| Lifetime evaluation of nanoscale silver sintered power modules for automotive application based on experiments and finite-element modeling F Le Henaff, S Azzopardi, E Woirgard, T Youssef, S Bontemps, J Joguet IEEE Transactions on Device and Materials Reliability 15 (3), 326-334, 2015 | 47 | 2015 |
| Power modules die attach: A comprehensive evolution of the nanosilver sintering physical properties versus its porosity T Youssef, W Rmili, E Woirgard, S Azzopardi, N Vivet, D Martineau, ... Microelectronics Reliability 55 (9-10), 1997-2002, 2015 | 39 | 2015 |
| New power module concept in PCB-embedded technology with silver sintering die attach A Tablati, N Alayli, T Youssef, O Belnoue, L Theolier, E Woirgard Microelectronics Reliability 114, 113891, 2020 | 11 | 2020 |
| Overview and new trends in technology bricks for reliability enhancement in future wide band gap power converters for More Electrical Aircraft (MEA) and More Electrical … B Revol, S Azzopardi, T Youssef, JSN Teu, C Gautier, R Khazaka, ... IECON 2019-45th Annual Conference of the IEEE Industrial Electronics Society …, 2019 | 8 | 2019 |
| An HVDC line parameters estimation method without optimization J Sabatier, T Youssef, M Pellet International Journal of Electrical Power & Energy Systems 83, 541-546, 2016 | 7 | 2016 |
| Modélisation multiphysique d'un assemblage de puissance haute température destiné à l'environnement aéronautique T Youssef Université de Bordeaux, 2016 | 7 | 2016 |
| Thermo-mechanical assessment of silver sintering for attaching power components in embedded PCB F Arabi, T Youssef, M Coudert, G Coquery, N Alayli, D Martineau, ... Microelectronics Reliability 114, 113900, 2020 | 6 | 2020 |
| Direct printing of heat sinks, cases and power connectors on insulated substrate using selective laser melting techniques R Khazaka, D Martineau, T Youssef, TL Le, S Azzopardi 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2173-2179, 2019 | 6 | 2019 |
| Effect of voids on crack propagation in AuSn die attach for high-temperature power modules F Arabi, L Theolier, T Youssef, M Medina, JY Deletage, E Woirgard 2017 18th International Conference on Thermal, Mechanical and Multi-Physics …, 2017 | 6 | 2017 |
| Multi-physics modelling of thin films: optimization for finite elements simulations tools T Youssef, E Woirgard, S Azzopardi, D Martineau, R Meuret 2015 16th International Conference on Thermal, Mechanical and Multi-Physics …, 2015 | 5 | 2015 |
| High power module GaN with integrated current sensor for fast short circuit protection TL Le, JSN Teu, T Youssef 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics …, 2022 | 4 | 2022 |
| HVDC line parameters estimation based on line transfer functions frequency analysis J Sabatier, T Youssef, M Pellet 2015 12th International Conference on Informatics in Control, Automation and …, 2015 | 4 | 2015 |
| Thickness Dependence of Epoxy-Based Composites with BaTiO₃ Particles on AC Electrical Breakdown Strength A Escriva, S Diaham, V Bley, Z Valdez-Nava, TT Le, T Youssef, ... 2022 IEEE 4th International Conference on Dielectrics (ICD), 713-716, 2022 | 2 | 2022 |
| Rapid and localized soldering using reactive films for electronic applications R Khazaka, D Martineau, T Youssef, TL Le, S Azzopardi Journal of Microelectronics and Electronic Packaging 16 (4), 182-187, 2019 | 2 | 2019 |
| Thermo-Mechanical Characterization of Sintered Nano-Silver Paste by Micro-Tensile Tests and Numerical Identification of the Anand Model Parameters G Le Quilliec, W Rmili, T Youssef, L Guilbaud, D Leduc, C Richard, ... IMAPS Power 2016, 2016 | 2 | 2016 |
| Design and performance evaluation of a full turboelectric distributed electric propulsion aircraft: Preliminary results of EU project IMOTHEP E Nguyen, S Defoort, M Ridel, D Donjat, C Viguier, M Ali, T Youssef, ... 9th European Conference for Aeronautics and Space Sciences (EUCASS), 2022 | 1 | 2022 |
| An improved monitoring of gate leakage current on SiC Power MOSFETs using source driver topology A Laspeyres, L Makki, C Darbas, AS Descamps, C Batard, N Ginot, ... PCIM Europe 2022; International Exhibition and Conference for Power …, 2022 | 1 | 2022 |
| A multiphysics cosimulation for a wide band gap power module fatigue-related performance assessment B Boulbene, D Martineau, E Woirgard, R Meuret, T Youssef, D Balland NAFEMS Americas Conference, The International Association for the …, 2016 | 1 | 2016 |
| Application of Field Grading Material for Power Device Insulation in PCB Embedded Environment A Escriva, S Diaham, V Bley, Z Valdez-Nava, T Youssef, R Khazaka, ... 2023 IEEE Conference on Electrical Insulation and Dielectric Phenomena …, 2023 | | 2023 |
| Thermal Evaluation of Substrate Technologies Used for Power Peak Management in SSPC Modules R Khazaka, G Scoggin, Y Avenas, T Youssef, C Gautier, JL Schanen, ... PCIM Europe 2023; International Exhibition and Conference for Power …, 2023 | | 2023 |
Stéphane AzzopardiAss. Prof. (HDR) - IMS Laboratory - Bordeaux Institute of TechnologyAdresse e-mail validée de bordeaux-inp.fr
