Arvind Sridhar
Arvind Sridhar
Sonova AG
Verified email at sonova.com
Title
Cited by
Cited by
Year
3D-ICE: Fast compact transient thermal modeling for 3D ICs with inter-tier liquid cooling
A Sridhar, A Vincenzi, M Ruggiero, T Brunschwiler, D Atienza
2010 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 463-470, 2010
3382010
3D-ICE: A compact thermal model for early-stage design of liquid-cooled ICs
A Sridhar, A Vincenzi, D Atienza, T Brunschwiler
IEEE Transactions on Computers 63 (10), 2576-2589, 2013
1092013
Compact transient thermal model for 3D ICs with liquid cooling via enhanced heat transfer cavity geometries
A Sridhar, A Vincenzi, M Ruggiero, T Brunschwiler, D Atienza
2010 16th International workshop on thermal investigations of ICs and …, 2010
762010
Thermal modeling and analysis of 3D multi-processor chips
JL Ayala, A Sridhar, D Cuesta
Integration 43 (4), 327-341, 2010
532010
Through silicon via-based grid for thermal control in 3D chips
JL Ayala, A Sridhar, D Atienza, Y Leblebici
Design Technology for Heterogeneous Embedded Systems, 303-320, 2012
492012
Greencool: An energy-efficient liquid cooling design technique for 3-d mpsocs via channel width modulation
MM Sabry, A Sridhar, J Meng, AK Coskun, D Atienza
IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2013
452013
Neural network-based thermal simulation of integrated circuits on GPUs
A Sridhar, A Vincenzi, M Ruggiero, D Atienza
IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2011
402011
Fast thermal simulation of 2D/3D integrated circuits exploiting neural networks and GPUs
A Vincenzi, A Sridhar, M Ruggiero, D Atienza
IEEE/ACM International Symposium on Low Power Electronics and Design, 151-156, 2011
372011
Radial hierarchical microfluidic evaporative cooling for 3-d integrated microprocessors
CL Ong, S Paredes, A Sridhar, B Michel, T Brunschwiler
Proc. 4th European Conference on Microfluidics, Limerick, 2014
362014
Towards thermally-aware design of 3D MPSoCs with inter-tier cooling
MM Sabry, A Sridhar, D Atienza, Y Temiz, Y Leblebici, S Szczukiewicz, ...
2011 Design, Automation & Test in Europe, 1-6, 2011
352011
Parallel and scalable transient simulator for power grids via waveform relaxation (PTS-PWR)
R Achar, MS Nakhla, HS Dhindsa, AR Sridhar, D Paul, NM Nakhla
IEEE Transactions on Very Large Scale Integration (VLSI) Systems 19 (2), 319-332, 2009
302009
Thermal balancing of liquid-cooled 3D-MPSoCs using channel modulation
MM Sabry, A Sridhar, D Atienza
2012 Design, Automation & Test in Europe Conference & Exhibition (DATE), 599-604, 2012
242012
Benchmarking study on the thermal management landscape for three-dimensional integrated circuits: From back-side to volumetric heat removal
T Brunschwiler, A Sridhar, C Lee Ong, G Schlottig
Journal of Electronic Packaging 138 (1), 010911, 2016
202016
STEAM: A fast compact thermal model for two-phase cooling of integrated circuits
A Sridhar, Y Madhour, D Atienza, T Brunschwiler, J Thome
2013 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 256-263, 2013
192013
Evaluation and classification of physical and psychological stress in firefighters using heart rate variability
U Pluntke, S Gerke, A Sridhar, J Weiss, B Michel
2019 41st Annual International Conference of the IEEE Engineering in …, 2019
172019
Counter-flow expanding channels for enhanced two-phase heat removal
TJ Brunschwiler, TJ Chainer, EG Colgan, ARM Sridhar, CL Ong, ...
US Patent 9,941,189, 2018
162018
Modeling and multi-objective optimization of 2.5 D inductor-based Fully Integrated Voltage Regulators for microprocessor applications
PAM Bezerra, F Krismer, TM Andersen, JW Kolar, A Sridhar, ...
2015 IEEE 13th Brazilian Power Electronics Conference and 1st Southern Power …, 2015
162015
Integrated microfluidic power generation and cooling for bright silicon MPSoCs
MM Sabry, A Sridhar, D Atienza, P Ruch, B Michel
2014 Design, Automation & Test in Europe Conference & Exhibition (DATE), 1-6, 2014
162014
Thermal model for embedded two-phase liquid cooled microprocessor
PR Parida, A Sridhar, A Vega, MD Schultz, M Gaynes, O Ozsun, ...
2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2017
142017
Investigation of the effects of LIFT printing with a KrF-excimer laser on thermally sensitive electrically conductive adhesives
SM Perinchery, ECP Smits, A Sridhar, P Albert, J Van Den Brand, ...
Laser Physics 24 (6), 066101, 2014
142014
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