| Critical variables of solder paste stencil printing for micro-BGA and fine-pitch QFP J Pan, GL Tonkay, RH Storer, RM Sallade, DJ Leandri IEEE Transactions on Electronics Packaging Manufacturing 27 (2), 125-132, 2004 | 174 | 2004 |
| Screen printing process design of experiments for fine line printing of thick film ceramic substrates J Pan, GL Tonkay, A Quintero Journal of Electronics Manufacturing 9 (03), 203-213, 1999 | 78 | 1999 |
| The effect of reflow profile on SnPb and SnAgCu solder joint shear strength J Pan, BJ Toleno, TC Chou, WJ Dee Soldering & Surface Mount Technology 18 (4), 48-56, 2006 | 74 | 2006 |
| The effect of solder joint microstructure on the drop test failure—a peridynamic analysis J Mehrmashhadi, Y Tang, X Zhao, Z Xu, JJ Pan, Q Van Le, F Bobaru IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (1 …, 2018 | 46 | 2018 |
| Drop test reliability of lead-free chip scale packages A Farris, J Pan, A Liddicoat, BJ Toleno, D Maslyk, D Shangguan, J Bath, ... 2008 58th Electronic Components and Technology Conference, 1173-1180, 2008 | 37 | 2008 |
| Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints J Pan, TC Chou, J Bath, D Willie, BJ Toleno Soldering & Surface Mount Technology 21 (4), 32-37, 2009 | 36 | 2009 |
| Effect of chromium–gold and titanium–titanium nitride–platinum–gold metallization on wire/ribbon bondability J Pan, RM Pafchek, FF Judd, JB Baxter IEEE transactions on advanced packaging 29 (4), 707-713, 2006 | 35 | 2006 |
| Lead-free solder joint reliability–State of the art and perspectives J Pan, J Wang, DM Shaddock Journal of microelectronics and electronic packaging 2 (1), 72-83, 2005 | 32 | 2005 |
| Effect of gold content on the reliability of SnAgCu solder joints J Pan, J Silk, M Powers, P Hyland IEEE Transactions on Components, Packaging and Manufacturing Technology 1 …, 2011 | 31 | 2011 |
| Screen printing process design of experiments for fine line printing of thick film ceramic substrates J Pan, GL Tonkay, A Quintero 1998 Proceedings of the International Symposium on Microelectronics: San …, 1998 | 30 | 1998 |
| Wire bonding challenges in optoelectronics packaging J Pan, P Fraud Proceedings of the 1st SME Annual Manufacturing Technology Summit: Dearborn, MI, 2004 | 29 | 2004 |
| A study of solder joint failure criteria J Pan, J Silk International Symposium on Microelectronics 2011 (1), 000694-000702, 2011 | 28 | 2011 |
| Optimization of engineering tolerance design using revised loss functions JN Pan, J Pan Engineering Optimization 41 (2), 99-118, 2009 | 27 | 2009 |
| A control-chart-based method for solder joint crack detection J Pan Journal of Microelectronics and Electronic Packaging 11 (3), 94-103, 2014 | 25 | 2014 |
| Drop impact reliability of edge-bonded lead-free chip scale packages A Farris, J Pan, A Liddicoat, M Krist, N Vickers, BJ Toleno, D Maslyk, ... Microelectronics Reliability 49 (7), 761-770, 2009 | 24 | 2009 |
| Effect of gold content on the microstructural evolution of SAC305 solder joints under isothermal aging M Powers, J Pan, J Silk, P Hyland Journal of electronic materials 41, 224-231, 2012 | 19 | 2012 |
| A comparative study of various loss functions in the economic tolerance design JN Pan, J Pan 2006 IEEE International Conference on Management of Innovation and …, 2006 | 18 | 2006 |
| Investigation of the lead-free solder joint shear performance J Webster, J Pan, BJ Toleno Journal of microelectronics and electronic packaging 4 (2), 72-77, 2007 | 14 | 2007 |
| Finding and optimising the key factors for the multiple-response manufacturing process JN Pan, J Pan, CY Lee International journal of production research 47 (9), 2327-2344, 2009 | 13 | 2009 |
| Modeling and process optimization of solder paste stencil printing for micro-BGA and fine pitch surface mount assembly J Pan Lehigh University, 2000 | 12 | 2000 |
