| 10-kV SiC MOSFET power module with reduced common-mode noise and electric field CM DiMarino, B Mouawad, CM Johnson, D Boroyevich, R Burgos IEEE Transactions on Power Electronics 35 (6), 6050-6060, 2019 | 101 | 2019 |
| Design and experimental validation of a wire-bond-less 10-kV SiC MOSFET power module C DiMarino, B Mouawad, CM Johnson, M Wang, YS Tan, GQ Lu, ... IEEE Journal of emerging and selected topics in power electronics 8 (1), 381-394, 2019 | 63 | 2019 |
| Enhanced recovery and recrystallization of metals due to an applied current D Fabregue, B Mouawad, CR Hutchinson Scripta Materialia 92, 3-6, 2014 | 53 | 2014 |
| Tailoring the microstructure and the mechanical properties of ultrafine grained high strength ferritic steels by powder metallurgy B Mouawad, X Boulnat, D Fabrègue, M Perez, Y de Carlan Journal of Nuclear Materials 465, 54-62, 2015 | 43 | 2015 |
| Full densification of molybdenum powders using spark plasma sintering B Mouawad, M Soueidan, D Fabregue, C Buttay, V Bley, B Allard, H Morel Metallurgical and Materials Transactions A 43, 3402-3409, 2012 | 41 | 2012 |
| Design of a novel, high-density, high-speed 10 kV SiC MOSFET module C DiMarino, M Johnson, B Mouawad, J Li, D Boroyevich, R Burgos, ... 2017 IEEE Energy Conversion Congress and Exposition (ECCE), 4003-4010, 2017 | 32 | 2017 |
| Development of a highly integrated 10 kV SiC MOSFET power module with a direct jet impingement cooling system B Mouawad, R Skuriat, J Li, CM Johnson, C DiMarino 2018 IEEE 30th International Symposium on Power Semiconductor Devices and …, 2018 | 30 | 2018 |
| A thermal cycling reliability study of ultrasonically bonded copper wires E Arjmand, PA Agyakwa, MR Corfield, J Li, B Mouawad, CM Johnson Microelectronics Reliability 59, 126-133, 2016 | 30 | 2016 |
| Direct copper bonding for power interconnects: Design, manufacturing, and test B Mouawad, B Thollin, C Buttay, L Dupont, V Bley, D Fabregue, ... IEEE transactions on Components, Packaging and Manufacturing Technology 5 (1 …, 2014 | 29 | 2014 |
| A wire-bond-less 10 kV SiC MOSFET power module with reduced common-mode noise and electric field C Dimarino, B Mouawad, K Li, Y Xu, M Johnson, D Boroyevich, R Burgos PCIM Europe 2018; International Exhibition and Conference for Power …, 2018 | 26 | 2018 |
| Novel silicon carbide integrated power module for EV application B Mouawad, J Espina, J Li, L Empringham, CM Johnson 2018 1st Workshop on Wide Bandgap Power Devices and Applications in Asia …, 2018 | 26 | 2018 |
| Application of the spark plasma sintering technique to low-temperature copper bonding B Mouawad, M Soueidan, D Fabregue, C Buttay, B Allard, V Bley, H Morel, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 2 (4 …, 2012 | 21 | 2012 |
| Hybrid half-bridge package for high voltage application B Mouawad, J Li, A Castellazzi, CM Johnson 2016 28th International Symposium on Power Semiconductor Devices and ICs …, 2016 | 18 | 2016 |
| Low parasitic inductance multi-chip SiC devices packaging technology B Mouawad, J Li, A Castellazzi, P Friedrichs, CM Johnson 2016 18th European Conference on Power Electronics and Applications (EPE'16 …, 2016 | 17 | 2016 |
| Dynamic performance analysis of a 3.3 kV SiC MOSFET half-bridge module with parallel chips and body-diode freewheeling A Hussein, B Mouawad, A Castellazzi 2018 IEEE 30th International Symposium on Power Semiconductor Devices and …, 2018 | 16 | 2018 |
| Low inductance 2.5 kV packaging technology for SiC switches B Mouawad, J Li, A Castellazzi, CM Johnson, T Erlbacher, P Friedrichs CIPS 2016; 9th International Conference on Integrated Power Electronics …, 2016 | 15 | 2016 |
| Fabrication and characterization of a high-power-density, planar 10 kV SiC MOSFET power module C DiMarino, M Johnson, B Mouawad, J Li, R Skuriat, M Wang, Y Tan, ... CIPS 2018; 10th International Conference on Integrated Power Electronics …, 2018 | 14 | 2018 |
| Packaging degradation studies of high temperature SiC MOSFET discrete packages B Mouawad, L Yang, P Agyakwa, M Corfield, CM Johnson 2020 32nd International Symposium on Power Semiconductor Devices and ICs …, 2020 | 12 | 2020 |
| Three‐dimensional damage morphologies of thermomechanically deformed sintered nanosilver die attachments for power electronics modules P Agyakwa, J Dai, J Li, B Mouawad, L Yang, M Corfield, CM Johnson Journal of microscopy 277 (3), 140-153, 2020 | 12 | 2020 |
| 3-dimensional, solder-free interconnect technology for high-performance power modules B Mouawad, C Buttay, M Soueidan, H Morel, B Allard, D Fabregue, V Bley 2012 7th International Conference on Integrated Power Electronics Systems …, 2012 | 12 | 2012 |
Christina DiMarinoAssistant Professor, Center for Power Electronics Systems (CPES), Virginia TechVerified email at vt.edu
