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Co-authors
- Kang L. WangElectrical Engineering DepartmentVerified email at ee.ucla.edu
- Faxian XiuPhysics Department, Fudan UniversityVerified email at fudan.edu.cn
- Gang ChenProfessor, Mechanical Engineering, massachusetts institute of technologyVerified email at mit.edu
- Leelaprasanna Mandalapu JayaramuluSenior Staff Engineer - Product Development, Solaria CorporationVerified email at solaria.com
- Alexander A. BalandinDistinguished Professor of Materials Science and Engineering, UCLAVerified email at seas.ucla.edu
- Jingjian RenSanDisk, Corp., UC RiversideVerified email at ucr.edu
- Zheng ZuoUniversity of California, RiversideVerified email at ucr.edu
- Leonid ChernyakUCFVerified email at ucf.edu
- Alexander KhitunUniversity of California RiversideVerified email at engr.ucr.edu
- Hao TianUniversity of California, RiversideVerified email at ucr.edu
- Jian-Guo ZhengDirector of Facilities, Irvine Materials Research Institute, University of California IrvineVerified email at uci.edu
- Prof. Theodorian Borca-TasciucProfessor, Rensselaer Polytechnic InstituteVerified email at rpi.edu
- M. GoorskyUniversity of California, Los AngelesVerified email at seas.ucla.edu
- Alireza KhanakiIntel CorporationVerified email at intel.com
- Mildred S. DresselhausLate Professor, MITVerified email at mgm.mit.edu
- Renjing ZhengResearch assistant, UC RiversideVerified email at ucr.edu
- Zhongguang XuMicron, UC Riverside, institute of microelectronics, CASVerified email at ucr.edu
- Muhammad MorshedPhD, Electrical Engineering, U C RiversideVerified email at ucr.edu
- Wenhao ShiHuazhong University of Science and TechnologyVerified email at hust.edu.cn
- Sunayna Binte BasharPhD, EE, UC RIversideVerified email at intel.com
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Jianlin Liu
Professor of Electrical and Computer Engineering, University of California, Riverside
Verified email at ece.ucr.edu - Homepage