Donatien Martineau
Donatien Martineau
Safran Tech (Group Safran)
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Cited by
Cited by
Characterization of alterations on power MOSFET devices under extreme electro-thermal fatigue
D Martineau, T Mazeaud, M Legros, P Dupuy, C Levade
Microelectronics Reliability 50 (9-11), 1768-1772, 2010
Characterization of ageing failures on power MOSFET devices by electron and ion microscopies
D Martineau, T Mazeaud, M Legros, P Dupuy, C Levade, ...
Microelectronics Reliability 49 (9-11), 1330-1333, 2009
Power modules die attach: A comprehensive evolution of the nanosilver sintering physical properties versus its porosity
T Youssef, W Rmili, E Woirgard, S Azzopardi, N Vivet, D Martineau, ...
Microelectronics Reliability 55 (9-10), 1997-2002, 2015
Universal mechanisms of Al metallization ageing in power MOSFET devices
D Martineau, C Levade, M Legros, P Dupuy, T Mazeaud
Microelectronics Reliability 54 (11), 2432-2439, 2014
2 MHz high-density integrated power supply for gate driver in high-temperature applications
R Perrin, B Allard, C Buttay, N Quentin, W Zhang, R Burgos, D Boroyevic, ...
2016 IEEE Applied Power Electronics Conference and Exposition (APEC), 524-528, 2016
Power electronic assemblies: Thermo-mechanical degradations of gold-tin solder for attaching devices
F Arabi, L Theolier, D Martineau, JY Deletage, M Médina, E Woirgard
Microelectronics Reliability 64, 409-414, 2016
Numerical and experimental results correlation during power MOSFET ageing
T Azoui, P Tounsi, P Dupuy, JM Dorkel, D Martineau
2012 13th International Thermal, Mechanical and Multi-Physics Simulation and …, 2012
Identification and analysis of power substrates degradations subjected to severe aging tests
E Woirgard, F Arabi, W Sabbah, D Martineau, L Theolier, S Azzopardi
Microelectronics Reliability 55 (9-10), 1961-1965, 2015
Caractérisation de l'endommagement de composants électroniques de puissance soumis à des tests de vieillissement accéléré
D Martineau
Toulouse, INSA, 2011
Impact of source metallization ageing on thermo-mechanical characteristics of a vertical power device
E Marcault, M Breil, A Bourennane, P Tounsi, D Martineau, P Dupuy
Proceedings of the 2011 14th European Conference on Power Electronics and …, 2011
Multi-physics modelling of thin films: optimization for finite elements simulations tools
T Youssef, E Woirgard, S Azzopardi, D Martineau, R Meuret
2015 16th International Conference on Thermal, Mechanical and Multi-Physics …, 2015
Direct Printing of Heat Sinks, Cases and Power Connectors on Insulated Substrate Using Selective Laser Melting Techniques
R Khazaka, D Martineau, T Youssef, TL Le, S Azzopardi
2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2173-2179, 2019
Joining using reactive films for electronic applications: impact of applied pressure and assembled materials properties on the joint initial quality
R Khazaka, D Martineau, S Azzopardi
Journal of Electronic Materials 47 (12), 7053-7061, 2018
Thermo-Mechanical Reliability Assessment of AlN Power Substrates Subjected to Severe Aging Tests
F Arabi, L Theolier, D Martineau, JY Deletage, M Médina, E Woirgard
Materials Focus 6 (3), 352-358, 2017
Design of a GaN HEMT based inverter leg power module for aeronautic applications
B Thollin, F Zaki, Z Khatir, R Meuret, D Martineau, C Fita, PO Jeannin, ...
2016 6th Electronic System-Integration Technology Conference (ESTC), 1-6, 2016
A muliphysics cosimulation for a wide band gap power module fatigue-related performance assessment
B Boulbene, T Youssef, D Martineau, D Balland, R Meuret, E Woirgard
Proceedings of 2016 NAFEMS Americas Conference, The International …, 2016
Thermo-mechanical assessment of silver sintering for attaching power components in embedded PCB
F Arabi, T Youssef, M Coudert, G Coquery, N Alayli, D Martineau, ...
Microelectronics Reliability, 113900, 2020
Power electronic module
T Youssef, SJ Azzopardi, R Khazaka, DHE Martineau
US Patent App. 16/766,059, 2020
Direct heat sink printing on metallized ceramic substrate for power electronics applications: heat treatment identification and its impacts
E Martin, R Khazaka, D Martineau, S Azzopardi, J Alexis
CIPS 2020; 11th International Conference on Integrated Power Electronics …, 2020
A method of fabricating an electronic power module by additive manufacturing, and associated substrate and module
R Khazaka, S Azzopardi, DHE Martineau
US Patent App. 16/478,326, 2019
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