| Reduction of voids in solder joints an alternative to vacuum soldering R Diehm, M Nowottnick, U Pape Proceedings of the IPC APEX EXPO, 2012 | 34 | 2012 |
| Comparison of WTi and WTi (N) as diffusion barriers for Al and Cu metallization on Si with respect to thermal stability and diffusion behavior of Ti M Fugger, M Plappert, C Schäffer, O Humbel, H Hutter, H Danninger, ... Microelectronics Reliability 54 (11), 2487-2493, 2014 | 32 | 2014 |
| Thermal peak management using organic phase change materials for latent heat storage in electronic applications J Maxa, A Novikov, M Nowottnick Materials 11 (1), 31, 2017 | 29 | 2017 |
| Interconnection of silicon heterojunction solar cells by infrared soldering-solder joint analysis and temperature study A De Rose, T Geipel, D Eberlein, A Kraft, M Nowottnick 2019 European Photovoltaic Solar Energy Conference and Exhibition, 229-234, 2019 | 25 | 2019 |
| Soldering material based on Sn Ag and Cu HJ Albrecht, KHG Bartl, W Kruppa, K Müller, M Nowottnick, G Petzold, ... US Patent 10,376,994, 2019 | 17 | 2019 |
| Selective soldering on printed circuit boards with endogenous induction heat at appropriate susceptors D Seehase, C Kohlen, A Neiser, A Novikov, M Nowottnick Periodica Polytechnica Electrical Engineering and Computer Science 62 (4 …, 2018 | 13 | 2018 |
| Reliability investigation of large area solder joints in power electronics modules and its simulative representation A George, J Zipprich, M Breitenbach, M Klingler, M Nowottnick Microelectronics Reliability 88, 762-767, 2018 | 13 | 2018 |
| Plasma treatment for fluxless soldering R Deltschew, D Hirsch, H Neumann, T Herzog, KJ Wolter, M Nowottnick, ... Surface and coatings technology 142, 803-807, 2001 | 13 | 2001 |
| Solidification and wetting behaviour of SnAgCu solder alloyed by reactive metal organic flux P Zerrer, A Fix, M Hutter, H Reichl Soldering & surface mount technology 22 (1), 19-25, 2010 | 11 | 2010 |
| Паяемость бессвинцовых припоев М Новоттник, А Новиков Технологии в электронной промышленности, 61-63, 2006 | 11 | 2006 |
| Solder joints for high temperature electronics M Nowottnick, U Pape, K Wittke, W Steel 2003 SMTA International Conference Proceedings, 21-25, 2003 | 11 | 2003 |
| Comparison of active and passive temperature cycling M Nowottnick, A Novikov, D Seehase, C Kronwald Proceedings of the SMTA International Conference 2016, 99-104, 2016 | 10 | 2016 |
| Placement of embedded temperature sensors in a printed circuit board for a manufacturing process A Neiser, D Seehase, A Fink, M Nowottnick 2015 38th International Spring Seminar on Electronics Technology (ISSE), 213-217, 2015 | 10 | 2015 |
| Resistance development on embedded heating layers during climatic test D Seehase, A Novikov, M Nowottnick 2017 21st European Microelectronics and Packaging Conference (EMPC …, 2017 | 9 | 2017 |
| Quantification of osseointegration of plasma-polymer coated titanium alloyed implants by means of microcomputed tomography versus histomorphometry RB Carolin Gabler, Carmen Zietz, Richard Bieck, Rebecca Göhler, Tobias ... Biomed. Res. Int., 2015 | 9 | 2015 |
| Characterization of Ti diffusion in PVD deposited WTi/AlCu metallization on monocrystalline Si by means of secondary ion mass spectroscopy M Plappert, O Humbel, A Koprowski, M Nowottnick Microelectronics Reliability 52 (9-10), 1993-1997, 2012 | 9 | 2012 |
| NanoFlux—doping of solder pastes P Zerrer, A Fix, M Hutter, U Pape 2008 2nd Electronics System-Integration Technology Conference, 923-928, 2008 | 9 | 2008 |
| Material study for full-faced heating layers, integrated in printed circuit boards D Seehase, F Lange, A Novikov, M Nowottnick 2017 40th International Spring Seminar on Electronics Technology (ISSE), 1-6, 2017 | 8 | 2017 |
| Soldering technology for 3D PCB assemblies with microwave heating M Nowottnick, R Diehm 2007 IEEE International Symposium on Industrial Electronics, 3273-3277, 2007 | 8 | 2007 |
| Solder joint analysis on coated aluminum for silicon solar cell interconnection A De Rose, A Kraft, U Eitner, M Nowottnick 2018 41st International Spring Seminar on Electronics Technology (ISSE), 1-6, 2018 | 7 | 2018 |
Dirk SeehaseResearcher, University of RostockAdresse e-mail validée de uni-rostock.de
