Suivre
Guoqiang Wu
Guoqiang Wu
Adresse e-mail validée de whu.edu.cn
Titre
Citée par
Citée par
Année
MEMS resonators for frequency reference and timing applications
G Wu, J Xu, EJ Ng, W Chen
Journal of Microelectromechanical Systems 29 (5), 1137-1166, 2020
872020
Low-cost, tiny-sized MEMS hydrophone sensor for water pipeline leak detection
J Xu, KTC Chai, G Wu, B Han, ELC Wai, W Li, J Yeo, E Nijhof, Y Gu
IEEE Transactions on Industrial Electronics 66 (8), 6374-6382, 2018
782018
Wafer-level vacuum packaging for MEMS resonators using glass frit bonding
G Wu, D Xu, B Xiong, Y Wang, Y Wang, Y Ma
Journal of microelectromechanical systems 21 (6), 1484-1491, 2012
622012
GHz spurious mode free AlN lamb wave resonator with high figure of merit using one dimensional phononic crystal tethers
G Wu, Y Zhu, S Merugu, N Wang, C Sun, Y Gu
Applied Physics Letters 109 (1), 2016
482016
Phononic crystal strip based anchors for reducing anchor loss of micromechanical resonators
D Feng, D Xu, G Wu, B Xiong, Y Wang
Journal of Applied Physics 115 (2), 2014
432014
Isotropic Silicon Etching With Gas for Wafer-Level Micromachining Applications
D Xu, B Xiong, G Wu, Y Wang, X Sun, Y Wang
Journal of microelectromechanical systems 21 (6), 1436-1444, 2012
382012
Wafer-level vacuum-packaged high-performance AlN-on-SOI piezoelectric resonator for Sub-100-MHz oscillator applications
G Wu, J Xu, X Zhang, N Wang, D Yan, JLK Lim, Y Zhu, W Li, Y Gu
IEEE Transactions on Industrial Electronics 65 (4), 3576-3584, 2017
372017
A high-performance bulk mode single crystal silicon microresonator based on a cavity-SOI wafer
G Wu, D Xu, B Xiong, Y Wang
Journal of Micromechanics and Microengineering 22 (2), 025020, 2012
342012
A dual-mass fully decoupled MEMS gyroscope with wide bandwidth and high linearity
GQ Wu, GL Chua, YD Gu
Sensors and Actuators A: Physical 259, 50-56, 2017
302017
Resonant magnetic field sensor with capacitive driving and electromagnetic induction sensing
G Wu, D Xu, B Xiong, D Feng, Y Wang
IEEE electron device letters 34 (3), 459-461, 2013
302013
A wide measurement pressure range CMOS-MEMS based integrated thermopile vacuum gauge with an XeF2 dry-etching process
X Sun, D Xu, B Xiong, G Wu, Y Wang
Sensors and Actuators A: Physical 201, 428-433, 2013
292013
Design and characterization of an aluminum nitride-based MEMS hydrophone with biologically honeycomb architecture
L Jia, L Shi, C Liu, Y Yao, C Sun, G Wu
IEEE Transactions on Electron Devices 68 (9), 4656-4663, 2021
282021
A temperature-stable and low impedance piezoelectric MEMS resonator for drop-in replacement of quartz crystals
W Chen, W Jia, Y Xiao, Z Feng, G Wu
IEEE Electron Device Letters 42 (9), 1382-1385, 2021
232021
Development of six-degree-of-freedom inertial sensors with an 8-in advanced MEMS fabrication platform
G Wu, B Han, DD Cheam, LC Wai, PHK Chang, N Singh, Y Gu
IEEE Transactions on Industrial Electronics 66 (5), 3835-3842, 2018
232018
Considerations for an 8-inch wafer-level CMOS compatible AlN pyroelectric 5–14 μm wavelength IR detector towards miniature integrated photonics gas sensors
DKT Ng, G Wu, TT Zhang, L Xu, J Sun, WW Chung, H Cai, Q Zhang, ...
Journal of Microelectromechanical systems 29 (5), 1199-1207, 2020
222020
Uncooled thermoelectric infrared sensor with advanced micromachining
D Xu, B Xiong, G Wu, Y Ma, Y Wang
IEEE Sensors Journal 12 (6), 2014-2023, 2012
222012
A novel trapezoidal ScAlN/AlN-based MEMS piezoelectric accelerometer
B Hu, Y Liu, B Lin, G Wu, W Liu, C Sun
IEEE Sensors Journal 21 (19), 21277-21284, 2021
212021
Design and performance of scAlN/AlN trapezoidal cantilever-based MEMS piezoelectric energy harvesters
Y Liu, B Hu, Y Cai, J Zhou, W Liu, A Tovstopyat, G Wu, C Sun
IEEE Transactions on Electron Devices 68 (6), 2971-2976, 2021
202021
Extending of band gaps in silicon based one-dimensional phononic crystal strips
D Feng, D Xu, G Wu, B Xiong, Y Wang
Applied Physics Letters 103 (15), 2013
172013
Wafer-level vacuum packaging for microsystems using glass frit bonding
G Wu, D Xu, X Sun, B Xiong, Y Wang
IEEE Transactions on Components, Packaging and Manufacturing Technology 3 …, 2013
172013
Le système ne peut pas réaliser cette opération maintenant. Veuillez réessayer plus tard.
Articles 1–20