Thomas Siegmund
Thomas Siegmund
Professor of Mechanical Engineering
Adresse e-mail validée de purdue.edu - Page d'accueil
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An irreversible cohesive zone model for interface fatigue crack growth simulation
T Siegmund, K Roe
Engineering Fracture Mechanics 70 (2), 209-232, 2003
5082003
A numerical study on the correlation between the work of separation and the dissipation rate in ductile fracture
T Siegmund, W Brocks
Engineering Fracture Mechanics 67 (2), 139-154, 2000
1812000
An analysis of crack growth in thin-sheet metal via a cohesive zone model
W Li, T Siegmund
Engineering Fracture Mechanics 69 (18), 2073-2093, 2002
1362002
Prediction of the work of separation and implications to modeling
T Siegmund, W Brocks
International Journal of Fracture 99 (1-2), 97-116, 1999
1291999
Failure of mineralized collagen fibrils: modeling the role of collagen cross-linking
T Siegmund, MR Allen, DB Burr
Journal of biomechanics 41 (7), 1427-1435, 2008
1052008
A numerical study of dynamic crack growth in elastic-viscoplastic solids
T Siegmund, A Needleman
International Journal of Solids and Structures 34 (7), 769-787, 1997
1001997
Effects of a carbon nanotube layer on electrical contact resistance between copper substrates
M Park, BA Cola, T Siegmund, J Xu, MR Maschmann, TS Fisher, H Kim
Nanotechnology 17 (9), 2294, 2006
822006
A study of particle size effect and interface fracture in aluminum alloy composite via an extended conventional theory of mechanism-based strain-gradient plasticity
S Qu, T Siegmund, Y Huang, PD Wu, F Zhang, KC Hwang
Composites Science and Technology 65 (7-8), 1244-1253, 2005
812005
An analysis of the indentation test to determine the interface toughness in a weakly bonded thin film coating–substrate system
W Li, T Siegmund
Acta Materialia 52 (10), 2989-2999, 2004
792004
The low frequency performance of metamaterial barriers based on cellular structures
S Varanasi, JS Bolton, TH Siegmund, RJ Cipra
Applied Acoustics 74 (4), 485-495, 2013
772013
On the determination of the cohesive zone parameters for the modeling of micro-ductile crack growth in thick specimens*
CR Chen, O Kolednik, I Scheider, T Siegmund, A Tatschl, FD Fischer
International journal of fracture 120 (3), 517-536, 2003
772003
On the thermomechanical deformation behavior of duplex-type materials
T Siegmund, E Werner, FD Fischer
Journal of the Mechanics and Physics of Solids 43 (4), 495-532, 1995
771995
Dynamic crack growth across an interface
T Siegmund, NA Fleck, A Needleman
International Journal of Fracture 85 (4), 381-402, 1997
751997
A dislocation density based strain gradient model
S Brinckmann, T Siegmund, Y Huang
International journal of plasticity 22 (9), 1784-1797, 2006
692006
Influence of support properties on the sound radiated from the vibrations of rectangular plates
J Park, L Mongeau, T Siegmund
Journal of sound and vibration 264 (4), 775-794, 2003
662003
A constitutive model of the human vocal fold cover for fundamental frequency regulation
K Zhang, T Siegmund, RW Chan
The Journal of the Acoustical Society of America 119 (2), 1050-1062, 2006
652006
Optimization of thermal interface materials for electronics cooling applications
V Singhal, T Siegmund, SV Garimella
IEEE Transactions on Components and Packaging Technologies 27 (2), 244-252, 2004
582004
Optimization of thermal interface materials for electronics cooling applications
V Singhal, T Siegmund, SV Garimella
IEEE Transactions on Components and Packaging Technologies 27 (2), 244-252, 2004
582004
Rate-dependent crack growth in adhesives: I. Modeling approach
C Xu, T Siegmund, K Ramani
International journal of adhesion and adhesives 23 (1), 9-13, 2003
582003
Rate-dependent crack growth in adhesives II. Experiments and analysis
C Xu, T Siegmund, K Ramani
International journal of adhesion and adhesives 23 (1), 15-22, 2003
582003
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