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Donatien Martineau
Donatien Martineau
Safran Tech (Group Safran)
Adresse e-mail validée de safrangroup.com
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Characterization of alterations on power MOSFET devices under extreme electro-thermal fatigue
D Martineau, T Mazeaud, M Legros, P Dupuy, C Levade
Microelectronics Reliability 50 (9-11), 1768-1772, 2010
442010
Power modules die attach: A comprehensive evolution of the nanosilver sintering physical properties versus its porosity
T Youssef, W Rmili, E Woirgard, S Azzopardi, N Vivet, D Martineau, ...
Microelectronics Reliability 55 (9-10), 1997-2002, 2015
372015
Universal mechanisms of Al metallization ageing in power MOSFET devices
D Martineau, C Levade, M Legros, P Dupuy, T Mazeaud
Microelectronics Reliability 54 (11), 2432-2439, 2014
372014
Characterization of ageing failures on power MOSFET devices by electron and ion microscopies
D Martineau, T Mazeaud, M Legros, P Dupuy, C Levade, ...
Microelectronics Reliability 49 (9-11), 1330-1333, 2009
352009
2 MHz high-density integrated power supply for gate driver in high-temperature applications
R Perrin, B Allard, C Buttay, N Quentin, W Zhang, R Burgos, D Boroyevic, ...
2016 IEEE Applied Power Electronics Conference and Exposition (APEC), 524-528, 2016
242016
Power electronic assemblies: Thermo-mechanical degradations of gold-tin solder for attaching devices
F Arabi, L Theolier, D Martineau, JY Deletage, M Médina, E Woirgard
Microelectronics Reliability 64, 409-414, 2016
202016
Identification and analysis of power substrates degradations subjected to severe aging tests
E Woirgard, F Arabi, W Sabbah, D Martineau, L Theolier, S Azzopardi
Microelectronics Reliability 55 (9-10), 1961-1965, 2015
142015
Numerical and experimental results correlation during power MOSFET ageing
T Azoui, P Tounsi, P Dupuy, JM Dorkel, D Martineau
2012 13th International Thermal, Mechanical and Multi-Physics Simulation and …, 2012
142012
Impact of source metallization ageing on thermo-mechanical characteristics of a vertical power device
E Marcault, M Breil, A Bourennane, P Tounsi, D Martineau, P Dupuy
Proceedings of the 2011 14th European Conference on Power Electronics and …, 2011
72011
Thermo-mechanical assessment of silver sintering for attaching power components in embedded PCB
F Arabi, T Youssef, M Coudert, G Coquery, N Alayli, D Martineau, ...
Microelectronics Reliability 114, 113900, 2020
62020
Direct printing of heat sinks, cases and power connectors on insulated substrate using selective laser melting techniques
R Khazaka, D Martineau, T Youssef, TL Le, S Azzopardi
2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2173-2179, 2019
62019
Thermo-mechanical reliability assessment of AlN power substrates subjected to severe aging tests
F Arabi, L Theolier, D Martineau, JY Deletage, M Médina, E Woirgard
Materials Focus 6 (3), 352-358, 2017
62017
Caractérisation de l'endommagement de composants électroniques de puissance soumis à des tests de vieillissement accéléré
D Martineau
Toulouse, INSA, 2011
62011
Joining using reactive films for electronic applications: impact of applied pressure and assembled materials properties on the joint initial quality
R Khazaka, D Martineau, S Azzopardi
Journal of Electronic Materials 47, 7053-7061, 2018
52018
Design of a GaN HEMT based inverter leg power module for aeronautic applications
B Thollin, F Zaki, Z Khatir, R Meuret, D Martineau, C Fita, PO Jeannin, ...
2016 6th Electronic System-Integration Technology Conference (ESTC), 1-6, 2016
52016
Multi-physics modelling of thin films: optimization for finite elements simulations tools
T Youssef, E Woirgard, S Azzopardi, D Martineau, R Meuret
2015 16th International Conference on Thermal, Mechanical and Multi-Physics …, 2015
52015
Evaluation of direct printed heat sinks on metallized ceramic substrate for high-performance power modules
R Khazaka, E Martin, J Alexis, D Martineau, S Azzopardi
IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021
32021
Rapid and localized soldering using reactive films for electronic applications
R Khazaka, D Martineau, T Youssef, TL Le, S Azzopardi
Journal of Microelectronics and Electronic Packaging 16 (4), 182-187, 2019
22019
Direct heat sink printing on metallized ceramic substrate for power electronics applications: heat treatment identification and its impacts
E Martin, R Khazaka, D Martineau, S Azzopardi, J Alexis
CIPS 2020; 11th International Conference on Integrated Power Electronics …, 2020
12020
A multiphysics cosimulation for a wide band gap power module fatigue-related performance assessment
B Boulbene, D Martineau, E Woirgard, R Meuret, T Youssef, D Balland
NAFEMS Americas Conference, The International Association for the …, 2016
12016
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