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Co-authors
- Yang LuDept of Mechanical Engineering, the University of Hong KongVerified email at hku.hk
- Xiaocui LICity University of Hong KongVerified email at my.cityu.edu.hk
- Xiaobin FengWuhan University of TechnologyVerified email at whut.edu.cn
- Ke CaoXidian University, Xi’an, ChinaVerified email at xidian.edu.cn
- Libo GaoXiamen University, Xiamen, ChinaVerified email at xmu.edu.cn
- Chaoqun Dang (党超群)Zhejiang UniversityVerified email at zju.edu.cn
- Hongti ZhangSchool of Physical Science and Technology, ShanghaiTech UniversityVerified email at shanghaitech.edu.cn
- Rong FanCity University of Hong KongVerified email at cityu.edu.hk
- Weitong LinCity University of Hong KongVerified email at my.cityu.edu.hk
- Yuejiao WangCity University of HongkongVerified email at my.cityu.edu.hk
- Fanling MengSouthern University of Science and TechnologyVerified email at mail.sustech.edu.cn
- James Utama SurjadiPostdoctoral Associate, Massachusetts Institute of TechnologyVerified email at mit.edu
- Ying HANPennsylvania State UniversityVerified email at psu.edu
- Temitope Olumide OLUGBADEUniversity of DundeeVerified email at dundee.ac.uk
- Qi Ge (葛锜)Southern University of Science and Technology (SUSTech)Verified email at sustech.edu.cn
- Yang HaoKun (杨浩坤)Hong Kong Productivity CouncilVerified email at hkpc.org
- Johnny C. HoAssociate Head and Professor, Materials Science and Engin., City University of Hong KongVerified email at cityu.edu.hk
- You MENG (孟优)Ctiy University of Hong Kong, Postdoc FellowVerified email at my.cityu.edu.hk
- Yong Yang (楊勇)Professor, Department of Mechanical Engineering, City University of Hong KongVerified email at cityu.edu.hk
- Yajing Shen (申亚京)The Hong Kong University of Science and TechnologyVerified email at ust.hk