| Physics-of-failure, condition monitoring, and prognostics of insulated gate bipolar transistor modules: A review H Oh, B Han, P McCluskey, C Han, BD Youn IEEE Transactions on power electronics 30 (5), 2413-2426, 2014 | 487 | 2014 |
| A review of phase change materials for vehicle component thermal buffering NR Jankowski, FP McCluskey Applied energy 113, 1525-1561, 2014 | 468 | 2014 |
| Integrated product and process design and development: the product realization process EB Magrab, SK Gupta, FP McCluskey, P Sandborn CRC Press, 2009 | 383 | 2009 |
| High temperature electronics FP McCluskey, T Podlesak, R Grzybowski CRC press, 2018 | 320 | 2018 |
| Electronic packaging materials and their properties M Pecht, R Agarwal, FP McCluskey, TJ Dishongh, S Javadpour, ... CRC press, 2017 | 277 | 2017 |
| Two-phase liquid cooling for thermal management of IGBT power electronic module P Wang, P McCluskey, A Bar-Cohen Journal of Electronic Packaging 135 (2), 021001, 2013 | 118 | 2013 |
| Reliability of high temperature solder alternatives FP McCluskey, M Dash, Z Wang, D Huff Microelectronics reliability 46 (9-11), 1910-1914, 2006 | 109 | 2006 |
| An interactive multistage ε-inequality constraint method for multiple objectives decision making N Palli, P McCluskey, S Azarm, R Sundararajan International Design Engineering Technical Conferences and Computers and …, 1998 | 86 | 1998 |
| Numerical investigation and sensitivity analysis of manifold microchannel coolers L Boteler, N Jankowski, P McCluskey, B Morgan International Journal of Heat and Mass Transfer 55 (25-26), 7698-7708, 2012 | 78 | 2012 |
| Temperature cycling reliability of high-temperature lead-free die-attach technologies PO Quintero, FP McCluskey IEEE Transactions on Device and Materials Reliability 11 (4), 531-539, 2011 | 77 | 2011 |
| Hybrid solid-and liquid-cooling solution for isothermalization of insulated gate bipolar transistor power electronic devices P Wang, P McCluskey, A Bar-Cohen IEEE transactions on components, packaging and manufacturing technology 3 (4 …, 2012 | 61 | 2012 |
| Constitutive relations of indium in extreme-temperature electronic packaging based on Anand model RW Chang, FP Mccluskey Journal of Electronic Materials 38, 1855-1859, 2009 | 59 | 2009 |
| Intermetallic growth on PWBs soldered with Sn3. 8Ag0. 7Cu Y Zheng, C Hillman, P McCluskey 52nd Electronic Components and Technology Conference 2002.(Cat. No …, 2002 | 56 | 2002 |
| Reliability of power electronics under thermal loading P McCluskey 2012 7th International Conference on Integrated Power Electronics Systems …, 2012 | 49 | 2012 |
| A comparison of the theory of moisture diffusion in plastic encapsulated microelectronics with moisture sensor chip and weight-gain measurements H Ardebili, C Hillman, MAE Natishan, P McCluskey, MG Pecht, ... IEEE Transactions on Components and Packaging Technologies 25 (1), 132-139, 2002 | 46 | 2002 |
| Popcorning in PBGA packages during IR reflow soldering P McCluskey, R Munamarty, M Pecht Microelectronics International 14 (1), 20-23, 1997 | 46 | 1997 |
| Uprating electronic components for use outside their temperature specification limits MB Wright, D Humphrey, FP McCluskey IEEE Transactions on Components, Packaging, and Manufacturing Technology …, 1997 | 44 | 1997 |
| Reliable use of commercial technology in high temperature environments P McCluskey, K Mensah, C O'Connor, A Gallo Microelectronics Reliability 40 (8-10), 1671-1678, 2000 | 43 | 2000 |
| Transient liquid phase sintered attach for power electronics H Greve, LY Chen, I Fox, FP McCluskey 2013 IEEE 63rd Electronic Components and Technology Conference, 435-440, 2013 | 41 | 2013 |
| Reliability assessment of indium solder for low temperature electronic packaging RW Chang, FP McCluskey Cryogenics 49 (11), 630-634, 2009 | 40 | 2009 |
