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Matthew Lueck
Matthew Lueck
Adresse e-mail validée de rti.org
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Dual junction GaInP/GaAs solar cells grown on metamorphic SiGe/Si substrates with high open circuit voltage
MR Lueck, CL Andre, AJ Pitera, ML Lee, EA Fitzgerald, SA Ringel
IEEE Electron Device Letters 27 (3), 142-144, 2006
1792006
Fabrication and characterization of metal-to-metal interconnect structures for 3-D integration
A Huffman, J Lannon, M Lueck, C Gregory, D Temple
Journal of Instrumentation 4 (03), P03006, 2009
542009
Fabrication of TSV-based silicon interposers
D Malta, E Vick, S Goodwin, C Gregory, M Lueck, A Huffman, D Temple
2010 IEEE International 3D Systems Integration Conference (3DIC), 1-6, 2010
522010
Characterization of thermo-mechanical stress and reliability issues for Cu-filled TSVs
D Malta, C Gregory, M Lueck, D Temple, M Krause, F Altmann, M Petzold, ...
2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 1815-1821, 2011
412011
High density interconnect at 10µm pitch with mechanically keyed Cu/Sn-Cu and Cu-Cu bonding for 3-D integration
JD Reed, M Lueck, C Gregory, A Huffman, JM Lannon, D Temple
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010
412010
High density Cu-Cu interconnect bonding for 3-D integration
J Lannon, C Gregory, M Lueck, A Huffman, D Temple
2009 59th Electronic Components and Technology Conference, 355-359, 2009
352009
Effects of assembly process parameters on the structure and thermal stability of Sn-capped Cu bump bonds
A Huffman, M Lueck, C Bower, D Temple
2007 Proceedings 57th Electronic Components and Technology Conference, 1589-1596, 2007
352007
High-density large-area-array interconnects formed by low-temperature Cu/Sn–Cu bonding for three-dimensional integrated circuits
MR Lueck, JD Reed, CW Gregory, A Huffman, JM Lannon, DS Temple
IEEE transactions on electron devices 59 (7), 1941-1947, 2012
332012
Through glass vias (TGV) and aspects of reliability
M Lueck, A Huffman, A Shorey
2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 672-677, 2015
312015
Applying microfabrication to helical vacuum electron devices for THz applications
JA Dayton, CL Kory, GT Mearini, D Malta, M Lueck, K Gilchrist
2009 IEEE International Vacuum Electronics Conference, 41-44, 2009
312009
Microfabrication of diamond-based slow-wave circuits for mm-wave and THz vacuum electronic sources
MR Lueck, DM Malta, KH Gilchrist, CL Kory, GT Mearini, JA Dayton
Journal of Micromechanics and Microengineering 21 (6), 065022, 2011
292011
High-performance solenoidal RF transformers on high-resistivity silicon substrates for 3D integrated circuits
Z Feng, MR Lueck, DS Temple, MB Steer
IEEE Transactions on Microwave Theory and Techniques 60 (7), 2066-2072, 2012
282012
High density metal–metal interconnect bonding for 3-D integration
JM Lannon, C Gregory, M Lueck, JD Reed, CA Huffman, D Temple
IEEE Transactions on Components, Packaging and Manufacturing Technology 2 (1 …, 2011
262011
95 GHz helical TWT design
CL Kory, JA Dayton, GT Mearini, D Malta, M Lueck, K Gilchrist, B Vancil
2009 IEEE International Vacuum Electronics Conference, 125-126, 2009
262009
Microfabrication of fine-pitch high aspect ratio Faraday cup arrays in silicon
CA Bower, KH Gilchrist, MR Lueck, BR Stoner
Sensors and Actuators A: Physical 137 (2), 296-301, 2007
252007
Fabrication and testing of the 0.650 THz helical BWO
JA Dayton, CL Kory, GT Mearini, D Malta, M Lueck, B Vancil
IVEC 2012, 33-34, 2012
172012
Nanoimprint lithography fabrication of waveguide-integrated optical gratings with inexpensive stamps
S Grego, A Huffman, M Lueck, BR Stoner, J Lannon
Microelectronic engineering 87 (10), 1846-1851, 2010
172010
Bonding for 3-D integration of heterogeneous technologies and materials
D Temple, D Malta, JM Lannon, M Lueck, A Huffman, C Gregory, ...
ECS Transactions 16 (8), 3, 2008
172008
TSV-last, heterogeneous 3D integration of a SiGe BiCMOS beamformer and patch antenna for a W-band phased array radar
D Malta, E Vick, M Lueck, A Huffman, S Woodruff, P Ralston, J Hartman, ...
2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 1457-1464, 2016
132016
A stackable silicon interposer with integrated through-wafer inductors
J Carlson, M Lueck, CA Bower, D Temple, ZP Feng, MB Steer, AJ Moll, ...
2007 Proceedings 57th Electronic Components and Technology Conference, 1235-1238, 2007
132007
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