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Sasanka Kanuparthi
Sasanka Kanuparthi
Product Development Engineer, Intel Corporation
Adresse e-mail validée de intel.com
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Année
An efficient network model for determining the effective thermal conductivity of particulate thermal interface materials
S Kanuparthi, G Subbarayan, T Siegmund, B Sammakia
IEEE Transactions on Components and Packaging Technologies 31 (3), 611-621, 2008
672008
Random network percolation models for particulate thermal interface materials
S Kanuparthi, X Zhang, G Subbarayan, BG Sammakia, T Siegmund, ...
Thermal and Thermomechanical Proceedings 10th Intersociety Conference on …, 2006
192006
Hierarchical field compositions for simulations of near-percolation thermal transport in particulate materials
S Kanuparthi, M Rayasam, G Subbarayan, B Sammakia, A Gowda, ...
Computer methods in applied mechanics and engineering 198 (5-8), 657-668, 2009
172009
The effect of polydispersivity on the thermal conductivity of particulate thermal interface materials
S Kanuparthi, G Subbarayan, T Siegmund, B Sammakia
IEEE Transactions on Components and Packaging Technologies 32 (2), 424-434, 2009
162009
An improved network model for determining the effective thermal conductivity of particulate thermal interface materials
B Dan, S Kanuparthi, G Subbarayan, BG Sammakia
International Electronic Packaging Technical Conference and Exhibition 43604 …, 2009
142009
Full-field simulations of particulate thermal interface materials: Separating the effects of random distribution from interfacial resistance
S Kanuparthi, X Zhang, G Subbarayan, B Sammakia, A Gowda, S Tonapi
Thermal and Thermomechanical Proceedings 10th Intersociety Conference on …, 2006
142006
Semiconductor device having reduced thermal interface material (TIM) degradation and method therefor
JE Galloway, SLN Kanuparthi
US Patent 7,906,845, 2011
132011
The study of the polydispersivity effect on the thermal conductivity of particulate thermal interface materials by finite element method
B Dan, BG Sammakia, G Subbarayan, S Kanuparthi, S Mallampati
IEEE Transactions on Components, Packaging and Manufacturing Technology 3 …, 2013
112013
Impact of heatsink attach loading on FCBGA package thermal performance
SL Kanuparthi, JE Galloway, S McCain
13th InterSociety Conference on Thermal and Thermomechanical Phenomena in …, 2012
112012
Thermal performance of FCMBGA: Exposed molded die compared to lidded package
J Galloway, S Kanuparthi, Q Wan
2011 27th Annual IEEE Semiconductor Thermal Measurement and Management …, 2011
92011
An improved efficient network model for determining the effective thermal conductivity of particulate thermal interface materials
B Dan, BG Sammakia, G Subbarayan, S Kanuparthi
Journal of Electronic Packaging 135 (3), 031003, 2013
72013
Heat spreader package
A Arcedera, SLN Kanuparthi
US Patent 8,441,120, 2013
62013
Hierarchical modeling and trade-off studies in design of thermal interface materials
X Zhang, S Kanuparthi, G Subbarayan, B Sammakia, S Tonapi
International Electronic Packaging Technical Conference and Exhibition 42002 …, 2005
62005
Heat spreader package and method
A Arcedera, SLN Kanuparthi
US Patent 7,999,371, 2011
52011
BLT control and its impact on FCBGA thermal performance
J Galloway, S Kanuparthi
2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2008
52008
Evaluation and Characterization of Molded flip-chip BGA Package for 28nm FPGA Applications
G Sure, M Lee, S Lau, M Jimarez, C Reichman, J Galloway, S Kanuparthi, ...
Published Conference proceedings from APEX Conference, 2013
22013
The study of the polydispersivity effect on the thermal conductivity of particulate Thermal Interface Materials to refine the Random Network Model
B Dan, BG Sammakia, S Kanuparthi, G Subbarayan, S Mallampati
13th InterSociety Conference on Thermal and Thermomechanical Phenomena in …, 2012
22012
Microstructural characteristics influencing the effective thermal conductivity of particulate thermal interface materials
S Kanuparthi, G Subbarayan, B Sammakia, T Siegmund
2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2008
22008
Simulations of near-percolation thermal transport in particulate composites
SLN Kanuparthi
Purdue University, 2007
2007
Hierarchical Synthesis of Particulate Thermal Interface Materials
S Kanuparthi, X Zhang, G Subbarayan, B Sammakia, A Gowda, S Tonapi
2006 11th International Symposium on Advanced Packaging Materials: Processes …, 2006
2006
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