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Coauteurs
- Douglas A. BristowMissouri University of Science and TechnologyAdresse e-mail validée de mst.edu
- Ed KinzelUniversity of Notre DameAdresse e-mail validée de nd.edu
- Frank LiouMissouri University of Science and TechnologyAdresse e-mail validée de mst.edu
- Patrick M. SammonsPostdoctoral Research Fellow, University of MichiganAdresse e-mail validée de umich.edu
- A. Galip UlsoyDistinguished University Prof. Emeritus of Mechanical Engineering, Univ. of Michigan, Ann ArborAdresse e-mail validée de umich.edu
- Greg HilmasMissouri University of Science and TechnologyAdresse e-mail validée de mst.edu
- Jonathan T GoldsteinAFRLAdresse e-mail validée de us.af.mil
- K. KrishnamurthyProfessor of Mechanical Engineering, Missouri University of Science and TechnologyAdresse e-mail validée de mst.edu
- Joseph NewkirkMissouri University of Science & TechnologyAdresse e-mail validée de mst.edu
- Augustine UrbasAir Force Research LabAdresse e-mail validée de afresearchlab.com
- Byung-Kwon MinYonsei UniversityAdresse e-mail validée de yonsei.ac.kr
- Yoram KorenDistinguished University Professor of ManufacturingAdresse e-mail validée de umich.edu
- Jeremy WattsAssistant research professor, Missouri University of Science and TechnologyAdresse e-mail validée de mst.edu
- Jason BloughProfessor of Mechanical Engineering, Michigan Technological UniversityAdresse e-mail validée de mtu.edu
- Mehdi FerdowsiProfessor of Electrical & Computer Engineering, Missouri University of Science and TechnologyAdresse e-mail validée de mst.edu
- Mingyang LiSenior Research Fellow, Singapore Centre for 3D Printing, Nanyang Technological UniversityAdresse e-mail validée de ntu.edu.sg
- Mallikharjuna BodduQualcomm Inc.