|An Efficient Thermal Model for Multifinger SiGe HBTs Under Real Operating Condition|
K Nidhin, S Pande, S Yadav, S Balanethiram, DR Nair, S Fregonese, ...
IEEE Transactions on Electron Devices 67 (11), 5069-5075, 2020
|A SPICE compact model for forming-free, low-power graphene-insulator-graphene ReRAM technology|
LH Reddy, SR Pande, T Roy, EM Vogel, A Chakravorty, B Chakrabarti
Emergent Materials, 1-11, 2021
|Analytical Modeling of Junction Temperature and Thermal Resistance in LED Structure|
S Pande, K Nidhin, KP Navaneeth, S Balanethiram, A Chakravorty
XXth International Workshop on Physics of Semiconductor Devices: IWPSD 2019, 2019
|Development of low-cost silicon BiCMOS technology for RF applications|
S Balanethiram, S Pande, AK Singh, B Umapathi, HS Jatana, ...
2019 IEEE Conference on Modeling of Systems Circuits and Devices (MOS-AK …, 2019