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Coauteurs
- Juejun HuMITAdresse e-mail validée de mit.edu
- Carlos A. Ríos Ocampo (Carlos Ríos)University of Maryland, College Park | MSE & IREAPAdresse e-mail validée de umd.edu
- Mikhail Y. ShalaginovMIT & 2Pi OpticsAdresse e-mail validée de mit.edu
- Yifei Zhang (章逸飞)Hardware Engineer at Apple, PhD, Massachusetts Institute of TechnologyAdresse e-mail validée de mit.edu
- Vladimir LibermanMIT Lincoln LaboratoryAdresse e-mail validée de ll.mit.edu
- Jeffrey B. ChouSync Computing / MIT / UC BerkeleyAdresse e-mail validée de mit.edu
- Viktor A. PodolskiyUniversity of Massachusetts LowellAdresse e-mail validée de uml.edu
- Daniel WassermanProfessor of Electrical and Computer Engineering, University of Texas AustinAdresse e-mail validée de utexas.edu
- Steven A. VitaleSenior Technical Staff, MIT Lincoln LaboratoryAdresse e-mail validée de ll.mit.edu
- Stephanie LawAssociate Professor of Materials Science and Engineering, Penn State UniversityAdresse e-mail validée de psu.edu
- Jason AustermannNational Institute of Standards and TechnologyAdresse e-mail validée de nist.gov
- Min S. YunProfessor of Astronomy, University of Massachusetts, AmherstAdresse e-mail validée de astro.umass.edu
- Runyu LiuUniversity of Illinois at Urbana ChampaignAdresse e-mail validée de illinois.edu
- Lan YuProcess and Device integration engineer, AMATAdresse e-mail validée de amat.com
- Philip MauskopfProfessor, Arizona State UniversityAdresse e-mail validée de asu.edu
- SANDEEP INAMPUDIResearch Scientist at KLA TencorAdresse e-mail validée de kla-tencor.com
- Eric ShanerDistinguished Member of Technical Staff, Sandia National LaboratoriesAdresse e-mail validée de sandia.gov
- Anthony HoffmanUniversity of Notre DameAdresse e-mail validée de nd.edu
- Xiang ZhaoGraduate student, Department of Electrical and Computer Engineering, University of Illinois atAdresse e-mail validée de illinois.edu
- Xiuling LiUniversity of Texas at AustinAdresse e-mail validée de utexas.edu