| A study of through-silicon-via impact on the 3D stacked IC layout DH Kim, K Athikulwongse, SK Lim Proceedings of the 2009 International Conference on Computer-Aided Design …, 2009 | 341 | 2009 |
| 3D-MAPS: 3D Massively parallel processor with stacked memory DH Kim, K Athikulwongse, M Healy, M Hossain, M Jung, I Khorosh, ... IEEE International Solid-State Circuits Conference, 188-190, 2012 | 225 | 2012 |
| Architectural support for mitigating row hammering in DRAM memories DH Kim, PJ Nair, MK Qureshi IEEE Computer Architecture Letters 14 (1), 9-12, 2014 | 184 | 2014 |
| Fast and accurate analytical modeling of through-silicon-via capacitive coupling DH Kim, S Mukhopadhyay, SK Lim IEEE Transactions on Components, Packaging and Manufacturing Technology 1 (2 …, 2011 | 102 | 2011 |
| Design and analysis of 3D-MAPS: A many-core 3D processor with stacked memory MB Healy, K Athikulwongse, R Goel, MM Hossain, DH Kim, YJ Lee, ... IEEE Custom Integrated Circuits Conference 2010, 1-4, 2010 | 100 | 2010 |
| Through-silicon-via aware interconnect prediction and optimization for 3D stacked ICs DH Kim, S Mukhopadhyay, SK Lim Proceedings of the 11th international workshop on System level interconnect …, 2009 | 88 | 2009 |
| Design and analysis of 3D-MAPS (3D massively parallel processor with stacked memory) DH Kim, K Athikulwongse, MB Healy, MM Hossain, M Jung, I Khorosh, ... IEEE Transactions on Computers 64 (1), 112-125, 2013 | 82 | 2013 |
| Design method and test structure to characterize and repair TSV defect induced signal degradation in 3D system M Cho, C Liu, DH Kim, SK Lim, S Mukhopadhyay 2010 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 694-697, 2010 | 78 | 2010 |
| TSV-aware interconnect length and power prediction for 3D stacked ICs DH Kim, S Mukhopadhyay, SK Lim 2009 IEEE International Interconnect Technology Conference, 26-28, 2009 | 77 | 2009 |
| Pre-bond and post-bond test and signal recovery structure to characterize and repair TSV defect induced signal degradation in 3-D system M Cho, C Liu, DH Kim, SK Lim, S Mukhopadhyay IEEE Transactions on Components, Packaging and Manufacturing Technology 1 …, 2011 | 74 | 2011 |
| Through-silicon-via-aware delay and power prediction model for buffered interconnects in 3D ICs DH Kim, SK Lim Proceedings of the 12th ACM/IEEE international workshop on System level …, 2010 | 72 | 2010 |
| Optimizing 3D NoC design for energy efficiency: A machine learning approach S Das, JR Doppa, DH Kim, PP Pande, K Chakrabarty 2015 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 705-712, 2015 | 70 | 2015 |
| Block-level 3D IC design with through-silicon-via planning DH Kim, RO Topaloglu, SK Lim 17th Asia and South Pacific Design Automation Conference, 335-340, 2012 | 42 | 2012 |
| Physical experiments on the hydrodynamic response of submerged floating tunnel against the wave action 오상호， 박우선， 장세철， 김동현， 안희도 7th International Conference on Asian and Pacific Coasts, APAC 2013, 582-587, 2013 | 40 | 2013 |
| Analysis of TSV-to-TSV coupling with high-impedance termination in 3D ICs T Song, C Liu, DH Kim, SK Lim, J Cho, J Kim, JS Pak, S Ahn, J Kim, ... 2011 12th International Symposium on Quality Electronic Design, 1-7, 2011 | 38 | 2011 |
| TSV-aware interconnect distribution models for prediction of delay and power consumption of 3-D stacked ICs DH Kim, S Mukhopadhyay, SK Lim IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2014 | 37 | 2014 |
| A 7 Gb/s/pin 1 Gbit GDDR5 SDRAM with 2.5 ns bank to bank active time and no bank group restriction TY Oh, YS Sohn, SJ Bae, MS Park, JH Lim, YK Cho, DH Kim, DM Kim, ... IEEE journal of solid-state circuits 46 (1), 107-118, 2010 | 30 | 2010 |
| Impact of nano-scale through-silicon vias on the quality of today and future 3D IC designs DH Kim, S Kim, SK Lim International Workshop on System Level Interconnect Prediction, 1-8, 2011 | 29 | 2011 |
| Backend low-k TDDB chip reliability simulator M Bashir, DH Kim, K Athikulwongse, SK Lim, L Milor 2011 International Reliability Physics Symposium, 2C. 2.1-2C. 2.10, 2011 | 29 | 2011 |
| Design quality trade-off studies for 3-D ICs built with sub-micron TSVs and future devices DH Kim, SK Lim IEEE Journal on Emerging and Selected Topics in Circuits and Systems 2 (2 …, 2012 | 28 | 2012 |
