, Y Kubota, S Krishnan, JB Riley III, ...
US Patent 7,453,157, 2008
2432008
Chips having rear contacts connected by through vias to front contacts
B Haba, KA Honer, DB Tuckerman, V Oganesian
US Patent 8,405,196, 2013
2072013
Structure and method of making capped chips having vertical interconnects
G Humpston, D Tuckerman, B McWilliams, B Haba, C Mitchell
US Patent App. 10/949,674, 2005
2052005
Microelectronic packages and methods therefor
B Haba, TG Kang, I Mohammed, E Chau
US Patent 8,058,101, 2011
2032011
Microelectronic elements with rear contacts connected with via first or via middle structures
V Oganesian, B Haba, I Mohammed, C Mitchell, P Savalia
US Patent 8,796,135, 2014
1922014
High-frequency chip packages
M Warner, L Smith, B Haba, G Urbish, M Beroz, TG Kang
US Patent 7,268,426, 2007
1862007
Redistributed bond pads in stacked integrated circuit die package
B Haba, DV Perino, S Khalili
US Patent 6,376,904, 2002
1862002
Microelectronic elements having metallic pads overlying vias
V Oganesian, I Mohammed, C Mitchell, B Haba, P Savalia
US Patent 8,791,575, 2014
1852014
Flexible lead structures and methods of making same
JW Smith, B Haba
US Patent 6,117,694, 2000
1842000
Microelectronic package comprising offset conductive posts on compliant layer
B Haba, M Beroz, G Humpston, JM Park
US Patent 8,207,604, 2012
1822012
Formation of circuitry with modification of feature height
B Haba, M Beroz, YG Kim, DB Tuckerman
US Patent 7,462,936, 2008
1752008
Package-on-package assembly with wire bonds to encapsulation surface
H Sato, TG Kang, B Haba, PR Osborn, WS Wang, E Chau, I Mohammed, ...
US Patent 8,618,659, 2013
1722013
Microelectronic packages and methods therefor
B Haba, M Beroz, R Green, I Mohammed, SE Wilson, W Zohni, Y Kubota, ...
US Patent 7,176,043, 2007
1692007
Wafer-level fabrication of lidded chips with electrodeposited dielectric coating
V Oganesian, D Ovrutsky, C Rosenstein, B Haba, G Humpston
US Patent 7,935,568, 2011
1652011
Direct-connect integrated circuit signaling system for bypassing intra-substrate printed circuit signal paths
JC Fjelstad, PK Segaram, B Haba
US Patent 7,307,293, 2007
1602007
Redistributed bond pads in stacked integrated circuit die package
B Haba, DV Perino, S Khalili
US Patent 6,514,794, 2003
1572003
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