| Effect of Joule heating and current crowding on electromigration in mobile technology KN Tu, Y Liu, M Li Applied Physics Reviews 4 (1), 2017 | 137 | 2017 |
| Synergistic effect of electromigration and Joule heating on system level weak-link failure in 2.5 D integrated circuits Y Liu, M Li, DW Kim, S Gu, KN Tu Journal of Applied Physics 118 (13), 2015 | 53 | 2015 |
| Joule heating induced thermomigration failure in un-powered microbumps due to thermal crosstalk in 2.5 D IC technology M Li, DW Kim, S Gu, DY Parkinson, H Barnard, KN Tu Journal of Applied Physics 120 (7), 2016 | 24 | 2016 |
| Joule heating enhanced electromigration failure in redistribution layer in 2.5 D IC Y Liu, M Li, M Jiang, DW Kim, S Gu, KN Tu 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 1359-1363, 2016 | 16 | 2016 |
| Interconnect quality and reliability of 3D packaging Y Wang, Y Liu, M Li, KN Tu, L Xu 3D Microelectronic Packaging: From Fundamentals to Applications, 375-420, 2017 | 14 | 2017 |
| Band alignment between PEALD-AlNO and AlGaN/GaN determined by angle-resolved X-ray photoelectron spectroscopy Q Wang, X Cheng, L Zheng, P Ye, M Li, L Shen, J Li, D Zhang, Z Gu, Y Yu Applied Surface Science 423, 675-679, 2017 | 13 | 2017 |
| Enhanced interfacial and electrical characteristics of 4H-SiC MOS capacitor with lanthanum silicate passivation interlayer Q Wang, X Cheng, L Zheng, P Ye, M Li, L Shen, J Li, D Zhang, Z Gu, Y Yu Applied Surface Science 410, 326-331, 2017 | 11 | 2017 |
| Interfacial chemistry and energy band alignment of TiAlO on 4H-SiC determined by X-ray photoelectron spectroscopy Q Wang, X Cheng, L Zheng, P Ye, M Li, L Shen, J Li, D Zhang, Z Gu, Y Yu Applied Surface Science 409, 71-76, 2017 | 11 | 2017 |
| Optimized power delivery for 3D IC technology using grind side redistribution layers M Li, P Periasamy, KN Tu, SS Iyer 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2449-2454, 2016 | 6 | 2016 |
| Filler trap and solder extrusion in 3D IC thermo-compression bonded microbumps Y Liu, M Li, DW Kim, S Gu, DY Parkinson, J Blair, KN Tu 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 609-612, 2014 | 6 | 2014 |
| Interconnect Quality and Reliability of 3D Packaging Y Wang, Y Liu, M Li, KN Tu, L Xu 3D Microelectronic Packaging: From Architectures to Applications, 527-573, 2021 | 5 | 2021 |
| Electromigration induced thermomigration in microbumps by thermal cross-talk across neighboring chips in 2.5 D IC M Li, KN Tu, DW Kim, S Gu 2016 IEEE International Reliability Physics Symposium (IRPS), PA-3-1-PA-3-4, 2016 | 5 | 2016 |
| Electromigration Studies on 6 µm Solid Cu TSV (Via last) in 32 nm SOI Technology P Periasamy, M Iwatake, M Li, J Liu, T Graves-Abe, TT Quinn, SS Iyer 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 1364-1369, 2016 | 2 | 2016 |
| Joule heating induced interconnect failure in 3D IC technology M Li University of California, Los Angeles, 2016 | 1 | 2016 |
| Microelectronic Packaging Y Li, D Goyal | | |
