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- Daniel KienerProfessor of Micro- & Nanomechanics of Materials, Montanuniversität LeobenVerified email at unileoben.ac.at
- Jiwon JeongPrincipal Engineer, PL, Samsung ElectronicsVerified email at samsung.com
- Gerhard DehmDirector, Max-Planck-Institut für EisenforschungVerified email at mpie.de
- Subin LeeGroup Leader, Karlsruhe Institute of Technology (KIT)Verified email at kit.edu
- Young-Min KimDepartment of Energy Science, Sungkyunkwan University (SKKU)Verified email at skku.edu
- Christina ScheuMPIEVerified email at mpie.de
- Stephen PennycookNational University of Singapore (retired)Verified email at utk.edu
- Jong Hyeok ParkYonsei UniversityVerified email at yonsei.ac.kr
- Weidong LuoProfessor of Physics, Shanghai Jiao Tong UniversityVerified email at sjtu.edu.cn
- Chang-Beom EomUniversity of Wisconsin-MadisonVerified email at engr.wisc.edu
- Christoph T. KochDepartment of Physics, Humboldt University of BerlinVerified email at hu-berlin.de
- Klaus van BenthemUniversity of California, DavisVerified email at ucdavis.edu
- Kan ZhangNanjing University of Science and TechnologyVerified email at skku.edu
- Marc LegrosCEMES-CNRS - Toulouse, FranceVerified email at cemes.fr
- Hyunsang HwangPOSTECH, KoreaVerified email at postech.ac.kr
- E. Fred Schubert, Future Chips Conste...Rensselaer Polytechnic InstituteVerified email at rpi.edu
- Evgeny TsymbalUniversity of Nebraska-LincolnVerified email at unl.edu
- Albina BorisevichOak Ridge National laboratoryVerified email at ornl.gov
- Long-Qing ChenThe Pennslvania State UniversityVerified email at psu.edu
- Yaron KauffmannTechnion IITVerified email at technion.ac.il