| Monolithic 3D neuromorphic computing system with hybrid CMOS and memristor-based synapses and neurons H An, MA Ehsan, Z Zhou, F Shen, Y Yi Integration 65, 273-281, 2019 | 39 | 2019 |
| An analytical through silicon via (TSV) surface roughness model applied to a millimeter wave 3-D IC MA Ehsan, Z Zhou, L Liu, Y Yi IEEE Transactions on Electromagnetic Compatibility 57 (4), 815-826, 2015 | 30 | 2015 |
| Electrical modeling and analysis of 3D synaptic array using vertical RRAM structure H An, MA Ehsan, Z Zhou, Y Yi 2017 18th International Symposium On Quality Electronic Design (ISQED), 1-6, 2017 | 21 | 2017 |
| Electrical modeling and analysis of 3D Neuromorphic IC with Monolithic Inter-tier Vias H An, MA Ehsan, Z Zhou, Y Yi 2016 IEEE 25th Conference on Electrical Performance of Electronic Packaging …, 2016 | 14 | 2016 |
| Neuromorphic 3D integrated circuit: A hybrid, reliable and energy efficient approach for next generation computing MA Ehsan, Z Zhou, Y Yi Proceedings of the on Great Lakes Symposium on VLSI 2017, 221-226, 2017 | 13 | 2017 |
| Design challenges and methodologies in 3D integration for neuromorphic computing systems MA Ehsan, H An, Z Zhou, Y Yi 2016 17th International Symposium on Quality Electronic Design (ISQED), 24-28, 2016 | 12 | 2016 |
| Electrical modeling and analysis of sidewall roughness of through silicon vias in 3D integration MA Ehsan, Z Zhou, Y Yi 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC), 52-56, 2014 | 12 | 2014 |
| A novel approach for using TSVs as membrane capacitance in neuromorphic 3-D IC MA Ehsan, H An, Z Zhou, Y Yi IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2017 | 11 | 2017 |
| Modeling and analysis of neuronal membrane electrical activities in 3d neuromorphic computing system MA Ehsan, Z Zhou, Y Yi 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal …, 2017 | 10 | 2017 |
| Adaptation of enhanced TSV capacitance as membrane property in 3D brain-inspired computing system MA Ehsan, H An, Z Zhou, Y Yi Proceedings of the 54th Annual Design Automation Conference 2017, 1-6, 2017 | 10 | 2017 |
| Analytical modeling and analysis of through silicon vias (TSVs) in high speed three-dimensional system integration MA Ehsan, Z Zhou, Y Yi Progress In Electromagnetics Research M 42, 49-59, 2015 | 10 | 2015 |
| Three dimensional integration technology applied to neuromorphic hardware implementation MA Ehsan, Z Zhou, Y Yi 2015 IEEE International Symposium on Nanoelectronic and Information Systems …, 2015 | 9 | 2015 |
| Hybrid three-dimensional integrated circuits: A viable solution for high efficiency neuromorphic computing MA Ehsan, Z Zhou, Y Yi 2017 International Symposium on VLSI Design, Automation and Test (VLSI-DAT), 1-2, 2017 | 7 | 2017 |
| Modeling and optimization of TSV for crosstalk mitigation in 3D neuromorphic system MA Ehsan, Z Zhou, Y Yi 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC …, 2016 | 7 | 2016 |
| Development of an equivalent circuit model of a finite ground coplanar waveguide interconnect in MIS system for ultra-broadband monolithic ICs MA Ehsan, Z Zhou, Y Yi Progress In Electromagnetics Research C 56, 1-13, 2015 | 3 | 2015 |
| Numerical Analysis of a-Si/c-Si1-x Ge x /c-Si Heterostructures Based on Si and Ge Thin-Film Solar Cells MA Ehsan, M Khizar, MYA Raja, D Mei Arabian Journal for Science and Engineering 39, 5347-5353, 2014 | 2 | 2014 |
| The Investigation of Optimal Si/Si1x Ge X Thin-film Solar Cells with Quantitative Analysis MA Ehsan University of South Dakota, 2013 | 1 | 2013 |
| A novel approach for modeling and simulation of a-Si/c-Si1−xGex/c-Si hetrostructure thin-film solar cells MK Khan, MA Ehsan, C Keller, D Mei 2012 38th IEEE Photovoltaic Specialists Conference, 001958-001962, 2012 | 1 | 2012 |
| Enabling Technologies for 3D ICs: TSV Modeling and Analysis A Ehsan University of Kansas, 2017 | | 2017 |
| Numerical Analysis of a-Si/c-SiGe/c-Si Heterostructures Based on Si and Ge Thin-Film Solar Cells. M Ehsan, M Khizar, M Raja, D Mei Arabian Journal for Science & Engineering (Springer Science & Business Media …, 2014 | | 2014 |
Yang (Cindy) YiVirginia TechAdresse e-mail validée de vt.edu
