| 3D-ICE: Fast compact transient thermal modeling for 3D ICs with inter-tier liquid cooling A Sridhar, A Vincenzi, M Ruggiero, T Brunschwiler, D Atienza 2010 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 463-470, 2010 | 406 | 2010 |
| Forced convective interlayer cooling in vertically integrated packages T Brunschwiler, B Michel, H Rothuizen, U Kloter, B Wunderle, ... 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2008 | 354 | 2008 |
| Energy efficient hotspot-targeted embedded liquid cooling of electronics CS Sharma, MK Tiwari, S Zimmermann, T Brunschwiler, G Schlottig, ... Applied Energy 138, 414-422, 2015 | 217 | 2015 |
| Experimental investigation of an ultrathin manifold microchannel heat sink for liquid-cooled chips W Escher, T Brunschwiler, B Michel, D Poulikakos | 213 | 2010 |
| Interlayer cooling potential in vertically integrated packages T Brunschwiler, B Michel, H Rothuizen, U Kloter, B Wunderle, ... Microsystem Technologies 15, 57-74, 2009 | 213 | 2009 |
| Direct liquid jet-impingment cooling with micron-sized nozzle array and distributed return architecture T Brunschwiler, H Rothuizen, M Fabbri, U Kloter, B Michel, RJ Bezama, ... Thermal and Thermomechanical Proceedings 10th Intersociety Conference on …, 2006 | 188 | 2006 |
| On the cooling of electronics with nanofluids W Escher, T Brunschwiler, N Shalkevich, A Shalkevich, T Burgi, B Michel, ... | 151 | 2011 |
| 3D-ICE: A compact thermal model for early-stage design of liquid-cooled ICs A Sridhar, A Vincenzi, D Atienza, T Brunschwiler IEEE Transactions on Computers 63 (10), 2576-2589, 2013 | 142 | 2013 |
| Energy-efficient variable-flow liquid cooling in 3D stacked architectures AK Coskun, D Atienza, TS Rosing, T Brunschwiler, B Michel 2010 Design, Automation & Test in Europe Conference & Exhibition (DATE 2010 …, 2010 | 138 | 2010 |
| Double-face heat removal of vertically integrated chip-stacks utilizing combined symmetric silicon carrier fluid cavity and micro-channel cold plate PS Andry, TJ Brunschwiler, EG Colgan, JH Magerlein US Patent 7,990,711, 2011 | 135 | 2011 |
| Cloud computing D Bryan, M Anderson A weapon of mass destruction, 2010 | 131 | 2010 |
| A novel method of energy efficient hotspot-targeted embedded liquid cooling for electronics: An experimental study CS Sharma, G Schlottig, T Brunschwiler, MK Tiwari, B Michel, ... International Journal of Heat and Mass Transfer 88, 684-694, 2015 | 127 | 2015 |
| Toward zero-emission data centers through direct reuse of thermal energy T Brunschwiler, B Smith, E Ruetsche, B Michel IBM Journal of Research and Development 53 (3), 11: 1-11: 13, 2009 | 127 | 2009 |
| Hysteretic electroluminescence in organic light-emitting diodes for spin injection G Salis, SF Alvarado, M Tschudy, T Brunschwiler, R Allenspach Physical Review B—Condensed Matter and Materials Physics 70 (8), 085203, 2004 | 105 | 2004 |
| Toward five-dimensional scaling: How density improves efficiency in future computers P Ruch, T Brunschwiler, W Escher, S Paredes, B Michel IBM Journal of Research and Development 55 (5), 15: 1-15: 13, 2011 | 95 | 2011 |
| Microvortex-enhanced heat transfer in 3D-integrated liquid cooling of electronic chip stacks A Renfer, MK Tiwari, R Tiwari, F Alfieri, T Brunschwiler, B Michel, ... International Journal of Heat and Mass Transfer 65, 33-43, 2013 | 86 | 2013 |
| Energy-efficient multiobjective thermal control for liquid-cooled 3-D stacked architectures MM Sabry, AK Coskun, D Atienza, TŠ Rosing, T Brunschwiler IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2011 | 86 | 2011 |
| Compact transient thermal model for 3D ICs with liquid cooling via enhanced heat transfer cavity geometries A Sridhar, A Vincenzi, M Ruggiero, T Brunschwiler, D Atienza 2010 16th International workshop on thermal investigations of ICs and …, 2010 | 83 | 2010 |
| 3D integrated water cooling of a composite multilayer stack of chips F Alfieri, MK Tiwari, I Zinovik, D Poulikakos, T Brunschwiler, B Michel | 81 | 2010 |
| Nocturnal cough and snore detection in noisy environments using smartphone-microphones S Vhaduri, T Van Kessel, B Ko, D Wood, S Wang, T Brunschwiler 2019 IEEE international conference on healthcare informatics (ICHI), 1-7, 2019 | 70 | 2019 |
Arvind SridharSonova AGVerified email at sonova.com
