| High-Density Multiple Bits-per-Cell 1T4R RRAM Array with Gradual SET/RESET and its Effectiveness for Deep Learning ER Hsieh, M Giordano, B Hodson, A Levy, SK Osekowsky, RM Radway, ... | 50 | 2019 |
| CHIMERA: A 0.92 TOPS, 2.2 TOPS/W edge AI accelerator with 2 MByte on-chip foundry resistive RAM for efficient training and inference M Giordano, K Prabhu, K Koul, RM Radway, A Gural, R Doshi, ZF Khan, ... 2021 symposium on VLSI circuits, 1-2, 2021 | 49 | 2021 |
| 14.3 A 43pJ/cycle non-volatile microcontroller with 4.7 μs shutdown/wake-up integrating 2.3-bit/cell resistive RAM and resilience techniques TF Wu, BQ Le, R Radway, A Bartolo, W Hwang, S Jeong, H Li, P Tandon, ... 2019 IEEE International Solid-State Circuits Conference-(ISSCC), 226-228, 2019 | 38* | 2019 |
| RADAR: A fast and energy-efficient programming technique for multiple bits-per-cell RRAM arrays BQ Le, A Levy, TF Wu, RM Radway, ER Hsieh, X Zheng, M Nelson, ... IEEE Transactions on Electron Devices 68 (9), 4397-4403, 2021 | 34 | 2021 |
| CHIMERA: A 0.92-TOPS, 2.2-TOPS/W edge AI accelerator with 2-MByte on-chip foundry resistive RAM for efficient training and inference K Prabhu, A Gural, ZF Khan, RM Radway, M Giordano, K Koul, R Doshi, ... IEEE Journal of Solid-State Circuits 57 (4), 1013-1026, 2022 | 29 | 2022 |
| Four-bits-per-memory one-transistor-and-eight-resistive-random-access-memory (1T8R) array ER Hsieh, X Zheng, BQ Le, YC Shih, RM Radway, M Nelson, S Mitra, ... IEEE Electron Device Letters 42 (3), 335-338, 2021 | 27 | 2021 |
| The future of hardware technologies for computing: N3XT 3D MOSAIC, illusion scaleup, co-design RM Radway, K Sethi, WC Chen, J Kwon, S Liu, TF Wu, E Beigne, ... 2021 IEEE International Electron Devices Meeting (IEDM), 25.4. 1-25.4. 4, 2021 | 15 | 2021 |
| Illusion of large on-chip memory by networked computing chips for neural network inference RM Radway, A Bartolo, PC Jolly, ZF Khan, BQ Le, P Tandon, TF Wu, ... Nature Electronics 4 (1), 71-80, 2021 | 15 | 2021 |
| Three-dimensional stacked neural network accelerator architectures for AR/VR applications L Yang, RM Radway, YH Chen, TF Wu, H Liu, E Ansari, V Chandra, ... IEEE Micro 42 (6), 116-124, 2022 | 10 | 2022 |
| Heterogeneous 3D nano-systems: The N3XT approach? D Rich, A Bartolo, C Gilardo, B Le, H Li, R Park, RM Radway, ... NANO-CHIPS 2030: On-Chip AI for an Efficient Data-Driven World, 127-151, 2020 | 5 | 2020 |
| Foundry Monolithic 3D BEOL Transistor+ Memory Stack: ISO-Performance and Iso-Footprint BEOL Carbon Nanotube FET+ RRAM vs. FEOL Silicon FET+ RRAM T Srimani, AC Yu, RM Radway, DT Rich, M Nelson, S Wong, D Murphy, ... 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and …, 2023 | 2 | 2023 |
| GaN DEVICES FABRICATED VIA WAFER BONDING RM Radway, TA Palacios US Patent App. 15/489,083, 2017 | 2 | 2017 |
| PBA: Percentile-Based Level Allocation for Multiple-Bits-Per-Cell RRAM A Wei, A Levy, P Yi, RM Radway, P Raina, S Mitra, S Achour 2023 IEEE/ACM International Conference on Computer Aided Design (ICCAD), 1-9, 2023 | 1 | 2023 |
| Thermal Scaffolding for Ultra-Dense 3D Integrated Circuits D Rich, A Kasperovich, M Malakoutian, RM Radway, S Hagiwara, ... 2023 60th ACM/IEEE Design Automation Conference (DAC), 1-6, 2023 | 1 | 2023 |
| Ultra-Dense 3D Physical Design Unlocks New Architectural Design Points with Large Benefits T Srimani, RM Radway, J Kim, K Prabhu, D Rich, C Gilardi, P Raina, ... 2023 Design, Automation & Test in Europe Conference & Exhibition (DATE), 1-6, 2023 | 1 | 2023 |
| Near junction thermal management of GaN HEMTs via wafer bonding RM Radway Massachusetts Institute of Technology, 2017 | 1 | 2017 |
| 8-bit Transformer Inference and Fine-tuning for Edge Accelerators J Yu, K Prabhu, Y Urman, RM Radway, E Han, P Raina Proceedings of the 29th ACM International Conference on Architectural …, 2024 | | 2024 |
| N3XT 3D Technology Foundations and Their Lab-to-Fab: Omni 3D Logic, Logic+ Memory Ultra-Dense 3D, 3D Thermal Scaffolding T Srimani, A Bechdolt, S Choi, C Gilardi, A Kasperovich, S Li, Q Lin, ... 2023 International Electron Devices Meeting (IEDM), 1-4, 2023 | | 2023 |
| Testbench on a Chip: A Yield Test Vehicle for Resistive Memory Devices LR Upton, G Lallement, MD Scott, J Taylor, RM Radway, D Rich, ... 2023 24th International Symposium on Quality Electronic Design (ISQED), 1-7, 2023 | | 2023 |
Subhasish MitraWilliam E. Ayer Professor, Stanford UniversityAdresse e-mail validée de stanford.edu
