| A 16 Gb/s/link, 64 GB/s bidirectional asymmetric memory interface H Lee, KYK Chang, JH Chun, T Wu, Y Frans, B Leibowitz, N Nguyen, ... IEEE Journal of Solid-State Circuits 44 (4), 1235-1247, 2009 | 75 | 2009 |
| Direct TOF scanning LiDAR sensor with two-step multievent histogramming TDC and embedded interference filter H Seo, H Yoon, D Kim, J Kim, SJ Kim, JH Chun, J Choi IEEE Journal of Solid-State Circuits 56 (4), 1022-1035, 2021 | 52 | 2021 |
| A 16Gb/s/link, 64GB/s bidirectional asymmetric memory interface cell K Chang, H Lee, JH Chun, T Wu, TJ Chin, K Kaviani, J Shen, X Shi, ... 2008 IEEE symposium on VLSI circuits, 126-127, 2008 | 50 | 2008 |
| Efficient Scalable Modeling of Double-Equivalent Circuit for On-Chip Spiral Inductors YG Ahn, SK Kim, JH Chun, BS Kim IEEE transactions on microwave theory and techniques 57 (10), 2289-2300, 2009 | 46 | 2009 |
| RF ESD protection strategies: Codesign vs. low-C protection W Soldner, M Streibl, U Hodel, M Tiebout, H Gossner, ... Microelectronics Reliability 47 (7), 1008-1015, 2007 | 42 | 2007 |
| ESD protection circuits for advanced CMOS technologies JH Chun Stanford University, 2006 | 42 | 2006 |
| A low power CMOS compatible embedded EEPROM for passive RFID tag KS Lee, JH Chun, KW Kwon Microelectronics Journal 41 (10), 662-668, 2010 | 38 | 2010 |
| Indirect time-of-flight CMOS image sensor with on-chip background light cancelling and pseudo-four-tap/two-tap hybrid imaging for motion artifact suppression D Kim, S Lee, D Park, C Piao, J Park, Y Ahn, K Cho, J Shin, SM Song, ... IEEE Journal of Solid-State Circuits 55 (11), 2849-2865, 2020 | 34 | 2020 |
| Advanced modeling and accurate characterization of a 16 Gb/s memory interface WT Beyene, C Madden, JH Chun, H Lee, Y Frans, B Leibowitz, K Chang, ... IEEE transactions on advanced packaging 32 (2), 306-327, 2009 | 34 | 2009 |
| Design and characterization of ESD protection devices for high-speed I/O in advanced SOI technology S Cao, AA Salman, JH Chun, SG Beebe, MM Pelella, RW Dutton IEEE transactions on electron devices 57 (3), 644-653, 2010 | 33 | 2010 |
| A 4.8 Gb/s impedance-matched bidirectional multi-drop transceiver for high-capacity memory interface WY Shin, GM Hong, H Lee, JD Han, S Kim, KS Park, DH Lim, JH Chun, ... 2011 IEEE International Solid-State Circuits Conference, 494-496, 2011 | 32 | 2011 |
| A 1.08-nW/kHz 13.2-ppm/° C self-biased timer using temperature-insensitive resistive current J Jung, IH Kim, SJ Kim, Y Lee, JH Chun IEEE Journal of Solid-State Circuits 53 (8), 2311-2318, 2018 | 29 | 2018 |
| 7.2 A 48× 40 13.5 mm depth resolution flash LiDAR sensor with in-pixel zoom histogramming time-to-digital converter B Kim, S Park, JH Chun, J Choi, SJ Kim 2021 IEEE International Solid-State Circuits Conference (ISSCC) 64, 108-110, 2021 | 28 | 2021 |
| ESD design strategies for high-speed digital and RF circuits in deeply scaled silicon technologies S Cao, JH Chun, SG Beebe, RW Dutton IEEE Transactions on Circuits and Systems I: Regular Papers 57 (9), 2301-2311, 2010 | 28 | 2010 |
| A 0.75–3.0-Gb/s dual-mode temperature-tolerant referenceless CDR with a deadzone-compensated frequency detector J Jin, X Jin, J Jung, K Kwon, J Kim, JH Chun IEEE Journal of Solid-State Circuits 53 (10), 2994-3003, 2018 | 24 | 2018 |
| A power-efficient voltage upconverter for embedded EEPROM application JM Baek, JH Chun, KW Kwon IEEE Transactions on Circuits and Systems II: Express Briefs 57 (6), 435-439, 2010 | 24 | 2010 |
| A method for enhancing the sensing distance of a fingerprint sensor KH Song, J Choi, JH Chun Sensors 17 (10), 2280, 2017 | 23 | 2017 |
| A 5.2-Gb/s low-swing voltage-mode transmitter with an AC-/DC-coupled equalizer and a voltage offset generator S Kim, Y Jeong, M Lee, KW Kwon, JH Chun IEEE Transactions on Circuits and Systems I: Regular Papers 61 (1), 213-225, 2013 | 23 | 2013 |
| Mutual capacitive sensing touch screen controller for ultrathin display with extended signal passband using negative capacitance CJ Lee, JK Park, C Piao, HE Seo, J Choi, JH Chun Sensors 18 (11), 3637, 2018 | 22 | 2018 |
| Pulse amplitude modulation transmitter and pulse amplitude modulation receiver SH Kim, JH Chun, H Oh US Patent 10,312,896, 2019 | 21 | 2019 |
