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Mario Gonzalez
Mario Gonzalez
Adresse e-mail validée de imec.be
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Design of metal interconnects for stretchable electronic circuits
M Gonzalez, F Axisa, MV Bulcke, D Brosteaux, B Vandevelde, ...
Microelectronics reliability 48 (6), 825-832, 2008
4652008
Design and fabrication of elastic interconnections for stretchable electronic circuits
D Brosteaux, F Axisa, M Gonzalez, J Vanfleteren
IEEE Electron Device Letters 28 (7), 552-554, 2007
2832007
Hermal cycling reliability of SnAgCu and SnPb solder joints: A comparison for several IC-packages
B Vandevelde, M Gonzalez, P Limaye, P Ratchev, E Beyne
5th International Conference on Thermal and Mechanical Simulation and …, 2004
1662004
Printed circuit board technology inspired stretchable circuits
J Vanfleteren, M Gonzalez, F Bossuyt, YY Hsu, T Vervust, I De Wolf, ...
MRS bulletin 37 (3), 254-260, 2012
1592012
Polyimide-enhanced stretchable interconnects: design, fabrication, and characterization
YY Hsu, M Gonzalez, F Bossuyt, J Vanfleteren, I De Wolf
IEEE transactions on electron devices 58 (8), 2680-2688, 2011
1262011
The effects of encapsulation on deformation behavior and failure mechanisms of stretchable interconnects
YY Hsu, M Gonzalez, F Bossuyt, F Axisa, J Vanfleteren, I De Wolf
Thin Solid Films 519 (7), 2225-2234, 2011
932011
Impact of the electrodeposition chemistry used for TSV filling on the microstructural and thermo-mechanical response of Cu
C Okoro, R Labie, K Vanstreels, A Franquet, M Gonzalez, B Vandevelde, ...
Journal of Materials Science 46, 3868-3882, 2011
902011
Design and performance of metal conductors for stretchable electronic circuits
M Gonzalez, F Axisa, F Bossuyt, YY Hsu, B Vandevelde, J Vanfleteren
Circuit World 35 (1), 22-29, 2009
872009
Stretching-induced interconnect delamination in stretchable electronic circuits
O Van Der Sluis, YY Hsu, PHM Timmermans, M Gonzalez, ...
Journal of Physics D: Applied Physics 44 (3), 034008, 2010
772010
The effect of pitch on deformation behavior and the stretching-induced failure of a polymer-encapsulated stretchable circuit
YY Hsu, M Gonzalez, F Bossuyt, F Axisa, J Vanfleteren, I De Wolf
Journal of Micromechanics and Microengineering 20 (7), 075036, 2010
762010
In situ observations on deformation behavior and stretching-induced failure of fine pitch stretchable interconnect
YY Hsu, M Gonzalez, F Bossuyt, F Axisa, J Vanfleteren, I De Wolf
Journal of Materials research 24, 3573-3582, 2009
632009
Thermo-mechanics of 3D-wafer level and 3D stacked IC packaging technologies
B Vandevelde, C Okoro, M Gonzalez, B Swinnen, E Beyne
EuroSimE 2008-International Conference on Thermal, Mechanical and Multi …, 2008
602008
Analysis of the induced stresses in silicon during thermcompression Cu-Cu bonding of Cu-through-vias in 3D-SIC architecture
C Okoro, M Gonzalez, B Vandevelde, B Swinnen, G Eneman, S Stoukatch, ...
2007 Proceedings 57th Electronic Components and Technology Conference, 249-255, 2007
572007
Effect of pore structure of nanometer scale porous films on the measured elastic modulus
K Vanstreels, C Wu, M Gonzalez, D Schneider, D Gidley, P Verdonck, ...
Langmuir 29 (38), 12025-12035, 2013
542013
Stretchable circuits with horseshoe shaped conductors embedded in elastic polymers
A Jahanshahi, M Gonzalez, J van den Brand, F Bossuyt, T Vervust, ...
Japanese Journal of Applied Physics 52 (5S1), 05DA18, 2013
512013
Stretchable dipole antenna for body area networks at 2.45 GHz
A Arriola, JI Sancho, S Brebels, M Gonzalez, W De Raedt
IET microwaves, antennas & propagation 5 (7), 852-859, 2011
482011
Design and implementation of flexible and stretchable systems
M Gonzalez, B Vandevelde, W Christiaens, YY Hsu, F Iker, F Bossuyt, ...
Microelectronics Reliability 51 (6), 1069-1076, 2011
452011
Design of metal interconnects for stretchable electronic circuits using finite element analysis
M Gonzalez, F Axisa, MV Bulcke, D Brosteaux, B Vandevelde, ...
2007 International Conference on Thermal, Mechanical and Multi-Physics …, 2007
432007
Epoxy-induced spalling of silicon
R Martini, M Gonzalez, F Dross, A Masolin, J Vaes, D Frederickx, ...
Energy Procedia 27, 567-572, 2012
412012
A novel fan-out concept for ultra-high chip-to-chip interconnect density with 20-µm pitch
A Podpod, J Slabbekoorn, A Phommahaxay, F Duval, A Salahouelhadj, ...
2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 370-378, 2018
382018
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