Thermal fracture of zirconia–mullite composite thermal barrier coatings under thermal shock: An experimental study A Gilbert, K Kokini, S Sankarasubramanian Surface and Coatings Technology 202 (10), 2152-2161, 2008 | 75 | 2008 |
Thermal fracture of zirconia–mullite composite thermal barrier coatings under thermal shock: A numerical study A Gilbert, K Kokini, S Sankarasubramanian Surface and Coatings Technology 203 (1-2), 91-98, 2008 | 57 | 2008 |
High-Temperature Interfacial Adhesion Strength Measurement in Electronic Packaging Using the Double Cantilever Beam Method S Sankarasubramanian, J Cruz, K Yazzie, V Sundar, V Subramanian, ... Journal Of Electronic Packaging 139 (2), 021003, 2017 | 8 | 2017 |
Electronic assembly components with corner adhesive for warpage reduction during thermal processing S Sankarasubramanian, H Xie, NR Raravikar, SA Klein, P Malatkar US Patent App. 15/084,032, 2017 | 6 | 2017 |
Constrained cure component attach process for improved IC package warpage control K Yazzie, VSR Guthikonda, P Nardi, S Sankarasubramanian, KY Lin, ... US Patent 10,290,569, 2019 | 3 | 2019 |
Removable ic package stiffener SA Klein, AS Vaidya, VK Subramanian, S Sankarasubramanian, ... US Patent App. 15/088,998, 2017 | 2 | 2017 |
Symmetric and Asymmetric Double Cantilever Beam Methods for Interfacial Adhesion Strength Measurement in Electronic Packaging T Alazar, S Sankarasubramanian, S Yagnamurthy, K Yazzie, P Liu, ... Experimental and Applied Mechanics, Volume 4: Proceedings of the 2015 Annual …, 2016 | 2 | 2016 |
Effect of porosity and mullite on the thermal fracture of plasma-sprayed ceramic thermal barrier coatings S Sankarasubramanian Purdue University, 2008 | | 2008 |