| Application of the PCB-embedding technology in power electronics–State of the art and proposed development C Buttay, C Martin, F Morel, R Caillaud, J Le Leslé, R Mrad, N Degrenne, ... 2018 Second International Symposium on 3D Power Electronics Integration and …, 2018 | 41 | 2018 |
| Comparison of planar and Toroidal PCB integrated inductors for a multi-cellular 3.3 kW PFC R Caillaud, C Buttay, R Mrad, J Le Lesle, F Morel, N Degrenne, S Mollov 2017 IEEE International Workshop On Integrated Power Packaging (IWIPP), 1-5, 2017 | 17 | 2017 |
| Design, manufacturing and characterization of printed circuit board embedded inductors for power applications R Caillaud, C Buttay, R Mrad, J Le Leslé, F Morel, N Degrenne, S Mollov, ... 2018 IEEE International Conference on Industrial Technology (ICIT), 694-699, 2018 | 13 | 2018 |
| Thermal considerations of a power converter with components embedded in printed circuit boards R Caillaud, C Buttay, R Mrad, J Le Lesle, F Morel, N Degrenne, SV Mollov IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2019 | 12 | 2019 |
| Multi-objective optimisation of a bidirectional single-phase grid connected AC/DC converter (PFC) with two different modulation principles J Le Leslé, R Caillaud, F Morel, N Degrenne, C Buttay, R Mrad, C Vollaire, ... 2017 IEEE Energy Conversion Congress and Exposition (ECCE), 5298-5305, 2017 | 12 | 2017 |
| Evaluation of the PCB-embedding technology for a 3.3 kW converter R Caillaud, J Le Lesle, C Buttay, F Morel, R Mrad, N Degrenne, S Mollov 2019 IEEE international workshop on integrated power packaging (IWIPP), 1-6, 2019 | 8 | 2019 |
| Optimum design of a single-phase Power Pulsating Buffer (PPB) with PCB-integrated inductor technologies J Le Leslé, R Caillaud, F Morel, N Degrenne, C Buttay, R Mrad, C Vollaire, ... 2018 IEEE International Conference on Industrial Technology (ICIT), 782-787, 2018 | 8 | 2018 |
| Optimisation of an integrated bidirectional interleaved single-phase power factor corrector J Le Lesle, R Caillaud, F Morel, N Degrenne, C Buttay, R Mrad, C Vollaire, ... PCIM Europe 2018; International Exhibition and Conference for Power …, 2018 | 7 | 2018 |
| High power PCB-embedded inductors based on ferrite powder R Caillaud, C Buttay, J Le Lesle, F Morel, R Mrad, N Degrenne, S Mollov, ... 5th Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing …, 2017 | 7 | 2017 |
| Short-circuit robustness of discrete SiC MOSFETs in half-bridge configuration N Degrenne, A Roy, J Le Lesle, E David, S Mollov PCIM Europe 2017; International Exhibition and Conference for Power …, 2017 | 7 | 2017 |
| A PCB based package with thermal resistance improvement R Perrin, J Le Leslé, J Morand, G Lefevre 2021 23rd European Conference on Power Electronics and Applications (EPE'21 …, 2021 | 4 | 2021 |
| Design and evaluation of a building block for a 100kw dc/dc converter based on pcb process J Morand, R Perrin, J Le Lesle, G Lefevre CIPS 2022; 12th International Conference on Integrated Power Electronics …, 2022 | 3 | 2022 |
| A fast short-circuit detection and protection method for wide band-gap devices based on current derivative sensing J Le Leslé, J Morand, R Perrin, G Lefevre 2021 23rd European Conference on Power Electronics and Applications (EPE'21 …, 2021 | 3 | 2021 |
| Design, manufacturing and evaluation of a highly integrated low-voltage high-current inverter J Le Lesle, V Quemener, J Morrand, R Perrin, R Mrad, S Mollov CIPS 2020; 11th International Conference on Integrated Power Electronics …, 2020 | 3 | 2020 |
| A gate driver for on-line heat-treatment to extend the lifetime of multichip power modules V Quemener, J Le Lesle, PY Pichon, JC Brandelero, N Degrenne CIPS 2022; 12th International Conference on Integrated Power Electronics …, 2022 | 2 | 2022 |
| Increasing the reliability of aluminum wirebonds by thermal treatments: Analysis and implementation PY Pichon, J Brandelero, J Le Leslé, M Ouhab, V Quemener IEEE Journal of Emerging and Selected Topics in Power Electronics 11 (3 …, 2023 | 1 | 2023 |
| Design modeling and evaluation of a bidirectional highly integrated AC/DC converter J Le Lesle Lyon, 2019 | 1 | 2019 |
| A 3D Folded Power Inductor with PCB based technology for applications in the kW range J Le Lesle, C Darbas, F Morel, N Degrenne, R Caillaud, C Buttay, ... 2019 IEEE Applied Power Electronics Conference and Exposition (APEC), 2815-2821, 2019 | 1 | 2019 |
| Design of a 3kW power converter using PCB-embedding technology R Caillaud, J Le Lesle, C Buttay, F Morel, R Mrad, N Degrenne, S Mollov From Nano to Micro Power Electronics And Packaging Workshop (IMAPS), 2018 | 1 | 2018 |
| Half bridge power converter, and switching method for half bridge power converter and power switch J Le Lesle, J Morand, S Mollov US Patent App. 17/918,840, 2023 | | 2023 |
Nicolas DegrenneMitsubishi Electric R&D Centre EuropeAdresse e-mail validée de fr.merce.mee.com
