An inductively powered implantable blood flow sensor microsystem for vascular grafts JH Cheong, SSY Ng, X Liu, RF Xue, HJ Lim, PB Khannur, KL Chan, ... IEEE Transactions on Biomedical Engineering 59 (9), 2466-2475, 2012 | 78 | 2012 |
Sensorized guidewires with MEMS tri-axial force sensor for minimally invasive surgical applications L Lou, K Ramakrishna, L Shao, WT Park, D Yu, L Lim, Y Wee, V Kripesh, ... 2010 Annual International Conference of the IEEE Engineering in Medicine and …, 2010 | 20 | 2010 |
Characterization of silicon nanowire embedded in a MEMS diaphragm structure within large compressive strain range L Lou, WT Park, S Zhang, LS Lim, DL Kwong, C Lee IEEE electron device letters 32 (12), 1764-1766, 2011 | 19 | 2011 |
Three chips stacking with low volume solder using single re-flow process N Khan, DHS Wee, OS Chiew, C Sharmani, LS Lim, HY Li, S Vasarala 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010 | 16 | 2010 |
Ultra-low-power wireless implantable blood flow sensing microsystem for vascular graft applications RF Xue, JH Cheong, HK Cha, X Liu, P Li, HJ Lim, LS Lim, MY Cheng, ... 2011 International Symposium on Integrated Circuits, 224-229, 2011 | 13 | 2011 |
Design, process integration and characterization of wafer level vacuum packaging for MEMS resonator A Yu, CS Premachandran, R Nagarajan, CW Kyoung, LQ Trang, R Kumar, ... 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010 | 13 | 2010 |
Characteristics of NEMS piezoresistive silicon nanowires pressure sensors with various diaphragm layers L Lou, S Zhang, L Lim, WT Park, H Feng, DL Kwong, C Lee Procedia Engineering 25, 1433-1436, 2011 | 10 | 2011 |
A wirelessly powered and interrogated blood flow monitoring microsystem fully integrated with a prosthetic vascular graft for early failure detection JH Cheong, CK Ho, SSY Ng, RF Xue, HK Cha, PB Khannur, X Liu, ... 2012 IEEE Asian Solid State Circuits Conference (A-SSCC), 177-180, 2012 | 9 | 2012 |
MEMS Tri-axial Tactile Sensor packaging using polymer fleible cable for sensorised guide wire application M Hamidullah, MY Cheng, LS Lim, C He, H Feng, WT Park 2011 IEEE 13th Electronics Packaging Technology Conference, 207-210, 2011 | 8 | 2011 |
Electrical interconnect design optimization for fully embedded board-level optical interconnects JYY Chai, GJ Yap, TG Lim, CW Tan, YM Khoo, CWL Teo, LS Lim, HL Yee, ... 2008 10th Electronics Packaging Technology Conference, 1126-1130, 2008 | 8 | 2008 |
Guide wire arrangement WT Park, M Hamidullah, MY Cheng, HE Cairan, LS Lim US Patent App. 13/864,220, 2013 | 7 | 2013 |
Design, fabrication and characterization of ultra miniature piezoresistive pressure sensors for medical implants LS Lim, WT Park, L Lou, HH Feng, P Singh Advanced Materials Research 254, 94-98, 2011 | 6 | 2011 |
Wireless sensor microsystems for emerging biomedical applications M Je, JH Cheong, CK Ho, SSY Ng, RF Xue, HK Cha, X Liu, WT Park, ... 2015 IEEE International Symposium on Radio-Frequency Integration Technology …, 2015 | 4 | 2015 |
Development of thin film dielectric embedded 3D stacked package SW Ho, N Su, LS Lim, SC Ong, WS Lee, VS Rao 2009 11th Electronics Packaging Technology Conference, 185-190, 2009 | 4 | 2009 |
Guide wire arrangement, strip arrangement and methods of forming the same D Yu, WT Park, LS Lim, M Hamidullah, RK Kotlanka, V Kripesh, H Feng US Patent App. 13/883,274, 2013 | 3 | 2013 |
Implantable blood flow sensor integrated on flexible circuit for vascular graft application LS Lim, JH Cheong, JLA Jerry, C He 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC), 695-699, 2012 | 3 | 2012 |
Batteryless MEMS flow sensor within prosthetic vascular graft C He, LS Lim, M Hamidullah, P Singh, WT Park, HH Feng 2011 Defense Science Research Conference and Expo (DSR), 1-4, 2011 | 3 | 2011 |
Direct eutectic AuSn solder bumping on Al bond pad surface using laser solder ball jetting MZ Ding, JL Aw, LS Lim, LC Wai, VS Rao 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), 224-229, 2013 | 2 | 2013 |
Low temperature bonding studies of Au-studs and AuSn-solder bumps on Au-surface using ultrasonic energy JL Aw, JB Lee, N Jaafar, MZ Ding, LS Lim, CS Choong, VS Rao 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), 384-388, 2013 | 1 | 2013 |
Characterization of a multi-layered MEMS pressure sensor using piezoresistive silicon nanowire within large measurable strain range L Lou, S Zhang, WT Park, L Lim, DL Kwong, C Lee 2012 7th IEEE International Conference on Nano/Micro Engineered and …, 2012 | 1 | 2012 |