3D-MAPS: 3D massively parallel processor with stacked memory SK Lim, SK Lim Design for High Performance, Low Power, and Reliable 3D Integrated Circuits …, 2013 | 216 | 2013 |
Design and analysis of 3D-MAPS: A many-core 3D processor with stacked memory MB Healy, K Athikulwongse, R Goel, MM Hossain, DH Kim, YJ Lee, ... IEEE Custom Integrated Circuits Conference 2010, 1-4, 2010 | 97 | 2010 |
Low-power and reliable clock network design for through-silicon via (TSV) based 3D ICs X Zhao, J Minz, SK Lim IEEE Transactions on Components, Packaging and Manufacturing Technology 1 (2 …, 2010 | 95 | 2010 |
Buffered clock tree synthesis for 3D ICs under thermal variations J Minz, X Zhao, SK Lim 2008 Asia and South Pacific Design Automation Conference, 504-509, 2008 | 93 | 2008 |
Pre-bond testable low-power clock tree design for 3D stacked ICs X Zhao, DL Lewis, HHS Lee, SK Lim Proceedings of the 2009 International Conference on Computer-Aided Design …, 2009 | 82 | 2009 |
Design and analysis of 3D-MAPS (3D massively parallel processor with stacked memory) DH Kim, K Athikulwongse, MB Healy, MM Hossain, M Jung, I Khorosh, ... IEEE Transactions on Computers 64 (1), 112-125, 2013 | 80 | 2013 |
Power and slew-aware clock network design for through-silicon-via (TSV) based 3D ICs X Zhao, SK Lim 2010 15th Asia and South Pacific Design Automation Conference (ASP-DAC), 175-180, 2010 | 47 | 2010 |
Low-power clock tree design for pre-bond testing of 3-D stacked ICs X Zhao, DL Lewis, HHS Lee, SK Lim IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2011 | 46 | 2011 |
Thermal-reliable 3D clock-tree synthesis considering nonlinear electrical-thermal-coupled TSV model Y Shang, C Zhang, H Yu, CS Tan, X Zhao, SK Lim 2013 18th Asia and South Pacific Design Automation Conference (ASP-DAC), 693-698, 2013 | 36 | 2013 |
Transient modeling of TSV-wire electromigration and lifetime analysis of power distribution network for 3D ICs X Zhao, Y Wan, M Scheuermann, SK Lim 2013 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 363-370, 2013 | 34 | 2013 |
Robust clock tree synthesis with timing yield optimization for 3D-ICs JS Yang, J Pak, X Zhao, SK Lim, DZ Pan 16th Asia and South Pacific Design Automation Conference (ASP-DAC 2011), 621-626, 2011 | 34 | 2011 |
Designing 3D test wrappers for pre-bond and post-bond test of 3D embedded cores DL Lewis, S Panth, X Zhao, SK Lim, HHS Lee 2011 IEEE 29th International Conference on Computer Design (ICCD), 90-95, 2011 | 23 | 2011 |
Designing 3D test wrappers for pre-bond and post-bond test of 3D embedded cores DL Lewis, S Panth, X Zhao, SK Lim, HHS Lee 2011 IEEE 29th International Conference on Computer Design (ICCD), 90-95, 2011 | 23 | 2011 |
Variation-aware clock network design methodology for ultralow voltage (ULV) circuits X Zhao, JR Tolbert, S Mukhopadhyay, SK Lim IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2012 | 22 | 2012 |
Analysis and design of energy and slew aware subthreshold clock systems JR Tolbert, X Zhao, SK Lim, S Mukhopadhyay IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2011 | 20 | 2011 |
Variation-tolerant and low-power clock network design for 3D ICs X Zhao, S Mukhopadhyay, SK Lim 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 2007-2014, 2011 | 19 | 2011 |
Analysis of DC current crowding in through-silicon-vias and its impact on power integrity in 3D ICs X Zhao, M Scheuermann, SK Lim Proceedings of the 49th Annual Design Automation Conference, 157-162, 2012 | 18 | 2012 |
Buffered clock tree sizing for skew minimization under power and thermal budgets K Athikulwongse, X Zhao, SK Lim 2010 15th Asia and South Pacific Design Automation Conference (ASP-DAC), 474-479, 2010 | 18 | 2010 |
Analysis and modeling of DC current crowding for TSV-based 3-D connections and power integrity X Zhao, MR Scheuermann, SK Lim IEEE Transactions on Components, Packaging and Manufacturing Technology 4 (1 …, 2013 | 15 | 2013 |
Through-silicon-via-induced obstacle-aware clock tree synthesis for 3D ICs X Zhao, SK Lim 17th Asia and South Pacific Design Automation Conference, 347-352, 2012 | 15 | 2012 |