| On the efficacy of through-silicon-via inductors UR Tida, R Yang, C Zhuo, Y Shi IEEE Transactions on Very Large Scale Integration (VLSI) Systems 23 (7 …, 2014 | 70 | 2014 |
| Novel through-silicon-via inductor-based on-chip DC-DC converter designs in 3D ICs UR Tida, C Zhuo, Y Shi ACM Journal on Emerging Technologies in Computing Systems (JETC) 11 (2), 1-14, 2014 | 44 | 2014 |
| Through-silicon-via inductor: Is it real or just a fantasy? UR Tida, C Zhuo, Y Shi 2014 19th Asia and South Pacific Design Automation Conference (ASP-DAC), 837-842, 2014 | 35 | 2014 |
| Dynamic frequency scaling aware opportunistic through-silicon-via inductor utilization in resonant clocking UR Tida, C Zhuo, L Liu, Y Shi IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2018 | 18 | 2018 |
| Opportunistic through-silicon-via inductor utilization in LC resonant clocks: concept and algorithms UR Tida, V Mittapalli, C Zhuo, Y Shi 2014 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 750-757, 2014 | 18 | 2014 |
| Single-inductor–multiple-tier regulation: TSV-inductor-based on-chip buck converters for 3-D IC power delivery UR Tida, C Zhuo, Y Shi IEEE Transactions on Very Large Scale Integration (VLSI) Systems 27 (10 …, 2019 | 16 | 2019 |
| "Green" on-chip inductors in three-dimensional integrated circuits UR Tida Missouri University of Science and Technology, 2014 | 11 | 2014 |
| " Green" on-chip inductors in three-dimensional integrated circuits UR Tida, V Mittapalli, C Zhuo, Y Shi 2014 IEEE Computer Society Annual Symposium on VLSI, 571-576, 2014 | 11 | 2014 |
| Recent advances in dielectrophoresis toward biomarker detection: A summary of studies published between 2014 and 2021 L Velmanickam, V Jayasooriya, MS Vemuri, UR Tida, D Nawarathna Electrophoresis 43 (1-2), 212-231, 2022 | 9 | 2022 |
| Modeling and optimization of magnetic core tsv-inductor for on-chip dc-dc converter B Chen, U Tida, C Zhuo, Y Shi 2018 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 1-8, 2018 | 7 | 2018 |
| PWM-controlled DC-DC converter designs in 3D ICs using through-silicon-via inductors PN Kankonkar, UR Tida, C Zhou, Y Shi 2016 China Semiconductor Technology International Conference (CSTIC), 1-3, 2016 | 6 | 2016 |
| Design and optimization of magnetic-core solenoid inductor for multi-phase buck converter MS Vemuri, UR Tida 2020 IEEE 63rd International Midwest Symposium on Circuits and Systems …, 2020 | 5 | 2020 |
| Efficient metal inter-layer via utilization strategies for three-dimensional integrated circuits UR Tida, MS Vemuri 2020 IEEE 33rd International System-on-Chip Conference (SOCC), 195-200, 2020 | 4 | 2020 |
| Dual-Purpose Metal Inter-layer Via Utilization in Monolithic Three-Dimensional (M3D) Integration MS Vemuri, UR Tida 2020 IEEE 63rd International Midwest Symposium on Circuits and Systems …, 2020 | 4 | 2020 |
| Metal Inter-layer Via Keep-out-zone in M3D IC: A Critical Process-aware Design Consideration MS Vemuri, UR Tida 2023 24th International Symposium on Quality Electronic Design (ISQED), 1-8, 2023 | 2 | 2023 |
| An Improved Quadrature Voltage-Controlled Oscillator with Through-Silicon-Via Inductor in Three-dimensional Integrated Circuits D Li, MS Vemuri, UR Tida arXiv preprint arXiv:2001.10678, 2020 | 2 | 2020 |
| Design, Analysis and Optimization of Magnetic-core Solenoid Inductor for On-chip Multi-phase Buck Converter M Elma, MS Vemuri, UR Tida IEEE Access, 2023 | 1 | 2023 |
| Magnetic core TSV-inductor design and optimization for on-chip DC-DC converter C Wen, X Dong, B Chen, UR Tida, Y Shi, C Zhuo ACM Transactions on Design Automation of Electronic Systems (TODAES) 27 (5 …, 2022 | 1 | 2022 |
| Efficient and Scalable MIV-transistor with Extended Gate in Monolithic 3D Integration MS Vemuri, UR Tida arXiv preprint arXiv:2306.14033, 2023 | | 2023 |
| FDSOI Process Based MIV-transistor Utilization for Standard Cell Designs in Monolithic 3D Integration MS Vemuri, UR Tida arXiv preprint arXiv:2306.14032, 2023 | | 2023 |
Yiyu ShiUniversity of Notre DameVerified email at nd.edu
