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Liang Yuan Dai
Liang Yuan Dai
Verified email at columbia.edu
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Year
Design space exploration of microring resonators in silicon photonic interconnects: impact of the ring curvature
M Bahadori, M Nikdast, S Rumley, LY Dai, N Janosik, T Van Vaerenbergh, ...
Journal of lightwave technology 36 (13), 2767-2782, 2018
942018
Ultralow-crosstalk, strictly non-blocking microring-based optical switch
Q Cheng, LY Dai, NC Abrams, YH Hung, PE Morrissey, M Glick, P O’brien, ...
Photonics Research 7 (2), 155-161, 2019
762019
A silicon photonic switching platform for flexible converged centralized-radio access networking
C Browning, Q Cheng, NC Abrams, M Ruffini, LY Dai, LP Barry, ...
Journal of Lightwave Technology 38 (19), 5386-5392, 2020
332020
Wafer-scale high-density edge coupling for high throughput testing of silicon photonics
R Polster, LY Dai, OA Jimenez, Q Cheng, M Lipson, K Bergman
Optical Fiber Communication Conference, M3F. 2, 2018
182018
Si/SiN microring-based optical router in switch-and-select topology
Q Cheng, LY Dai, M Bahadori, NC Abrams, PE Morrissey, M Glick, ...
2018 European Conference on Optical Communication (ECOC), 1-3, 2018
132018
Silicon photonic switch-based optical equalization for mitigating pulsewidth distortion
YH Hung, Q Cheng, M Glick, M Badahori, LY Dai, K Bergman
Optics Express 27 (14), 19426-19435, 2019
102019
Experimental demonstration of PAM-4 transmission through microring silicon photonic Clos switch fabric
LY Dai, YH Hung, Q Cheng, K Bergman
Optical Fiber Communication Conference, M1H. 3, 2020
92020
Peta-scale embedded photonics architecture for distributed deep learning applications
Z Wu, LY Dai, A Novick, M Glick, Z Zhu, S Rumley, G Michelogiannakis, ...
Journal of Lightwave Technology, 2023
82023
Challenges and solutions for high-volume testing of silicon photonics
R Polster, LY Dai, M Oikonomou, Q Cheng, S Rumley, K Bergman
Silicon Photonics XIII 10537, 1053703, 2018
82018
Efficient intra-rack resource disaggregation for HPC using co-packaged DWDM photonics
G Michelogiannakis, Y Arafa, B Cook, LY Dai, AHH Badawy, M Glick, ...
2023 IEEE International Conference on Cluster Computing (CLUSTER), 158-172, 2023
72023
Streamlined architecture for thermal control and stabilization of cascaded DWDM micro-ring filters bus
M Hattink, LY Dai, Z Zhu, K Bergman
Optical Fiber Communication Conference, W2A. 2, 2022
52022
SiP architecture for accelerating collective communication in distributed deep learning
Z Wu, LY Dai, Z Zhu, A Novick, M Glick, K Bergman
2023 Optical Fiber Communications Conference and Exhibition (OFC), 1-3, 2023
42023
Ultra-low power consumption silicon photonic link design analysis in the AIM PDK
A Rizzo, LY Dai, X Meng, Y London, J Patel, M Glick, K Bergman
Optical Interconnects XIX 10924, 31-36, 2019
42019
Microring-based Si/SiN dual-layer switch fabric
Q Cheng, LY Dai, M Bahadori, P Morrissey, R Polster, S Rumley, ...
2018 IEEE Optical Interconnects Conference (OI), 29-30, 2018
42018
Ultra-scalable microring-based architecture for spatial-and-wavelength selective switching
LY Dai, V Gopal, K Bergman
2023 IEEE Silicon Photonics Conference (SiPhotonics), 1-2, 2023
22023
High-bandwidth density silicon photonic resonators for energy-efficient optical interconnects
A Novick, A James, LY Dai, Z Wu, A Rizzo, S Wang, Y Wang, M Hattink, ...
Applied Physics Reviews 10 (4), 2023
12023
Low Noise Ultra-Flexible SiP Switching Platform for mmWave OCDM & Multi-band OFDM ARoF Fronthaul
D Dass, LY Dai, K Bergman, X Ouyang, P Townsend, C Roeloffzen, ...
IEEE Photonics Technology Letters, 2023
12023
Silicon Photonic Deserialization for Energy Efficient Links
NC Abrams, R Polster, M Oikonomou, LY Dai, K Bergman
CLEO: Science and Innovations, JTu2A. 45, 2018
12018
Flexible silicon photonic architecture for accelerating distributed deep learning
Z Wu, LY Dai, Y Wang, S Wang, K Bergman
Journal of Optical Communications and Networking 16 (2), A157-A168, 2024
2024
Package Design and Measurements for Radar Emulator using Accelerators and Photonics
M Daniel-Aguebor, MU Rehman, S Erdogan, KSJ Moon, N Ambasana, ...
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1342-1348, 2022
2022
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