| Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni CE Ho, RY Tsai, YL Lin, CR Kao Journal of Electronic Materials 31, 584-590, 2002 | 384 | 2002 |
| Interfacial reaction issues for lead-free electronic solders KN Subramanian, CE Ho, SC Yang, CR Kao Lead-Free Electronic Solders: A Special Issue of the Journal of Materials …, 2007 | 380 | 2007 |
| Effect of Cu concentration on the interfacial reactions between Ni and Sn–Cu solders WT Chen, CE Ho, CR Kao Journal of materials research 17 (2), 263-266, 2002 | 247 | 2002 |
| Effects of limited Cu supply on soldering reactions between SnAgCu and Ni CE Ho, YW Lin, SC Yang, CR Kao, DS Jiang Journal of electronic materials 35, 1017-1024, 2006 | 163 | 2006 |
| Formation and resettlement of (AuxNi1−x)Sn4 in solder joints of ball-grid-array packages with the Au/Ni surface finish CE Ho, R Zheng, GL Luo, AH Lin, CR Kao Journal of electronic materials 29, 1175-1181, 2000 | 158 | 2000 |
| Reactions between Sn–Ag–Cu lead‐free solders and the Au/Ni surface finish in advanced electronic packages LC Shiau, CE Ho, CR Kao Soldering & Surface Mount Technology 14 (3), 25-29, 2002 | 128 | 2002 |
| Solid-state reactions between Ni and Sn–Ag–Cu solders with different Cu concentrations WC Luo, CE Ho, JY Tsai, YL Lin, CR Kao Materials Science and Engineering: A 396 (1-2), 385-391, 2005 | 124 | 2005 |
| Reaction kinetics of solder-balls with pads in BGA packages during reflow soldering CE Ho, YM Chen, CR Kao Journal of Electronic Materials 28, 1231-1237, 1999 | 109 | 1999 |
| Strong Zn concentration effect on the soldering reactions between Sn-based solders and Cu SC Yang, CE Ho, CW Chang, CR Kao Journal of materials research 21 (10), 2436-2439, 2006 | 98 | 2006 |
| Comparative study between Sn37Pb and Sn3Ag0. 5Cu soldering with Au/Pd/Ni (P) tri-layer structure SP Peng, WH Wu, CE Ho, YM Huang Journal of Alloys and Compounds 493 (1-2), 431-437, 2010 | 92 | 2010 |
| Strong effect of Cu concentration on the reaction between lead-free microelectronic solders and Ni CE Ho, YL Lin, CR Kao Chemistry of materials 14 (3), 949-951, 2002 | 92 | 2002 |
| Interactions between solder and metallization during long-term aging of advanced microelectronic packages CE Ho, WT Chen, CR Kao Journal of Electronic Materials 30, 379-385, 2001 | 91 | 2001 |
| Influence of palladium thickness on the soldering reactions between Sn-3Ag-0.5 Cu and Au/Pd (P)/Ni (P) surface finish WH Wu, CS Lin, SH Huang, CE Ho Journal of electronic materials 39, 2387-2396, 2010 | 80 | 2010 |
| Selective interfacial reaction between Ni and eutectic BiSn lead-free solder WH Tao, C Chen, CE Ho, WT Chen, CR Kao Chemistry of materials 13 (3), 1051-1056, 2001 | 79 | 2001 |
| Inhibiting the formation of (Au1−xNix)Sn4 and reducing the consumption of Ni metallization in solder joints CE Ho, LC Shiau, CR Kao Journal of electronic materials 31, 1264-1269, 2002 | 78 | 2002 |
| Reflow soldering and isothermal solid-state aging of Sn-Ag eutectic solder on Au/Ni surface finish CM Liu, CE Ho, WT Chen, CR Kao Journal of electronic Materials 30, 1152-1156, 2001 | 77 | 2001 |
| Reaction of solder with Ni/Au metallization for electronic packages during reflow soldering CE Ho, SY Tsai, CR Kao IEEE transactions on advanced packaging 24 (4), 493-498, 2001 | 69 | 2001 |
| Long-term aging study on the solid-state reaction between 58Bi42Sn solder and Ni substrate C Chen, CE Ho, AH Lin, GL Luo, CR Kao Journal of electronic materials 29, 1200-1206, 2000 | 66 | 2000 |
| Inhibiting the growth of Cu3Sn and Kirkendall voids in the Cu/Sn-Ag-Cu system by minor Pd alloying CE Ho, TT Kuo, CC Wang, WH Wu Electronic Materials Letters 8, 495-501, 2012 | 62 | 2012 |
| Massive spalling of intermetallic compounds in solder-substrate reactions due to limited supply of the active element SC Yang, CE Ho, CW Chang, CR Kao Journal of Applied Physics 101 (8), 2007 | 51 | 2007 |
