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YEKAN WANG
YEKAN WANG
Intel Corp
Adresse e-mail validée de g.ucla.edu
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Experimental observation of high intrinsic thermal conductivity of AlN
Z Cheng, YR Koh, A Mamun, J Shi, T Bai, K Huynh, L Yates, Z Liu, R Li, ...
Physical Review Materials 4 (4), 044602, 2020
1182020
Direct visualization of thermal conductivity suppression due to enhanced phonon scattering near individual grain boundaries
A Sood, R Cheaito, T Bai, H Kwon, Y Wang, C Li, L Yates, T Bougher, ...
Nano letters 18 (6), 3466-3472, 2018
962018
Thermal Transport across Ion-Cut Monocrystalline β-Ga2O3 Thin Films and Bonded β-Ga2O3–SiC Interfaces
Z Cheng, F Mu, T You, W Xu, J Shi, ME Liao, Y Wang, K Huynh, T Suga, ...
ACS Applied Materials & Interfaces 12 (40), 44943-44951, 2020
842020
Simultaneous determination of the lattice thermal conductivity and grain/grain thermal resistance in polycrystalline diamond
J Anaya, T Bai, Y Wang, C Li, M Goorsky, TL Bougher, L Yates, Z Cheng, ...
Acta Materialia 139, 215-225, 2017
802017
Probing photoelectrical transport in lead halide perovskites with van der Waals contacts
Y Wang, Z Wan, Q Qian, Y Liu, Z Kang, Z Fan, P Wang, Y Wang, C Li, ...
Nature Nanotechnology 15 (9), 768-775, 2020
732020
Thermal boundary conductance across heteroepitaxial ZnO/GaN interfaces: assessment of the phonon gas model
JT Gaskins, G Kotsonis, A Giri, S Ju, A Rohskopf, Y Wang, T Bai, E Sachet, ...
Nano letters 18 (12), 7469-7477, 2018
702018
Probing growth-induced anisotropic thermal transport in high-quality CVD diamond membranes by multifrequency and multiple-spot-size time-domain thermoreflectance
Z Cheng, T Bougher, T Bai, SY Wang, C Li, L Yates, BM Foley, M Goorsky, ...
ACS applied materials & interfaces 10 (5), 4808-4815, 2018
672018
Tunable thermal energy transport across diamond membranes and diamond–Si interfaces by nanoscale graphoepitaxy
Z Cheng, T Bai, J Shi, T Feng, Y Wang, M Mecklenburg, C Li, KD Hobart, ...
ACS applied materials & interfaces 11 (20), 18517-18527, 2019
602019
Thermal conductance across harmonic-matched epitaxial Al-sapphire heterointerfaces
Z Cheng, YR Koh, H Ahmad, R Hu, J Shi, ME Liao, Y Wang, T Bai, R Li, ...
Communications Physics 3 (1), 115, 2020
572020
Phonon scattering effects from point and extended defects on thermal conductivity studied via ion irradiation of crystals with self-impurities
EA Scott, K Hattar, CM Rost, JT Gaskins, M Fazli, C Ganski, C Li, T Bai, ...
Physical Review Materials 2 (9), 095001, 2018
392018
Orders of magnitude reduction in the thermal conductivity of polycrystalline diamond through carbon, nitrogen, and oxygen ion implantation
EA Scott, K Hattar, JL Braun, CM Rost, JT Gaskins, T Bai, Y Wang, ...
Carbon 157, 97-105, 2020
352020
Exfoliation of β-Ga2O3 along a non-cleavage plane using helium ion implantation
ME Liao, Y Wang, T Bai, MS Goorsky
ECS Journal of Solid State Science and Technology 8 (11), P673, 2019
212019
One-pot self-templated growth of gold nanoframes for enhanced surface-enhanced Raman scattering performance
P Ye, W Xin, IM De Rosa, Y Wang, MS Goorsky, L Zheng, X Yin, YH Xie
ACS applied materials & interfaces 12 (19), 22050-22057, 2020
202020
High thermal conductivity and thermal boundary conductance of homoepitaxially grown gallium nitride (GaN) thin films
YR Koh, MSB Hoque, H Ahmad, DH Olson, Z Liu, J Shi, Y Wang, K Huynh, ...
Physical Review Materials 5 (10), 104604, 2021
182021
Strain Recovery and Defect Characterization in Mg‐Implanted Homoepitaxial GaN on High‐Quality GaN Substrates
Y Wang, K Huynh, ME Liao, HM Yu, T Bai, J Tweedie, MH Breckenridge, ...
physica status solidi (b) 257 (4), 1900705, 2020
172020
Effects of ultra-low ethylene partial pressure on microstructure and composition of reactively sputter-deposited Ta–C thin films
K Tanaka, A Aleman, ME Liao, Y Wang, MS Goorsky, S Kodambaka
Thin Solid Films 688, 137440, 2019
142019
Diamond Seed Size and the Impact on Chemical Vapor Deposition Diamond Thin Film Properties
T Bai, Y Wang, TI Feygelson, MJ Tadjer, KD Hobart, NJ Hines, L Yates, ...
ECS Journal of Solid State Science and Technology 9 (5), 053002, 2020
122020
Direct wafer bonding of GaN for power devices applications
V Dragoi, N Razek, E Guiot, R Caulmilone, M Liao, YS Wang, MS Goorsky, ...
ECS Transactions 86 (5), 23, 2018
102018
Ultra-high vacuum dc magnetron sputter-deposition of 0001-textured trigonal α-Ta2C/Al2O3 (0001) thin films
K Tanaka, A Aleman, H Zaid, ME Liao, K Hojo, Y Wang, MS Goorsky, ...
Materialia 13, 100838, 2020
82020
Structural Characterization of Dot-Core GaN Substrates with Annealing Under Growth-Like Conditions Using Synchrotron Monochromatic X-ray Topography
Y Wang, ME Liao, K Huynh, AA Allerman, MS Goorsky
ECS Journal of Solid State Science and Technology 10 (4), 045010, 2021
72021
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