| Crystallization behavior of soft, attractive microgels Z Meng, JK Cho, S Debord, V Breedveld, LA Lyon The Journal of Physical Chemistry B 111 (25), 6992-6997, 2007 | 74 | 2007 |
| Tunable attractive and repulsive interactions between pH-responsive microgels JK Cho, Z Meng, LA Lyon, V Breedveld Soft Matter 5 (19), 3599-3602, 2009 | 58 | 2009 |
| Physical aging and phase behavior of multiresponsive microgel colloidal dispersions Z Meng, JK Cho, V Breedveld, LA Lyon The Journal of Physical Chemistry B 113 (14), 4590-4599, 2009 | 46 | 2009 |
| Three-dimensional in situ temperature measurement in microsystems using Brownian motion of nanoparticles K Chung, JK Cho, ES Park, V Breedveld, H Lu Analytical Chemistry 81 (3), 991-999, 2009 | 42 | 2009 |
| A CMOS compatible monolithic fiber attach solution with reliable performance and self-alignment B Peng, T Barwicz, A Sahin, T Houghton, B Hedrick, Y Bian, M Rakowski, ... Optical Fiber Communication Conference, Th3I. 4, 2020 | 33 | 2020 |
| Microfluidic dialysis cell for characterization of macromolecule interactions J Scrimgeour, JK Cho, V Breedveld, J Curtis Soft Matter 7 (10), 4762-4767, 2011 | 18 | 2011 |
| Hybrid III-V laser integration on a monolithic silicon photonic platform Y Bian, K Ramachandran, B Peng, B Hedrick, S Mills, K Donegan, ... Optical Fiber Communication Conference, M5A. 2, 2021 | 17 | 2021 |
| Chip package interaction analysis for 20-nm technology with thermo-compression bonding with non-conductive paste JK Cho, S Gao, S Choi, RS Smith, EC Chua, S Kannan, B Kuo, M Jimarez, ... 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 12-16, 2015 | 12 | 2015 |
| Integrated laser attach technology on a monolithic silicon photonics platform Y Bian, K Ramachandran, B Peng, B Hedrick, S Mills, K Donegan, ... 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 237-244, 2021 | 10 | 2021 |
| Chip Package Interaction (CPI) risk assessment of 22FDX® Wafer Level Chip Scale Package (WLCSP) using 2D Finite Element Analysis modeling KV Machani, F Kuechenmeister, D Breuer, C Klewer, JK Cho, ... 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 1100-1105, 2020 | 9 | 2020 |
| 3D integrated laser attach technology on a 300-mm monolithic CMOS silicon photonics platform Y Bian, K Ramachandran, ZJ Wu, B Hedrick, KK Dezfulian, T Houghton, ... IEEE Journal of Selected Topics in Quantum Electronics 29 (3: Photon. Elec …, 2023 | 8 | 2023 |
| Chip Packaging Interaction (CPI) with Cu Pillar Flip Chip for 20 nm Silicon Technology and Beyond S Gao, RS Smith, JK Cho, S Choi, S Kannan, E Chua, H Geisler, ... ECS Journal of Solid State Science and Technology 4 (1), N3134, 2014 | 8 | 2014 |
| A Generic Strategy to Assess and Mitigate Chip Package Interaction Risk Factors for Semiconductor Devices with Ultra-low k Dielectric Materials in Back End of Line F Kuechenmeister, D Breuer, H Geisler, C Klewer, B Boehme, ... International Symposium on Microelectronics 2017 (1), 000163-000171, 2017 | 7 | 2017 |
| Monolithically integrated self-aligned SiN edge coupler with< 0.6/0.8 dB TE/TM insertion loss,<-39 dB back reflection and> 520 mW high-power handling capability Y Bian, T Hirokawa, V Karra, A Dasgupta, WS Lee, A Aboketaf, F Afzal, ... Optical Fiber Communication Conference, M3C. 3, 2023 | 4 | 2023 |
| Optical performance and reliability assessment from self-aligned single mode fiber attach for O-band silicon photonics platform JK Cho, T Hirokawa, J Pellerin, B Fasano, Y Bian, K Giewont, V Karra, ... 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 403-409, 2022 | 4 | 2022 |
| Chip package interaction for advanced nodes: a holistic approach for foundries and OSATs JK Cho, F Kuechenmeister, D Breuer, J Paul, M Thiele Chipscale Review November/December, 2015 | 4 | 2015 |
| Polarization mode dispersion in CMOS-integrated monolithic SiPh components: Simulations and experiments Y Bian, H Ding, A Aboketaf, V Karra, M Sorbara, T Hirokawa, S Mosleh, ... 2023 Optical Fiber Communications Conference and Exhibition (OFC), 1-3, 2023 | 3 | 2023 |
| Self-aligned Fiber Attach on Monolithic Silicon Photonic Chips: Moisture Effect and Hermetic Seal ZJG Wu, PC Wang, S Choi, P Justison, M Gall, JK Cho, T Hirokawa, ... Optical Fiber Communication Conference, Th1A. 5, 2023 | 3 | 2023 |
| Experiment of 22FDX (R) Chip Board Interaction (CBI) in Wafer Level Packaging Fan-Out (WLPFO) JK Cho, J Paul, S Capecchi, F Kuechenmeister, TC Cheng 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 910-916, 2019 | 3 | 2019 |
| Chip Board Interaction Analysis of 22-NM Fully Depeleted Silicon on Insulator (FD-SOI) Technology in Wafer Level Packaging (WLP) JK Cho, J Paul, S Capecchi, D Breuer, F Kuechenmeister, D Scott, ... 2018 International Wafer Level Packaging Conference (IWLPC), 1-6, 2018 | 3 | 2018 |
