| Selective soldering on printed circuit boards with endogenous induction heat at appropriate susceptors D Seehase, C Kohlen, A Neiser, A Novikov, M Nowottnick Periodica Polytechnica Electrical Engineering and Computer Science 62 (4 …, 2018 | 13 | 2018 |
| Placement of embedded temperature sensors in a printed circuit board for a manufacturing process A Neiser, D Seehase, A Fink, M Nowottnick 2015 38th International Spring Seminar on Electronics Technology (ISSE), 213-217, 2015 | 10 | 2015 |
| Endogenous Heating of Printed Circuit Boards by Means of Electromagnetic Induction on Suitable Susceptors D Seehase, C Kohlen, A Neiser, A Novikov, M Nowottnick 2018 41st International Spring Seminar on Electronics Technology (ISSE), 1-7, 2018 | 4 | 2018 |
| Self-Heating Printed Circuit Board-A Challenge to Contact and Control for a Reflow Soldering Process A Neiser, D Seehase, A Reinhardt 2018 41st International Spring Seminar on Electronics Technology (ISSE), 1-4, 2018 | 3 | 2018 |
| Thermal Characterization of Endogenously Heated Printed Circuit Boards with Embedded Resistive Layers D Seehase, A Neiser, F Lange, A Novikov, M Nowottnick 2018 7th Electronic System-Integration Technology Conference (ESTC), 1-9, 2018 | 2 | 2018 |
| Control a Joule-Heating Embedded Layer within a Printed Circuit Board A Neiser, D Seehase, P Koschorrek, A Reinhardt 2018 7th Electronic System-Integration Technology Conference (ESTC), 1-4, 2018 | 2 | 2018 |
| Observing of near field information to analyse a master-slave fieldbus A Neiser, KP Kirchner, H Beikirch 2015 IEEE 8th International Conference on Intelligent Data Acquisition and …, 2015 | 2 | 2015 |
| Thermoelectric generator for stand-alone electronic device operation in temperature test cabinets A Neiser, D Seehase, A Fink, K Lehnzen, H Beikirch Proceedings of the 2014 37th International Spring Seminar on Electronics …, 2014 | 2 | 2014 |
| Alternative Heating Methods for Printed Circuit Boards and a Practical Comparison of Direct Resistance and Inductive Heating Processes D Seehase, A Neiser, J Maxa, F Lange, A Novikov, M Nowottnick 2019 22nd European Microelectronics and Packaging Conference & Exhibition …, 2019 | 1 | 2019 |
| Improvement of Measurement Devices for Soldering Machines A Herkert, A Neiser, A Reinhardt 2021 44th International Spring Seminar on Electronics Technology (ISSE), 1-4, 2021 | | 2021 |
| The Challenge of a Self-Soldering PCB A Neiser, D Seehase, A Reinhardt 2019 22nd European Microelectronics and Packaging Conference & Exhibition …, 2019 | | 2019 |
| Wireless Sensor Nodes Optimized for Industrial Soldering Equipment A Neiser, M Abb, D Seehase, A Reinhardt 2019 42nd International Spring Seminar on Electronics Technology (ISSE), 1-4, 2019 | | 2019 |
| Comparison of different energy harvesting solutions for printed circuit board production 用于印制电路板生产的不同能量收集解决方案之比较 A Neiser, D Seehase, A Fink, T Gabloffsky, H Beikirch Comparison of different energy harvesting solutions for printed circuit …, 2015 | | 2015 |
| Non-destructive potential-free capacitive tap for low and mid voltage smart grid communication A Neiser, J Fuhrmann, A Fink, H Beikirch 2015 9th International Conference on Compatibility and Power Electronics …, 2015 | | 2015 |
| Reactive paste for reflow soldering of large components D Seehase, H Huth, A Neiser, M Nowottnick Proceedings of the 2014 37th International Spring Seminar on Electronics …, 2014 | | 2014 |
| Anwendungen mit integrierten Schichten für endogene Heizprozesse auf Leiterplatten D Seehase, A Neiser, F Lange, A Novikov, M Nowottnick | | |
| 19. Workshop Computer-Bildanalyse in der Landwirtschaft: 2. Workshop Unbemannte autonom fliegende Systeme (UAS) in der Landwirtschaft 6.-7. Mai 2013, Berlin SHVV Kontakt | | |
Andreas FinkResearch Associate, Rostock UniversityAdresse e-mail validée de uni-rostock.de
