Hydrogen sensor of Pd-decorated tubular TiO2 layer prepared by anodization with patterned electrodes on SiO2/Si substrate J Moon, HP Hedman, M Kemell, A Tuominen, R Punkkinen Sensors and Actuators B: Chemical 222, 190-197, 2016 | 83 | 2016 |
Thermal analysis of LED spot lighting device operating in external natural or forced heat convection M Maaspuro, A Tuominen Microelectronics Reliability 53 (3), 428-434, 2013 | 58 | 2013 |
Reviewing and defining productization A Suominen, J Kantola, A Tuominen 20th Annual Conference of the International Society for Professional …, 2009 | 41 | 2009 |
Discussion on the challenges of DMFC catalyst loading process for mass production W Zheng, A Suominen, A Tuominen Energy Procedia 28, 78-87, 2012 | 34 | 2012 |
Analyzing the Direct Methanol Fuel Cell technology in portable applications by a historical and bibliometric analysis. A Suominen, A Tuominen Journal of Business Chemistry 7 (3), 2010 | 29 | 2010 |
Gas sensor using anodic TiO2 thin film for monitoring hydrogen J Moon, M Kemell, J Kukkola, R Punkkinen, HP Hedman, A Suominen, ... Procedia Engineering 47, 791-794, 2012 | 26 | 2012 |
Reliability of 80 μm pitch flip chip attachment on flex P Palm, J Määttänen, A Tuominen, E Ristolainen Microelectronics reliability 41 (5), 633-638, 2001 | 26 | 2001 |
A study of monitoring hydrogen using mesoporous TiO2 synthesized by anodization J Moon, HP Hedman, M Kemell, A Suominen, E Mäkilä, H Kim, ... Sensors and Actuators B: Chemical 189, 246-250, 2013 | 24 | 2013 |
The correlation between the interference colour and growth procedure of anodic titanium dioxide nanotube arrays J Moon, M Kemell, B Park, A Suominen, E Mäkilä, R Punkkinen, ... Coloration Technology 130 (1), 1-7, 2014 | 19 | 2014 |
Analyzing prospects of portable fuel cells with an expert opinion study A Suominen, A Tuominen, J Kantola Futures 43 (5), 513-524, 2011 | 16 | 2011 |
The applicability of electrodeposited photoresist in producing ultra-fine lines using sputtered seeding layers P Jalonen, A Tuominen International Symposium on Electronic Materials and Packaging (EMAP2000)(Cat …, 2000 | 16 | 2000 |
The effect of lead‐free solder paste on component placement accuracy and self‐alignment during reflow T Liukkonen, P Nummenpää, A Tuominen Soldering & surface mount technology 16 (1), 44-47, 2004 | 13 | 2004 |
Qualification of flip chip fluxes by wetting balance and surface insulation resistance tests A Tuominen, E Ristolainen, V Lehtinen Soldering & surface mount technology 11 (1), 21-26, 1999 | 12 | 1999 |
A new structure of a passive direct methanol fuel cell W Zheng, A Suominen, J Kankaanranta, A Tuominen Chemical engineering science 76, 188-191, 2012 | 9 | 2012 |
The safety assessment of wind-photovoltaic hybrid power system for afforestation in desertification area DS Oh, KW Rhie, JY Moon, A Tuominen 2010 12th Biennial Baltic Electronics Conference, 317-320, 2010 | 8 | 2010 |
Characterization of resolution cycle times of corrective actions in mobile terminals A Mwegerano, P Kytösaho, T Liukkonen, A Tuominen Quality and Reliability Engineering International 24 (5), 613-621, 2008 | 8 | 2008 |
A case study of spc in circuit board assembly: statistical mounting process control T Liukkonen, A Tuominen 2004 24th International Conference on Microelectronics (IEEE Cat. No …, 2004 | 8 | 2004 |
Metallization of microvias by sputter-deposition T Uusluoto, P Jalonen, H Laaksonen, A Tuominen Microelectronics Reliability 44 (4), 587-593, 2004 | 8 | 2004 |
The effect of sputtered interface metallic layers on reinforced core laminate making build-up structures P Jalonen, A Tuominen Microelectronics Reliability 42 (7), 1075-1079, 2002 | 8 | 2002 |
Applicability of no-flow fluxing encapsulants and flip chip technology in volume production P Palm, K Puhakka, J Maattanen, T Heimonen, A Tuominen 4th International Conference on Adhesive Joining and Coating Technology in …, 2000 | 8 | 2000 |