| Novel Cu/SiCN surface topography control for 1 μm pitch hybrid wafer-to-wafer bonding SW Kim, F Fodor, N Heylen, S Iacovo, J De Vos, A Miller, G Beyer, ... 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 216-222, 2020 | 66 | 2020 |
| Reliable 50Gb/s silicon photonics platform for next-generation data center optical interconnects P Absil, K Croes, A Lesniewska, P De Heyn, Y Ban, B Snyder, J De Coster, ... 2017 IEEE International Electron Devices Meeting (IEDM), 34.2. 1-34.2. 4, 2017 | 50 | 2017 |
| Language geostrategy in eastern and central Europe: Assessment and perspectives F Fodor, S Peluau Languages in a globalising world, 85-98, 2003 | 40 | 2003 |
| Accès à l'énergie en Europe F Bafoil, F Fodor, D Le Roux HAL Post-Print, 2014 | 23 | 2014 |
| High density and high bandwidth chip-to-chip connections with 20μm pitch flip-chip on fan-out wafer level package D Velenis, A Phommahaxay, P Bex, F Fodor, EJ Marinissen, K Rebibis, ... 2018 International Wafer Level Packaging Conference (IWLPC), 1-5, 2018 | 16 | 2018 |
| Demonstration of a collective hybrid die-to-wafer integration S Suhard, A Phommahaxay, K Kennes, P Bex, F Fodor, M Liebens, ... 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 1315-1321, 2020 | 15 | 2020 |
| Demonstration of a collective hybrid die-to-wafer integration using glass carrier S Suhard, K Kennes, P Bex, A Jourdain, L Teugels, E Walsby, C Bolton, ... 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2064-2070, 2021 | 13 | 2021 |
| A fully automatic test system for characterizing large-array fine-pitch micro-bump probe cards EJ Marinissen, F Fodor, B De Wächter, J Kiesewetter, E Hill, K Smith 2017 International Test Conference in Asia (ITC-Asia), 144-149, 2017 | 12 | 2017 |
| L'énergie éolienne en Europe. Conflits, démocratie, acceptabilité sociale F Bafoil, A Bonnet, M Dąbrowski, M Dicko, F Fodor, R Guyet, F Lamari, ... HAL Post-Print, 2016 | 12 | 2016 |
| Climat d'angoisse: l'imaginaire du changement climatique F Fodor Les 2 Encres, 2011 | 11 | 2011 |
| Solutions to multiple probing challenges for test access to multi-die stacked integrated circuits EJ Marinissen, F Fodor, A Podpod, M Stucchi, YR Jian, CW Wu 2018 IEEE International Test Conference (ITC), 1-10, 2018 | 10 | 2018 |
| New Cu “Bulge-Out” Mechanism Supporting SubMicron Scaling of Hybrid Wafer-to-Wafer Bonding J De Messemaeker, L Witters, B Zhang, YW Tsau, F Fodor, J De Vos, ... 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 109-113, 2023 | 7 | 2023 |
| Multi-tier Binary Stacking, combining Face-to-Face and Back-to-Back Hybrid Wafer-to-Wafer Bonding Technology S Van Huylenbroeck, J De Vos, L Teugels, S Iacovo, F Fodor, A Miller, ... 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 1057-1062, 2021 | 5 | 2021 |
| Dynamique des imaginaires linguistiques dans la constitution des langues nationales européennes: le cas du français et du hongrois F Fodor Paris 5, 1999 | 5 | 1999 |
| „Le récit d'un «drame» possible: la mise en discours de la grippe aviaire dans la presse française” F Fodor Dire l’événement, ed. Sophie Moirand, Sandrine Reboul-Touré, Danielle Londei …, 2013 | 4 | 2013 |
| Les jeunes face au changement climatique dans l’imaginaire romanesque F Fodor Communication & langages, 83-95, 2012 | 4 | 2012 |
| Testing embedded toggle pattern generation through on-chip IR drop monitoring K Monta, L Kataselas, F Fodor, A Hatzopoulos, M Nagata, EJ Marinissen 2021 IEEE European Test Symposium (ETS), 1-4, 2021 | 3 | 2021 |
| Leading-edge wide-I/O2 memory probing challenges: TPEG (TM) MEMS solution F Fodor, EJ Marinissen, D Acconcia, R Vallauri | 3 | 2018 |
| L'imaginaire des langues chez Meillet ou la contamination de l'univers discursif scientifique par le politique et l'intime F Fodor Dossiers d'HEL, 10, 2014 | 3 | 2014 |
| L’imaginaire de l’épidémie F Fodor Les mots de la santé 3, 2011 | 3 | 2011 |
