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- Yong Chan JungIntelAdresse e-mail validée de intel.com
- Su Min HwangThe University of Texas at DallasAdresse e-mail validée de utdallas.edu
- Si Joon KimAssociate Professor, Kangwon National UniversityAdresse e-mail validée de kangwon.ac.kr
- Jiyoung KimProfessor of Materials Science and Engineering, University of Texas at DallasAdresse e-mail validée de utdallas.edu
- Harrison Sejoon KimIntel ATTDAdresse e-mail validée de intel.com
- Rino ChoiProfessor of Materials Science and Eng., Inha UniversityAdresse e-mail validée de inha.ac.kr
- Jin-Hyun KimThe University of Texas at DallasAdresse e-mail validée de utdallas.edu
- Jinho AhnProfessor of Materials Science and Engineering, Hanyang UniversityAdresse e-mail validée de hanyang.ac.kr
- Akshay SahotaFE Integration EngineerAdresse e-mail validée de intel.com
- Jaidah MohanProcess Development EngineerAdresse e-mail validée de micron.com
- Chang-Yong NamScientist, Center for Functional Nanomaterials, Brookhaven National LaboratoryAdresse e-mail validée de bnl.gov
- Nikhil TiwaleStaff Scientist, Center for Functional Nanomaterials, Brookhaven National LaboratoryAdresse e-mail validée de bnl.gov
- Jean francois VeyanUniversity of texas at dallasAdresse e-mail validée de utdallas.edu
- Ashwanth SubramanianProcess Engineer, Lam ResearchAdresse e-mail validée de lamresearch.com
- Minjong LeeThe University of Texas at DallasAdresse e-mail validée de utdallas.edu