| Characterization methods and modelling of ultracapacitors for use as peak power sources W Lajnef, JM Vinassa, O Briat, S Azzopardi, E Woirgard Journal of Power Sources 168 (2), 553-560, 2007 | 195 | 2007 |
| Bonding strength of multiple SiC die attachment prepared by sintering of Ag nanoparticles J Li, CM Johnson, C Buttay, W Sabbah, S Azzopardi Journal of Materials Processing Technology 215, 299-308, 2015 | 119 | 2015 |
| Principle, design and experimental validation of a flywheel-battery hybrid source for heavy-duty electric vehicles O Briat, JM Vinassa, W Lajnef, S Azzopardi, E Woirgard Iet electric power Applications 1 (5), 665-674, 2007 | 79 | 2007 |
| Strategy for designing accelerated aging tests to evaluate IGBT power modules lifetime in real operation mode JM Thebaud, E Woirgard, C Zardini, S Azzopardi, O Briat, JM Vinassa IEEE Transactions on components and packaging technologies 26 (2), 429-438, 2003 | 75 | 2003 |
| A preliminary study on the thermal and mechanical performances of sintered nano-scale silver die-attach technology depending on the substrate metallization F Le Henaff, S Azzopardi, JY Delétage, E Woirgard, S Bontemps, J Joguet Microelectronics reliability 52 (9-10), 2321-2325, 2012 | 70 | 2012 |
| Lifetime evaluation of nanoscale silver sintered power modules for automotive application based on experiments and finite-element modeling F Le Henaff, S Azzopardi, E Woirgard, T Youssef, S Bontemps, J Joguet IEEE Transactions on Device and Materials Reliability 15 (3), 326-334, 2015 | 47 | 2015 |
| Power modules die attach: A comprehensive evolution of the nanosilver sintering physical properties versus its porosity T Youssef, W Rmili, E Woirgard, S Azzopardi, N Vivet, D Martineau, ... Microelectronics Reliability 55 (9-10), 1997-2002, 2015 | 39 | 2015 |
| Study of die attach technologies for high temperature power electronics: Silver sintering and gold–germanium alloy W Sabbah, S Azzopardi, C Buttay, R Meuret, E Woirgard Microelectronics Reliability 53 (9-11), 1617-1621, 2013 | 39 | 2013 |
| Quantification of ageing of ultracapacitors during cycling tests with current profile characteristics of hybrid and electric vehicles applications W Lajnef, JM Vinassa, O Briat, H El Brouji, S Azzopardi, E Woirgard IET Electric Power Applications 1 (5), 683-689, 2007 | 33 | 2007 |
| Failure mechanisms of Trench IGBT under various short-circuit conditions A Benmansour, S Azzopardi, JC Martin, E Woirgard 2007 IEEE Power Electronics Specialists Conference, 1923-1929, 2007 | 32 | 2007 |
| Ultracapacitors modeling improvement using an experimental characterization based on step and frequency responses W Lajnef, JM Vinassa, S Azzopardi, O Briat, E Woirgard, C Zardini, ... 2004 IEEE 35th Annual Power Electronics Specialists Conference (IEEE Cat. No …, 2004 | 29 | 2004 |
| A systematic hard-and soft-switching performances evaluation of 1200 V punchthrough IGBT structures S Azzopardi, JM Vinassa, E Woirgard, C Zardini, O Briat IEEE Transactions on Power Electronics 19 (1), 231-241, 2004 | 29 | 2004 |
| Thermomechanical modelling and reliability study of an IGBT module for an aeronautical application A Zeanh, O Dalverny, M Karama, E Woirgard, S Azzopardi, A Bouzourene, ... EuroSimE 2008-International Conference on Thermal, Mechanical and Multi …, 2008 | 27 | 2008 |
| Switching performances comparison of 1200 V punch-through and nonpunch-through IGBTs under hard-switching at high temperature S Azzopardi, C Jamet, JM Vinassa, C Zardini PESC 98 Record. 29th Annual IEEE Power Electronics Specialists Conference …, 1998 | 26 | 1998 |
| Die attach using silver sintering. Practical implementation and analysis A Masson, W Sabbah, R Riva, C Buttay, S Azzopardi, H Morel, D Planson, ... European journal of electrical engineering 16 (3-4), 293-305, 2013 | 25 | 2013 |
| Study of ultracapacitors dynamic behaviour using impedance frequency analysis on a specific test bench W Lajnef, JM Vinassa, O Briat, S Azzopardi, C Zardini 2004 IEEE International Symposium on Industrial Electronics 2, 839-844, 2004 | 25 | 2004 |
| Failure mechanism of trench IGBT under short-circuit after turn-off A Benmansour, S Azzopardi, JC Martin, E Woirgard Microelectronics Reliability 46 (9-11), 1778-1783, 2006 | 24 | 2006 |
| An investigation into the reliability of power modules considering baseplate solders thermal fatigue in aeronautical applications A Micol, A Zeanh, T Lhommeau, S Azzopardi, E Woirgard, O Dalverny, ... Microelectronics Reliability 49 (9-11), 1370-1374, 2009 | 17 | 2009 |
| Evaluation of silver-sintering die attach W Sabbah, R Riva, S Hascoët, C Buttay, S Azzopardi, E Woirgard, ... 2012 7th International Conference on Integrated Power Electronics Systems …, 2012 | 16 | 2012 |
| Assessment of the Trench IGBT reliability: low temperature experimental characterization S Azzopardi, A Benmansour, M Ishiko, E Woirgard Microelectronics Reliability 45 (9-11), 1700-1705, 2005 | 15 | 2005 |
