| Method for air gap interconnect integration using photo-patternable low k material LA Clevenger, M Darnon, Q Lin, AD Lisi, SV Nitta US Patent 8,241,992, 2012 | 357 | 2012 |
| Pulsed high-density plasmas for advanced dry etching processes S Banna, A Agarwal, G Cunge, M Darnon, E Pargon, O Joubert Journal of Vacuum Science & Technology A 30 (4), 2012 | 208 | 2012 |
| Mechanisms of porous dielectric film modification induced by reducing and oxidizing ash plasmas N Posseme, T Chevolleau, T David, M Darnon, O Louveau, O Joubert Journal of Vacuum Science & Technology B: Microelectronics and Nanometer …, 2007 | 105 | 2007 |
| Reducing damage to Si substrates during gate etching processes by synchronous plasma pulsing C Petit-Etienne, M Darnon, L Vallier, E Pargon, G Cunge, F Boulard, ... Journal of Vacuum Science & Technology B 28 (5), 926-934, 2010 | 78 | 2010 |
| Undulation of sub-100nm porous dielectric structures: A mechanical analysis M Darnon, T Chevolleau, O Joubert, S Maitrejean, JC Barbe, J Torres Applied Physics Letters 91 (19), 2007 | 61 | 2007 |
| Toward successful integration of porous low-k materials: Strategies addressing plasma damage K Lionti, W Volksen, T Magbitang, M Darnon, G Dubois ECS Journal of Solid State Science and Technology 4 (1), N3071, 2014 | 58 | 2014 |
| Etching characteristics of TiN used as hard mask in dielectric etch process M Darnon, T Chevolleau, D Eon, L Vallier, J Torres, O Joubert Journal of Vacuum Science & Technology B: Microelectronics and Nanometer …, 2006 | 49 | 2006 |
| Evolution of bulk c-Si properties during the processing of GaP/c-Si heterojunction cell R Varache, M Darnon, M Descazeaux, M Martin, T Baron, D Muñoz Energy Procedia 77, 493-499, 2015 | 47 | 2015 |
| Method of patterning of magnetic tunnel junctions O Joubert, B Schwarz, JGM Pereira, K Menguelti, EM Pargon, M Darnon US Patent 8,546,263, 2013 | 42 | 2013 |
| Patterning of narrow porous SiOCH trenches using a TiN hard mask M Darnon, T Chevolleau, D Eon, R Bouyssou, B Pelissier, L Vallier, ... Microelectronic engineering 85 (11), 2226-2235, 2008 | 41 | 2008 |
| Ion flux and ion distribution function measurements in synchronously pulsed inductively coupled plasmas M Brihoum, G Cunge, M Darnon, D Gahan, O Joubert, NSJ Braithwaite Journal of Vacuum Science & Technology A 31 (2), 2013 | 37 | 2013 |
| Impact of low-k structure and porosity on etch processes M Darnon, N Casiez, T Chevolleau, G Dubois, W Volksen, TJ Frot, ... Journal of Vacuum Science & Technology B 31 (1), 2013 | 33 | 2013 |
| Towards a controlled patterning of 10 nm silicon gates in high density plasmas E Pargon, M Darnon, O Joubert, T Chevolleau, L Vallier, L Mollard, T Lill Journal of Vacuum Science & Technology B: Microelectronics and Nanometer …, 2005 | 32 | 2005 |
| Methods for fabrication of an air gap-containing interconnect structure LA Clevenger, M Darnon, SV Nitta, AD Lisi, Q Lin US Patent 8,642,252, 2014 | 30 | 2014 |
| Roughening of porous SiCOH materials in fluorocarbon plasmas F Bailly, T David, T Chevolleau, M Darnon, N Posseme, R Bouyssou, ... Journal of Applied Physics 108 (1), 2010 | 30 | 2010 |
| Silicon recess minimization during gate patterning using synchronous plasma pulsing C Petit-Etienne, E Pargon, S David, M Darnon, L Vallier, O Joubert, ... Journal of Vacuum Science & Technology B 30 (4), 2012 | 29 | 2012 |
| Influence of plasma process on III-V/Ge multijunction solar cell via etching M De Lafontaine, E Pargon, C Petit-Etienne, G Gay, A Jaouad, MJ Gour, ... Solar Energy Materials and Solar Cells 195, 49-54, 2019 | 28 | 2019 |
| Time-resolved ion flux, electron temperature and plasma density measurements in a pulsed Ar plasma using a capacitively coupled planar probe M Darnon, G Cunge, NSJ Braithwaite Plasma Sources Science and Technology 23 (2), 025002, 2014 | 28 | 2014 |
| Atomic-scale silicon etching control using pulsed Cl2 plasma C Petit-Etienne, M Darnon, P Bodart, M Fouchier, G Cunge, E Pargon, ... Journal of Vacuum Science & Technology B 31 (1), 2013 | 26 | 2013 |
| Modifications of dielectric films induced by plasma ashing processes: Hybrid versus porous SiOCH materials M Darnon, T Chevolleau, T David, N Posseme, J Ducote, C Licitra, ... Journal of Vacuum Science & Technology B: Microelectronics and Nanometer …, 2008 | 25 | 2008 |
