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Santosh Sankarasubramanian
Santosh Sankarasubramanian
Adresse e-mail validée de intel.com
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Thermal fracture of zirconia–mullite composite thermal barrier coatings under thermal shock: An experimental study
A Gilbert, K Kokini, S Sankarasubramanian
Surface and Coatings Technology 202 (10), 2152-2161, 2008
752008
Thermal fracture of zirconia–mullite composite thermal barrier coatings under thermal shock: A numerical study
A Gilbert, K Kokini, S Sankarasubramanian
Surface and Coatings Technology 203 (1-2), 91-98, 2008
572008
High-Temperature Interfacial Adhesion Strength Measurement in Electronic Packaging Using the Double Cantilever Beam Method
S Sankarasubramanian, J Cruz, K Yazzie, V Sundar, V Subramanian, ...
Journal Of Electronic Packaging 139 (2), 021003, 2017
82017
Electronic assembly components with corner adhesive for warpage reduction during thermal processing
S Sankarasubramanian, H Xie, NR Raravikar, SA Klein, P Malatkar
US Patent App. 15/084,032, 2017
62017
Constrained cure component attach process for improved IC package warpage control
K Yazzie, VSR Guthikonda, P Nardi, S Sankarasubramanian, KY Lin, ...
US Patent 10,290,569, 2019
32019
Removable ic package stiffener
SA Klein, AS Vaidya, VK Subramanian, S Sankarasubramanian, ...
US Patent App. 15/088,998, 2017
22017
Symmetric and Asymmetric Double Cantilever Beam Methods for Interfacial Adhesion Strength Measurement in Electronic Packaging
T Alazar, S Sankarasubramanian, S Yagnamurthy, K Yazzie, P Liu, ...
Experimental and Applied Mechanics, Volume 4: Proceedings of the 2015 Annual …, 2016
22016
Effect of porosity and mullite on the thermal fracture of plasma-sprayed ceramic thermal barrier coatings
S Sankarasubramanian
Purdue University, 2008
2008
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