| Stabilized finite element methods for solving the level set equation without reinitialization MK Touré, A Soulaïmani Computers & Mathematics with Applications 71 (8), 1602-1623, 2016 | 23 | 2016 |
| CFD-based iterative methodology for modeling natural convection in microelectronic packages MK Toure, PM Souare, S Allard, B Foisy, E Duchesne, J Sylvestre 2018 19th International Conference on Thermal, Mechanical and Multi-Physics …, 2018 | 9 | 2018 |
| Stabilised finite-element methods for solving the level set equation with mass conservation MK Touré, A Fahsi, A Soulaïmani International Journal of Computational Fluid Dynamics 30 (1), 38-55, 2016 | 9 | 2016 |
| Best practices for thermal modeling in microelectronics with natural convection cooling: Sensitivity analysis MK Touré, PM Souaré, J Sylvestre | 6 | 2021 |
| Modeling of flip-chip underfill delamination and cracking with five input manufacturing variables Y Yang, MK Toure, PM Souare, E Duchesne, J Sylvestre Microelectronics Reliability 132, 114533, 2022 | 4 | 2022 |
| Study of underfill corner cracks by the confocal-DIC and phantom-nodes methods Y Yang, MK Toure, PM Souare, E Duchesne, J Sylvestre Microelectronics Reliability 128, 114431, 2022 | 4 | 2022 |
| Cooling Heat Sinks by Natural and Forced Convection in Microelectronic Packages: Numerical Modeling and Experimental Thermal Studies PM Souare, MK Toure, B Foisy, E Duchesne, J Sylvestre 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020 | 3 | 2020 |
| High precision numerical and experimental thermal studies of microelectronic packages in still air chamber tests PM Souare, MK Toure, S Allard, B Foisy, B Borzou, E Duchesne, ... 2018 7th Electronic System-Integration Technology Conference (ESTC), 1-8, 2018 | 3 | 2018 |
| A level set method without re-initialization MK Touré, A Soulaïmani | 3 | 2012 |
| Accurate modeling of forced convection cooling for microelectronic packages: Numerical and experimental thermal studies MK Toure, PM Souare, B Foisy, E Duchesne, J Sylvestre 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2019 | 2 | 2019 |
| Bond At The End: A Comprehensive Study of a New High-Throughput Bonding Process SB Jemaa, P Gagnon, A Dione, MK Touré, JF Morissette, PM Souare, ... 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 194-200, 2020 | | 2020 |
| Stabilised level set methods for two-phase flow simulation MK Touré École de technologie supérieure, 2016 | | 2016 |
| Extended velocity-pressure for solving moving interface two-phase flows A Soulaimani, A Fahsi, MK Touré | | 2014 |
