Nikhilesh Chawla
Title
Cited by
Cited by
Year
Mechanical behavior of particle reinforced metal matrix composites
N Chawla, YL Shen
Advanced engineering materials 3 (6), 357-370, 2001
6692001
Microstructure and mechanical behavior of porous sintered steels
N Chawla, X Deng
Materials Science and Engineering: A 390 (1-2), 98-112, 2005
3502005
Deformation behavior of (Cu, Ag)–Sn intermetallics by nanoindentation
X Deng, N Chawla, KK Chawla, M Koopman
Acta materialia 52 (14), 4291-4303, 2004
3192004
Tensile behavior of high performance natural (sisal) fibers
F de Andrade Silva, N Chawla, RD de Toledo Filho
Composites Science and Technology 68 (15-16), 3438-3443, 2008
3132008
Microstructure and deformation behavior of biocompatible TiO2 nanotubes on titanium substrate
GA Crawford, N Chawla, K Das, S Bose, A Bandyopadhyay
Acta Biomaterialia 3 (3), 359-367, 2007
2742007
Three-dimensional visualization and microstructure-based modeling of deformation in particle-reinforced composites
N Chawla, RS Sidhu, VV Ganesh
Acta materialia 54 (6), 1541-1548, 2006
2652006
Effect of SiC volume fraction and particle size on the fatigue resistance of a 2080 Al/SiC p composite
N Chawla, JW Jones, C Andres, JE Allison
Metallurgical and Materials Transactions A 29 (11), 2843-2854, 1998
2501998
Three-dimensional (3D) microstructure visualization and finite element modeling of the mechanical behavior of SiC particle reinforced aluminum composites
N Chawla, VV Ganesh, B Wunsch
Scripta materialia 51 (2), 161-165, 2004
2362004
Creep deformation behavior of Sn–3.5 Ag solder/Cu couple at small length scales
M Kerr, N Chawla
Acta materialia 52 (15), 4527-4535, 2004
2292004
Effects of cooling rate on the microstructure and tensile behavior of a Sn-3.5 wt.% Ag solder
F Ochoa, JJ Williams, N Chawla
Journal of Electronic Materials 32 (12), 1414-1420, 2003
2122003
Young’s modulus of (Cu, Ag)–Sn intermetallics measured by nanoindentation
X Deng, M Koopman, N Chawla, KK Chawla
Materials Science and Engineering: A 364 (1-2), 240-243, 2004
1772004
Influence of initial morphology and thickness of Cu6Sn5 and Cu3Sn intermetallics on growth and evolution during thermal aging of Sn-Ag solder/Cu joints
X Deng, G Piotrowski, JJ Williams, N Chawla
Journal of Electronic Materials 32 (12), 1403-1413, 2003
1672003
Effect of particle orientation anisotropy on the tensile behavior of metal matrix composites: experiments and microstructure-based simulation
VV Ganesh, N Chawla
Materials Science and Engineering: A 391 (1-2), 342-353, 2005
1622005
Influence of reflow and thermal aging on the shear strength and fracture behavior of Sn-3.5 Ag solder/Cu joints
X Deng, RS Sidhu, P Johnson, N Chawla
Metallurgical and Materials Transactions A 36 (1), 55-64, 2005
1602005
Microstructure-based modeling of the deformation behavior of particle reinforced metal matrix composites
N Chawla, KK Chawla
Journal of Materials Science 41 (3), 913-925, 2006
1512006
Microstructure-based modeling of crack growth in particle reinforced composites
A Ayyar, N Chawla
Composites Science and technology 66 (13), 1980-1994, 2006
1502006
Microstructure-based simulation of thermomechanical behavior of composite materials by object-oriented finite element analysis
N Chawla, BV Patel, M Koopman, KK Chawla, R Saha, BR Patterson, ...
Materials Characterization 49 (5), 395-407, 2002
1352002
Metal-matrix composites in ground transportation
N Chawla, KK Chawla
JoM 58 (11), 67-70, 2006
1342006
Effects of cooling rate on creep behavior of a Sn-3.5 Ag alloy
F Ochoa, X Deng, N Chawla
Journal of electronic materials 33 (12), 1596-1607, 2004
1232004
The effects of cooling rate on microstructure and mechanical behavior of Sn-3.5 Ag solder
F Ochoa, JJ Williams, N Chawla
JoM 55 (6), 56-60, 2003
1142003
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Articles 1–20