| All electrochemical fabrication of a platinized nanoporous Au thin-film catalyst DA McCurry, M Kamundi, M Fayette, F Wafula, N Dimitrov ACS applied materials & interfaces 3 (11), 4459-4468, 2011 | 73 | 2011 |
| Toward a Better Understanding of the Effect of Cu Electroplating Process Parameters on Cu3Sn Voiding L Yin, F Wafula, N Dimitrov, P Borgesen Journal of electronic materials 41, 302-312, 2012 | 46 | 2012 |
| Mechanism of cobalt bottom-up filling for advanced node interconnect metallization J Wu, F Wafula, S Branagan, H Suzuki, J van Eisden Journal of the Electrochemical Society 166 (1), D3136, 2018 | 36 | 2018 |
| Impact of key deposition parameters on the voiding sporadically occurring in solder joints with electroplated copper F Wafula, Y Liu, L Yin, S Bliznakov, P Borgesen, EJ Cotts, N Dimitrov Journal of The Electrochemical Society 157 (2), D111, 2009 | 36 | 2009 |
| Effect of the deposition parameters on the voiding propensity of solder joints with Cu electroplated in a Hull cell F Wafula, Y Liu, L Yin, P Borgesen, EJ Cotts, N Dimitrov Journal of applied electrochemistry 41, 469-480, 2011 | 32 | 2011 |
| Controlling Cu electroplating to prevent sporadic voiding in Cu3Sn L Yin, P Kondos, P Borgesen, Y Liu, S Bliznakov, F Wafula, N Dimitrov, ... 2009 59th Electronic Components and Technology Conference, 406-414, 2009 | 26 | 2009 |
| Influence of poly (ethylene glycol) degradation on voiding sporadically occurring in solder joints with electroplated Cu F Wafula, L Yin, P Borgesen, D Andala, N Dimitrov Journal of electronic materials 41, 1898-1906, 2012 | 25 | 2012 |
| Electrolytic cobalt fill of sub-5 nm node interconnect features F Wafula, J Wu, S Branagan, H Suzuki, A Gracias, J van Eisden 2018 IEEE International Interconnect Technology Conference (IITC), 123-125, 2018 | 7 | 2018 |
| Impact of Bath Stability on Electroplated Cu for Through-Silicon Vias in a Controlled Manufacturing Environment A Nguyen, K Fealey, P Reilly, G Pattanaik, A Gracias, F Wafula, M Flynn, ... Journal of Microelectronics and Electronic Packaging 12 (1), 43-49, 2015 | 5 | 2015 |
| Understanding, Controlling and Minimizing the Voiding, Sporadically Occurring in Solder Joints with Electroplated Copper F Wafula, Y Liu, L Yin, S Bliznakov, P Borgesen, E Cotts, N Dimitrov ECS Transactions 19 (24), 43, 2009 | 4 | 2009 |
| Short Loop Electrical And Reliability Learning For Through Silicon Via (TSV) Mid-Wafer Front-Side Processes V Vartanian, K Hummler, S Olson, T Barbera, KH Yu, S Hu, A Fujita, ... International Symposium on Microelectronics 2014 (1), 000794-000803, 2014 | 2 | 2014 |
| Direct Cu plating of high aspect ratio through silicon vias (TSVs) with Ru seed on 300 mm wafer F Wafula, G Pattanaik, J Enloe, K Hummler, B Sapp IEEE International Interconnect Technology Conference, 143-146, 2014 | 2 | 2014 |
| (Invited) Cobalt Bottom-up Filling for Advanced Node Interconnect Metallization J Wu, F Wafula, S Branagan, H Suzuki, J van Eisden Electrochemical Society Meeting Abstracts 235, 1050-1050, 2019 | | 2019 |
| AQUEOUS COMPOSITION FOR DEPOSITING A COBALT DEPOSIT AND METHOD FOR ELECTROLYTICALLY DEPOSITING SUCH A DEPOSIT F WAFULA, J ADOLF, J WU, J GAIDA, D ROHDE, G VAZHENIN WO Patent WO/2019/013,761, 2019 | | 2019 |
| Cost Analysis of TSV Process and Scaling Options V Vartanian, L Smith, K Hummler, S Olson, B Sapp, T Barbera, S Golovato, ... International Symposium on Microelectronics 2014 (1), 000001-000007, 2014 | | 2014 |
| Complete Electrochemical Fabrication of a Platinized Nanoporous Au Catalyst for Formic Acid Oxidation N Dimitrov, D McCurry, M Kamundi, M Fayette, F Wafula ECS Meeting Abstracts, 2280, 2011 | | 2011 |
| Electroanalytical Approaches to Understand and Control Voiding Sporadically Occurring in Solder Joints with Electroplated Copper FW Wafula State University of New York at Binghamton, Department of Chemistry, 2011 | | 2011 |
| Understanding, Controlling and Minimizing the Voiding, Sporadically Occurring in Solder Joints with Electroplated Copper N Dimitrov, Y Liu, F Wafula, S Bliznakov, E Cotts, L Yin, P Borgesen ECS Meeting Abstracts, 975, 2009 | | 2009 |
Nikolay G DimitrovProfessor, Binghamton University, SUNYAdresse e-mail validée de binghamton.edu
