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Co-authors
- JH LUAN (栾军华)City University of Hong KongVerified email at cityu.edu.hk
- Da ChenSoutheast UniversityVerified email at seu.edu.cn
- Z.B. Jiao/焦增宝Associate Professor, Hong Kong Polytechnic UniversityVerified email at mit.edu
- Bin Han (韩斌)Shaanxi University of Science and Technology, Xi'an, ChinaVerified email at sust.edu.cn
- Tao Yang (杨 涛)City University of Hong KongVerified email at my.cityu.edu.hk
- Weihong Liu(刘卫红)Harbin Institute of Technology (Shenzhen)Verified email at hit.edu.cn
- Weitong LinCity University of Hong KongVerified email at my.cityu.edu.hk
- Guma YeliCity University of Hong KongVerified email at cityu.edu.hk
- Yasuo ShimizuSony Semiconductor Solutions CorporationVerified email at sony.com
- Yiran LiShanghai UniversityVerified email at shu.edu.cn
- Zhe Jia (贾喆)Southeast UniversityVerified email at seu.edu.cn
- Wanpeng LiCity University of Hong KongVerified email at my.cityu.edu.hk
- Jamie J. KruzicUniversity of New South Wales (UNSW Sydney), Professor, School of Mechanical and ManufacturingVerified email at unsw.edu.au
- Yang TongInstitute for Advanced Studies in Precision Materials, Yantai University