| Estimation of the size of the RVE for isotropic copper polycrystals by using elastic–plastic finite element homogenisation A Salahouelhadj, H Haddadi Computational Materials Science 48 (3), 447-455, 2010 | 48 | 2010 |
| Modeling of the cyclic behavior of elastic–viscoplastic composites by the additive tangent Mori–Tanaka approach and validation by finite element calculations C Czarnota, K Kowalczyk-Gajewska, A Salahouelhadj, M Martiny, ... International Journal of Solids and Structures 56, 96-117, 2015 | 44 | 2015 |
| Application of the continuum shell finite element SHB8PS to sheet forming simulation using an extended large strain anisotropic elastic–plastic formulation A Salahouelhadj, F Abed-Meraim, H Chalal, T Balan Archive of Applied Mechanics 82, 1269-1290, 2012 | 41 | 2012 |
| A novel fan-out concept for ultra-high chip-to-chip interconnect density with 20-µm pitch A Podpod, J Slabbekoorn, A Phommahaxay, F Duval, A Salahouelhadj, ... 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 370-378, 2018 | 37 | 2018 |
| Reliability of thermally stressed rigid–flex printed circuit boards for High Density Interconnect applications A Salahouelhadj, M Martiny, S Mercier, L Bodin, D Manteigas, B Stephan Microelectronics Reliability 54 (1), 204-213, 2014 | 34 | 2014 |
| Characterization and benchmarking of the low intertier thermal resistance of three-dimensional hybrid Cu/dielectric wafer-to-wafer bonding H Oprins, V Cherman, T Webers, A Salahouelhadj, SW Kim, L Peng, ... Journal of Electronic Packaging 139 (1), 011008, 2017 | 13 | 2017 |
| Effects of packaging on mechanical stress in 3D-ICs V Cherman, M Lofrano, V Simons, M Gonzalez, G Van der Plas, J De Vos, ... 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 354-361, 2015 | 13 | 2015 |
| Thermal characterization of the inter-die thermal resistance of hybrid Cu/dielectric wafer-to-wafer bonding H Oprins, V Cherman, T Webers, A Salahouelhadj, SW Kim, L Peng, ... 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016 | 11 | 2016 |
| Comparative study of 3D stacked IC and 3D interposer integration: Processing and assembly challenges J De Vos, V Cherman, M Detalle, T Wang, A Salahouelhadj, R Daily, ... 2014 International 3D Systems Integration Conference (3DIC), 1-7, 2014 | 10 | 2014 |
| Study of the influence of material properties and geometric parameters on warpage for Fan-Out Wafer Level Packaging A Salahouelhadj, M Gonzalez, A Podpod, K Rebibis, E Beyne 2018 7th Electronic System-Integration Technology Conference (ESTC), 1-6, 2018 | 9 | 2018 |
| CTE measurements for 3D package substrates using Digital Image Correlation A Salahouelhadj, M Gonzalez 2016 17th International Conference on Thermal, Mechanical and Multi-Physics …, 2016 | 8 | 2016 |
| Die thickness impact on thermo-mechanical stress in 3D packages A Salahouelhadj, M Gonzalez, H Oprins 2015 16th International Conference on Thermal, Mechanical and Multi-Physics …, 2015 | 8 | 2015 |
| Study of wafer warpage for Fan-Out wafer level packaging: finite element modelling and experimental validation A Salahouelhadj, M Gonzalez, K Vanstreels, A Podpod, A Phommahaxay, ... 2019 20th International Conference on Thermal, Mechanical and Multi-Physics …, 2019 | 6 | 2019 |
| vers une amélioration de la prévision des champs mécaniques locaux dans les polycristaux A Salahouelhadj, H Haddadi, M Gaspérini Congrès Français de la Mécanique 29, 2005 | 5 | 2005 |
| Analysis of warpage of a flip-chip BGA package under thermal loading: Finite element modelling and experimental validation A Salahouelhadj, M Gonzalez, K Vanstreels, G Van der Plas, G Beyer, ... Microelectronic Engineering 271, 111947, 2023 | 4 | 2023 |
| Simulation of Cu pad expansion in wafer-to-wafer Cu/SiCN hybrid bonding YW Tsau, J De Messemaeker, A Salahouelhadj, M Gonzalez, L Witters, ... Microelectronics Reliability 138, 114716, 2022 | 4 | 2022 |
| Investigating moisture diffusion in Mold Compounds (MCs) for Fan-Out-Wafer-Level-Packaging (FOWLP) A Salahouelhadj, M Gonzalez, A Podpod, E Beyne 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1704-1710, 2022 | 3 | 2022 |
| Homogenization of the Mechanical Behavior of Metallic Polycrystals by Finite Element Method A Salahouelhadj, H Haddadi, M Gaspérini International Conference on Advances in Mechanical Engineering and Mechanics …, 2006 | 3 | 2006 |
| Ultra-low warpage epoxy mold compound for fan-out wafer level package applications F Duval, A Podpod, A Salahouelhadj, A Phommahaxay, J Bertheau, ... | 2 | 2018 |
| Thermomechanical aspects of wafer-to-wafer copper-dielectric hybrid bonding for 3D integrated circuits OO Okudur, J De Messemaeker, A Salahouelhadj, M Gonzalez, ... | 2 | 2017 |
